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The purpose of this paper is to address a research gap relating to the understanding of how one type of manufacturing flexibility – mix flexibility – is achieved during day‐to‐day operations.

Constructs from coordination theory are used in order to understand the way in which physical manufacturing resources are coordinated during daily operations to produce a company's product mix. A multiple case study methodology is used to investigate the applicability of these constructs in the flour milling industry. Subsequently, a conceptual framework is proposed which captures the coordination mechanisms used in the achievement of mix flexibility.

The paper finds that mix flexibility requirements influence how a company achieves mix flexibility. Further, the findings indicate that, at an operational level, mix flexibility is achieved via the use of coordination mechanisms to manage specific dependencies relating to mix flexibility requirements.

Mix flexibility achievement was studied in a single industry. Future research can test the applicability of the conceptual framework in other manufacturing settings.

An empirical contribution to the study of manufacturing flexibility achievement has been made, where the application of constructs from coordination theory presents a novel approach to the study of manufacturing flexibility achievement.

The purpose of this paper is to provide an understanding of how the materials feeding design at a workstation impacts the assembly process performance, in terms of manufacturing flexibility, process support, materials planning and work task efficiency.

The empirical data are based on two embedded case studies performed in close corporation with two Swedish automotive companies; additional observations from more than 20 company visits in Japan, and small‐scale case studies performed in Japanese companies. To fully assess the work measurement figures, video recordings, work instructions and layout drawings were used to plot the operators' walking patterns, and it was then possible to map the whole work cycle for an operator. Industrial engineers, managers, group leaders, team leaders and operators were interviewed. Based on the literature review and personal experience from the small‐scale case studies carried out in Japan, the existing assembly systems' component racks were conceptually re‐designed. This led to two hypothetical assembly systems, which could be used for understanding the impact of materials feeding design on assembly process performance. The design of the new component racks and the choice of packaging types were made together with practitioners.

The paper shows that the design of component racks and choice of packaging types have a major impact on the assembly process performance. Component racks with a large depth and small width and tailored packages create important advantages over traditional Swedish component racks designed for EUR‐pallets. Line stocking is not always the best choice for materials feeding, but this paper shows that line stocking, especially in Swedish assembly systems, can be improved. Sequencing can thus be reduced, resulting in fewer problems when there are sequence breaks in the production flow. Component racks with small packages and large depth increase the work task efficiency, volume, mix, new products and modification flexibility. For example, free space is an important issue for these types of flexibilities. Component racks that are portable and easy to rearrange, together with free space, greatly facilitate handling of new product introductions or modifications of products. The new and old component can be displayed and fed to the same workstation, and if there is a larger change a whole segment of a component rack can easily be replaced by a new one between work shifts.

The scope of the study is limited to the conditions at workstations. Consequences for the materials flow upstream (i.e. internal materials handling, warehousing, transport, supplier processes, etc.) are not included, but must in further studies also be considered to avoid sub‐optimisation.

The paper highlights the fact that a shift in focus is necessary when designing workstations with component racks in Swedish companies, meaning that operators become the customers rather than the transport company or materials handler.

The use of Taguchi experimental design techniques to examine the effects of package type, solder paste type and solder reflow technique on the quality of fine pitch surface mount IC package solder joints is described. In particular, the effect of the use of ceramic or plastic packages, copper or Alloy 42 leadframes, silver loaded or non‐silver loaded solder paste and infra‐red, laser or hot‐bar reflow on solder joint metallurgical structure, electrical resistance and mechanical strength is evaluated. In addition to these solder joint parameters, an associated visual inspection was used to find the best process parameters to minimise solder balling, bridging etc. and a correlation between paste contacts at placement and solder bridges after reflow was also conducted. The experiment used an L9 array to find the optimum parameters from three factors, each at three levels. An extension to the basic Taguchi array was included in the form of an outer (noise) factor to include the effect of climatic stress on the solder joints under investigation. Response tables separate out the contribution of each factor level to the mechanical strength and electrical resistance of the assemblies. By comparing the response tables before and after climatic testing it is possible to estimate the effect of each factor level on the long‐term quality of the solder joints. It is shown how Taguchi experimental design techniques can be used to minimise the number of experiments required to predict optimum solder assembly process parameters. The accuracy of the prediction is shown by the results of a confirmation run which yielded mechanical strengths very close to those predicted, both before and after highly accelerated stress testing of the solder assemblies.

