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The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This study aims to investigate the micro mechanism of macro rheological characteristics for composite modified asphalt.Grey relational analysis (GRA) was used to analyze the correlation between macro rheological indexes and micro infrared spectroscopy indexes.

First, a dynamic shear rheometer and a bending beam rheometer were used to obtain the evaluation indexes of high- and low-temperature rheological characteristics for asphalt (virgin, SBS/styrene butadiene rubber [SBR], SBS/rubber and SBR/rubber) respectively, and its variation rules were analyzed. Subsequently, the infrared spectroscopy test was used to obtain the micro rheological characteristics of asphalt, which were qualitatively and quantitatively analyzed, and its variation rules were analyzed. Finally, with the help of GRA, the macro-micro evaluation indexes were correlated, and the improvement efficiency of composite modifiers on asphalt was explored from rheological characteristics.

It was found that the deformation resistance and aging resistance of SBS/rubber composite modified asphalt are relatively good, and the modification effect of composite modifier and virgin asphalt is realized through physical combination, and the rheological characteristics change with the accumulation of functional groups. The correlation between macro rutting factor and micro functional group index is high, and the relationship between macro Burgers model parameters and micro functional group index is also close.

Results reveal the basic principle of inherent-improved synergistic effect for composite modifiers on asphalt and provide a theoretical basis for improving the composite modified asphalt.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

The purpose of this study is to investigate the thermomechanical condition on the shape memory property of Polybutylene adipate-co-terephthalate (PBAT). PBAT is a widely researched and rapidly developed biodegradable copolyester. In a tensile test, we found that the fractured PBAT samples had a heat-driven shape memory effect which piqued our interest, and it will lay a foundation for the application of PBAT in new fields (such as heat shrinkable film).

The shape memory effect of PBAT and the effect of the thermomechanical condition on its shape memory property were confirmed and systematically investigated by a thermal mechanical analyzer and tensile machine.

The results showed that the PBAT film had broad shape memory transform temperature and exhibited excellent thermomechanical stability and shape memory properties. The shape memory fixity ratio (Rf) of the PBAT films was increased with the prestrain temperature and prestrain, where the highest Rf exceeded 90%. The shape memory recovery ratio (Rr) of the PBAT films was increased with the shape memory recovery temperature and decreased with the prestrain value, and the highest Rr was almost 100%. Moreover, the PBAT films had high shape memory recovery stress which increased with the prestrain value and decreased with the prestrain temperature, and the highest shape memory recovery stress can reach 7.73 MPa.

The results showed that PBAT had a broad shape memory transform temperature, exhibited excellent thermomechanical stability and shape memory performance, especially for the sample programmed at high temperature and had a larger prestrian, which will provide a reference for the design, processing and application of PBAT-based heat shrinkable film and smart materials.

This study confirmed and systematically investigated the shape memory effect of PBAT and the effect of the thermomechanical condition on the shape memory property of PBAT.

Material extrusion-based additive manufacturing is a prominent manufacturing technique to fabricate complex geometrical three-dimensional (3D) parts. Despite the indisputable advantages of material extrusion-based technique, the poor surface and subsurface integrity hinder the industrial application of this technology. The purpose of this study is introducing the hot air jet treatment (HAJ) technique for surface treatment of additive manufactured parts.

In the presented research, novel theoretical formulation and finite element models are developed to study and model the polishing mechanism of printed parts surface through the HAJ technique. The model correlates reflow material volume, layer width and layer height. The reflow material volume is a function of treatment temperature, treatment velocity and HAJ velocity. The values of reflow material volume are obtained through the finite element modeling model due to the complexity of the interactions between thermal and mechanical phenomena. The theoretical model presumptions are validated through experiments, and the results show that the treatment parameters have a significant impact on the surface characteristics, hardness and dimensional variations of the treated surface.

The results demonstrate that the average value of error between the calculated theoretical results and experimental results is 14.3%. Meanwhile, the 3D plots of Ra and Rq revealed that the maximum values of Ra and Rq reduction percentages at 255°C, 270°C, 285°C and 300°C treatment temperatures are (35.9%, 33.9%), (77.6%,76.4%), (94%, 93.8%) and (85.1%, 84%), respectively. The scanning electron microscope results illustrate three different treatment zones and the treatment-induced and manufacturing-induced entrapped air relief phenomenon. The measured results of hardness variation percentages and dimensional deviation percentages at different regimes are (8.33%, 0.19%), (10.55%, 0.31%) and (−0.27%, 0.34%), respectively.

