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1 – 8 of 8Mohammad A. Gharaibeh and Faris M. Al-Oqla
There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly…
Abstract
Purpose
There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.
Design/methodology/approach
A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.
Findings
The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.
Originality/value
Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.
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Mohammad A Gharaibeh, Markus Feisst and Jürgen Wilde
This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.
Abstract
Purpose
This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.
Design/methodology/approach
The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.
Findings
The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.
Originality/value
In literature, there is no constitutive modeling data on the AgSn TLP bonds.
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Daniel E.S. Rodrigues, Jorge Belinha and Renato Natal Jorge
Fused Filament Fabrication (FFF) is an extrusion-based manufacturing process using fused thermoplastics. Despite its low cost, the FFF is not extensively used in high-value…
Abstract
Purpose
Fused Filament Fabrication (FFF) is an extrusion-based manufacturing process using fused thermoplastics. Despite its low cost, the FFF is not extensively used in high-value industrial sectors mainly due to parts' anisotropy (related to the deposition strategy) and residual stresses (caused by successive heating cycles). Thus, this study aims to investigate the process improvement and the optimization of the printed parts.
Design/methodology/approach
In this work, a meshless technique – the Radial Point Interpolation Method (RPIM) – is used to numerically simulate the viscoplastic extrusion process – the initial phase of the FFF. Unlike the FEM, in meshless methods, there is no pre-established relationship between the nodes so the nodal mesh will not face mesh distortions and the discretization can easily be modified by adding or removing nodes from the initial nodal mesh. The accuracy of the obtained results highlights the importance of using meshless techniques in this field.
Findings
Meshless methods show particular relevance in this topic since the nodes can be distributed to match the layer-by-layer growing condition of the printing process.
Originality/value
Using the flow formulation combined with the heat transfer formulation presented here for the first time within an in-house RPIM code, an algorithm is proposed, implemented and validated for benchmark examples.
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Mohammad Saeid Aghighi, Christel Metivier and Sajad Fakhri
According to the research, viscoplastic fluids are sensitive to slipping. The purpose of this study is to determine whether slip affects the Rayleigh–Bénard convection of…
Abstract
Purpose
According to the research, viscoplastic fluids are sensitive to slipping. The purpose of this study is to determine whether slip affects the Rayleigh–Bénard convection of viscoplastic fluids in cavities and, if so, under what conditions.
Design/methodology/approach
The wall slip was evaluated using a model created for viscoplastic (Bingham) fluids. The coupled conservation equations were solved numerically using the finite element method. Simulations were performed for various parameters: the Rayleigh number, yield number, slip yield number and friction number.
Findings
Wall slip determines two essential yield stresses: a specific yield stress value beyond which wall slippage is impossible (S_Yc); and a maximum yield stress beyond which convective flow is impossible (Y_c). At low Rayleigh numbers, Y_c is smaller than S_Yc. Hence, the flow attained a stable (conduction) condition before achieving the no-slip condition. However, for more significant Rayleigh numbers Y_c exceeded S_Yc. Thus, the flow will slip at low yield numbers while remaining no-slip at high yield numbers. The possibility of slipping on the wall increases the buoyancy force, facilitating the onset of Rayleigh–Bénard convection.
Originality/value
An essential aspect of this study lies in its comprehensive examination of the effect of slippage on the natural convection flow of viscoplastic materials within a cavity, which has not been previously investigated. This research contributes to a new understanding of the viscoplastic fluid behavior resulting from slipping.
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Thameem Hayath Basha, Sivaraj Ramachandran and Bongsoo Jang
The need for precise synthesis of customized designs has resulted in the development of advanced coating processes for modern nanomaterials. Achieving accuracy in these processes…
Abstract
Purpose
The need for precise synthesis of customized designs has resulted in the development of advanced coating processes for modern nanomaterials. Achieving accuracy in these processes requires a deep understanding of thermophysical behavior, rheology and complex chemical reactions. The manufacturing flow processes for these coatings are intricate and involve heat and mass transfer phenomena. Magnetic nanoparticles are being used to create intelligent coatings that can be externally manipulated, making them highly desirable. In this study, a Keller box calculation is used to investigate the flow of a coating nanofluid containing a viscoelastic polymer over a circular cylinder.
Design/methodology/approach
The rheology of the coating polymer nanofluid is described using the viscoelastic model, while the effects of nanoscale are accounted for by using Buongiorno’s two-component model. The nonlinear PDEs are transformed into dimensionless PDEs via a nonsimilar transformation. The dimensionless PDEs are then solved using the Keller box method.
