Drop and impact reliability investigation of BGA and LGA interconnects
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 11 May 2023
Issue publication date: 30 June 2023
Abstract
Purpose
Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations.
Design/methodology/approach
Therefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed.
Findings
The results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations.
Originality/value
In literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.
Keywords
Acknowledgements
Expression of concern: The publisher of the Soldering & Surface Mount Technology is issuing an Expression of Concern for the following article: Gharaibeh, M.A. and Pitarresi, J.M. (2023), “Drop and impact reliability investigation of BGA and LGA interconnects”, Soldering & Surface Mount Technology, Vol. 35 No. 4, pp. 244-254, https://doi.org/10.1108/SSMT-03-2023-0012, to inform readers that concerns have been raised regarding the authorship of this paper. An investigation is ongoing and is currently unresolved. Further information will be provided by Soldering & Surface Mount Technology as it becomes available.
Citation
Gharaibeh, M.A. and Pitarresi, J.M. (2023), "Drop and impact reliability investigation of BGA and LGA interconnects", Soldering & Surface Mount Technology, Vol. 35 No. 4, pp. 244-254. https://doi.org/10.1108/SSMT-03-2023-0012
Publisher
:Emerald Publishing Limited
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