Food packaging pictures are one of the most important extrinsic cues for consumers to evaluate food products before purchasing. Over the past decades, marketers have used exaggerated pictures to attract consumers' attention, enhance their attitude toward a product and increase their purchase intention. This study examined the interplay of “puff-up” product picture, food type and picture type in influencing consumers' responses via persuasion knowledge.

The research comprises two 2 × 2 factorial experiments. Study 1 tested the interaction effect of puffery (high vs low) and food type (utilitarian vs. hedonic) on consumers' responses using two fictitious brands of prepared food, whereas Study 2 tested the interaction effect of puffery (high vs. low) and picture type (ingredients vs. cooked food) using a fictitious brand of Chinese delicacy.

Results demonstrated that the degree of picture puffery did not influence consumers' responses to utilitarian food and ingredient image. Conversely, consumers were sensitive to puffery when they see hedonic food and cooked-food image. Our findings also suggested that consumers' persuasion knowledge mediates the relationship between puffery and their responses.

The presented findings facilitate marketers to know consumers' attitude about food puffery pictures.

This research is one of the first efforts to empirically explore the influences of persuasion knowledge on food puffery pictures. The importance of this work is underscored by the fact that a growing number of visual exaggerations are adopted on food packaging.

The purpose of this paper is to examine how firms manage the front end of new product development projects where packaging forms a core part of the product itself. Within the fast-moving consumer goods industry, innovation provides opportunities to create packaging that forms an integrated part of the product offering. The authors refer to these as packaging-integrated-products. This study conceptualises three levels of integration and investigates how they impact upon the management of the front end.

The study consisted of a two-phase design. This involved a preliminary study with key informants, followed by a multiple case study design, which examines product development projects with differing extents of packaging integration.

The results identify nine different new product opportunities. The authors also present 11 propositions that reveal the key characteristics of the front end of packaging-integrated development projects, as well as the project management requirements to capture the opportunities they present.

Initial insights into a number of unique front-end project management characteristics required to deliver different project types form an area for further research to better understand product packaging integration. The propositions presented guide the way forward for future studies.

The findings provide marketers with new understanding of three types of new product opportunities presented by packaging integration and demonstrate what is required to capture the opportunities they present in the front end of product development.

The paper contributes to extant studies of packaging development in the marketing literature, which have previously failed to capture the high levels of integration between packaging and the product. The authors present a new conceptual approach to understanding integration and subsequently uncover how the opportunities it presents can be captured.

Known good die, flip chip and chip scale packages are technologies that offer various advantages to the board manufacturer. A discussion of the different types of package options, their methods of assembly, test and performance comparisons can help to resolve the general direction a manufacturer might pursue for next generation systems. This paper attempts to give a perspective as well as highlighting the areas of concern with the different options.

The purpose of this paper is to tackle the issue of store brand equity by considering two store brand’s positioning strategies: those with high perceived added value (the organic store brands), as opposed to economic brands. It takes place in the current environmental considerations showing the important role played by the packaging in determining the store brand equity.

A PLS Path model divided into four sub-models enables the authors to make specific predictions about customers’ purchase intentions. It also provides a concise operational calculation of the brand equity of each studied store brand.

Results show that economic brands build their equity with reinforced packaging, and organic brands maximise their brand equity by using simple packaging. In general, reinforced packaging improves the perceived quality of economic store brands but destroys that of organic brands. The calculations of overall equity scores for each studied store brand reveal that economic brands could benefit from further development whilst organic brands already maximise their equity.