While some studies have investigated the effect of the HAJ process on the structural integrity of manufactured items, there is a dearth of research on the underlying treatment mechanism, the integrity of the treated surface and the subsurface characteristics of the treated surface.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

The purpose of this study is to investigate the thermoforming process of 3D-printed parts made from polylactic acid (PLA) and explore its application in producing wrist-hand orthoses. These orthoses were 3D printed flat, heated and molded to fit the patient’s hand. The advantages of such an approach include reduced production time and cost.

The study used both experimental and numerical methods to analyze the thermoforming process of PLA parts. Thermal and mechanical characteristics were determined at different temperatures and infill densities. An equivalent material model that considers infill within a print is proposed. Its practical use was proven using a coupled finite-element analysis model. The simulation strategy enabled a comparative analysis of the thermoforming behavior of orthoses with two designs by considering the combined impact of natural convection cooling and imposed structural loads.

The experimental results indicated that at 27°C and 35°C, the tensile specimens exhibited brittle failure irrespective of the infill density, whereas ductile behavior was observed at 45°C, 50°C and 55°C. The thermal conductivity of the material was found to be linearly related to the temperature of the specimen. Orthoses with circular open pockets required more time to complete the thermoforming process than those with hexagonal pockets. Hexagonal cutouts have a lower peak stress owing to the reduced reaction forces, resulting in a smoother thermoforming process.

This study contributes to the existing literature by specifically focusing on the thermoforming process of 3D-printed parts made from PLA. Experimental tests were conducted to gather thermal and mechanical data on specimens with two infill densities, and a finite-element model was developed to address the thermoforming process. These findings were applied to a comparative analysis of 3D-printed thermoformed wrist-hand orthoses that included open pockets with different designs, demonstrating the practical implications of this study’s outcomes.

Among the various applications involving the use of microwave energy, its growing utility within the mining industry is particularly noteworthy. Conventional grinding processes are often overburdened by energy inefficiencies that are directly related to machine wear, pollution and rising project costs. In this work, we numerically investigate the effects of microwave pretreatment through a series of compression tests as a means to help mitigate these energy inefficiencies.

We investigate the effects of microwave pretreatment on various rock samples, as quantified by uniaxial compression tests. In particular, we assign sample heterogeneity based on a Gaussian statistical distribution and invoke a damage model for elemental tensile and compressive stresses based on the maximum tensile stress and the Mohr–Coulomb theories, respectively. We further couple the electromagnetic, thermal and solid displacement relations using finite element modeling.

(1) Increased power intensity during microwave pretreatment results in decreased axial compressive stress. (2) Leveraging statistics to induce variable compressive and tensile strength can greatly facilitate sample heterogeneity and prove necessary for damage modeling. (3) There exists a nonlinear trend to the reduction in smax with increasing power levels, implying an optimum energy output efficiency to create the maximum degradation-power cost relationship.

Previous research in this area has been largely limited to two-dimensional thermo-electric models. The onset of high-performance computing has allowed for the development of high-fidelity, three-dimensional models with coupled equations for electromagnetics, heat transfer and solid mechanics.

This paper aims to achieve phosphating via optimal features of Mg metal as a suitable base coating, which is considered for other properties such as barrier properties against the passage of several factors.

In this research, in the phosphate bath, immersion time, temperature and the content of sodium nitrite as an accelerator were changed.

As a result, increasing the immersion time of AZ31 Mg alloy samples in the phosphating bath as well as increasing the ratio of sodium dodecyl sulfate (SDS) concentration to sodium nitrite concentration in the phosphating bath formulation increase the mass of phosphating formed per unit area of the Mg alloy. The results of the scanning electron microscope test showed phosphating is not completely formed in short immersion times, which is a thin and uneven layer.

Mg and its alloys are sensitive to galvanic corrosion, which would lead to generating several holes in the metal. As such, it causes a decrease in mechanical stability as well as an unfavorable appearance.

Mg is used in several industries such as automobile and computer parts, mobile phones, astronaut compounds, sports goods and home appliances.

Nevertheless, Mg has high chemical reactivity, so an oxide-hydroxide layer is formed on its surface, which has a harmful effect on the adhesion and uniformity of the coating applied on Mg.

By increasing the ratio of SDS concentration to sodium nitrite concentration in the phosphating bath, the corrosion resistance of the phosphating increases.