Findings
The transport phenomena are analyzed through a comprehensive parametric study that investigates the effects of various emerging parameters, including thermal radiation, Biot number, Eckert number, Brownian motion, magnetic field and thermophoresis. The results of the numerical analysis, such as the physical variables and flow field, are presented graphically. The momentum boundary layer thickness of the viscoelastic polymer nanofluid decreases as fluid parameter increases. An increase in mixed convection parameter leads to a rise in the Nusselt number. The enhancement of the Brinkman number and Biot number results in an increase in the total entropy generation of the viscoelastic polymer nanofluid.
Practical implications
Intelligent materials rely heavily on the critical characteristic of viscoelasticity, which displays both viscous and elastic effects. Viscoelastic models provide a comprehensive framework for capturing a range of polymeric characteristics, such as stress relaxation, retardation, stretching and molecular reorientation. Consequently, they are a valuable tool in smart coating technologies, as well as in various applications like supercapacitor electrodes, solar collector receivers and power generation. This study has practical applications in the field of coating engineering components that use smart magnetic nanofluids. The results of this research can be used to analyze the dimensions of velocity profiles, heat and mass transfer, which are important factors in coating engineering. The study is a valuable contribution to the literature because it takes into account Joule heating, nonlinear convection and viscous dissipation effects, which have a significant impact on the thermofluid transport characteristics of the coating.
Originality/value
The momentum boundary layer thickness of the viscoelastic polymer nanofluid decreases as the fluid parameter increases. An increase in the mixed convection parameter leads to a rise in the Nusselt number. The enhancement of the Brinkman number and Biot number results in an increase in the total entropy generation of the viscoelastic polymer nanofluid. Increasing the strength of the magnetic field promotes an increase in the density of the streamlines. An increase in the mixed convection parameter results in a decrease in the isotherms and isoconcentration.
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Mohammad A. Gharaibeh and James M. Pitarresi
Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices…
Abstract
Purpose
Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations.
Design/methodology/approach
Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed.
Findings
The results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations.
Originality/value
In literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.
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Kei Kimura, Takeshi Onogi and Fuminobu Ozaki
This work examines the effects of strain rate on the effective yield strength of high-strength steel at elevated temperatures, through tensile coupon tests at various strain…
Abstract
Purpose
This work examines the effects of strain rate on the effective yield strength of high-strength steel at elevated temperatures, through tensile coupon tests at various strain rates, to propose appropriate reduction factors considering the strain rate effect.
Design/methodology/approach
The stress–strain relationships of 385 N/mm2, 440 N/mm2 and 630 N/mm2-class steel plates at elevated temperatures are examined at three strain rate values (0.3%/min, 3.0%/min and 7.5%/min), and the reduction factors for the effective yield strength at elevated temperatures are evaluated from the results. A differential evolution-based optimization is used to produce the reduction-factor curves.
Findings
The strain rate effect enhances with an increase in the standard design value of the yield point. The effective yield strength and standard design value of the yield point exhibit high linearity between 600 and 700 °C. In addition to effectively evaluating the test results, the proposed reduction-factor curves can also help determine the ultimate strength of a steel member at collapse.
Originality/value
The novelty of this study is the quantitative evaluation of the relationship between the standard design value of yield point at ambient temperature and the strain-rate effect at elevated temperatures. It has been observed that the effect of the strain rate at elevated temperatures increases with the increase in the standard design value of the yield point for various steel strength grades.
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Kei Kimura, Takeshi Onogi, Naoya Yotsumoto and Fuminobu Ozaki
In this study, the effects of strain rate on the bending strength of full-scale wide-flange steel beams have been examined at elevated temperatures. Both full-scale loaded heating…
Abstract
Purpose
In this study, the effects of strain rate on the bending strength of full-scale wide-flange steel beams have been examined at elevated temperatures. Both full-scale loaded heating tests under steady-state conditions and in-plane numerical analysis using a beam element have been employed.
Design/methodology/approach
The load–deformation relationships in 385 N/mm2-class steel beam specimens was examined using steady-state tests at two loading rate values (0.05 and 1.00 kN/s) and at two constant member temperatures (600 and 700 °C). Furthermore, the stress–strain relationships considering the strain rate effects were proposed based on tensile coupon test results under various strain rate values. The in-plane elastoplastic numerical analysis was conducted considering the strain rate effect.
Findings
The experimental test results of the full-scale steel beam specimens confirmed that the bending strength increased with increase in strain rate. In addition, the analytical results agreed relatively well with the test results, and both strain and strain rate behaviours of a heated steel member, which were difficult to evaluate from the test results, could be quantified numerically.
Originality/value
The novelty of this study is the quantification of the strain rate effect on the bending strength of steel beams at elevated temperatures. The results clarify that the load–deformation relationship of steel beams could be evaluated by using in-plane analysis using the tensile coupon test results. The numerical simulation method can increase the accuracy of evaluation of the actual behaviour of steel members in case of fire.
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