Results will enable large retailers to develop effective campaigns focussing on perceived quality and more specifically by designing packaging that are suitable for the positioning of their brands – a simple packaging for organic brands and a reinforced packaging for economic brands to maximise customers’ value.

This is one of the first studies to deepen the store brand equity, comparing two contrasting types of brands, by studying specifically variations of the levels of customers’ perceived quality depending of two types of packaging.

The purpose of this paper is to describe a pilot study characterizing the domestic usage of food packaging (amount and type) at the household level.

Collection and detailed characterization is carried out, from a sample of Portuguese consumers, of packages used at home during a seven‐day period.

The daily intake of domestically consumed, packaged food ranged from 5 to 50 g/kgbw. The average intake value for children below 12 years old was 26 g/kgbw. Considering all packaging materials, package usage ranged from 0.1dm2/day.kgbw to 0.6dm2/day.kgbw. Packaging usage factors and food‐type distribution factors for each packaging material were estimated.

The period of packaging collection and the size of the sample limit the degree of generalized conclusions that can be drawn.

The data collected are the base for the development of a framework and could make an important contribution to the assessment of consumer exposure to substances migrating from packages into food, in this case of the Portuguese consumer.

The results achieved are analysed in relation to the current assumptions made for the safety assessment of materials in the relevant European legislation. Furthermore, the results achieved can be used in a probabilistic approach to these assessments as the distributions of values, and not only the per capita values, are known.

The purpose of this paper is to evaluate the lead‐free solder joint reliability of a variety of surface mount components assembled onto printed circuit boards (PCBs) under a number of different tests.

Lead‐free solder with a composition of Sn96.5‐Ag3.0‐Cu0.5 was used in a surface mount reflow process. Different types of surface mount dummy components with a daisy chain, such as CBGAs, BGAs, PLCCs, CSPs, and QFNs, were assembled onto PCBs. Both the mechanical and thermo‐mechanical reliability of the solder joints were evaluated by several tests. The experiments included package shear, package pull, three‐point bending and accelerated thermal cycling testing for 2,000 cycles. The packages were examined by X‐ray and C‐SAM before the reliability tests were carried out. The maximum load and the corresponding load‐displacement curve were recorded in the mechanical test.

The results from the mechanical tests show the major failure mode is on the copper pad. Weibull analysis shows that the characteristic lives of most packages are between 1,100 and 2,400 cycles. For the CBGA, the characteristic life of 96 cycles is relatively short, due to the serious CTE mismatch. Cross‐section inspection shows failures occur at the solder joint. Copper pad failure is also observed.

This paper provides both the mechanical and thermal‐mechanical reliability of lead‐free solder joints. The experimental data are very useful in the lead‐free SMT industries.

The purpose of this paper is to demonstrate that the positive effect of packaging transparency on purchase intention is moderated by product quality risk (PQR) associated with the product category.

Two separate experiments were conducted. Study 1 was designed to test the mediating role of perceived quality to account for the positive effect of transparency on purchase intention. Two types of packaging (opaque vs transparent) for a product associated with a high level of PQR were examined. Study 2 extended the findings by introducing the moderating role of PQR. A 2 (type of packaging: opaque vs transparent)*2 (PQR: low vs high) between subjects design was used.

The moderating role of the product PQR level is established: transparent packaging improves the product perceived quality and brand purchase intention when the product is associated with a high PQR, whereas there is no such preference for transparent packaging when the product is associated with a low PQR.

The results offer insights to better understand the potential gains from adopting transparent packaging. If a brand manager's main goals are to develop sales, costly investments in research and development of transparent packaging appear to be fruitful only for products associated with high PQR.

This paper contributes to packaging, cue utilisation and perceived risk literatures by evidencing the moderating role of PQR to explain the positive effect of transparency on purchase intention.