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High packaging density in the present VLSI era builds an acute power crisis, which limits the use of MOSFET device as a constituent block in CMOS technology. This leads researchers in looking for alternative devices, which can replace the MOSFET in CMOS VLSI logic design. In a quest for alternative devices, tunnel field effect transistor emerged as a potential alternative in recent times. The purpose of this study is to enhance the performances of the proposed device structure and make it compatible with circuit implementation. Finally, the performances of that circuit are compared with CMOS circuit and a comparative study is made to find the superiority of the proposed circuit with respect to conventional CMOS circuit.

Silicon–germanium heterostructure is currently one of the most promising architectures for semiconductor devices such as tunnel field effect transistor. Analytical modeling is computed and programmed with MATLAB software. Two-dimensional device simulation is performed by using Silvaco TCAD (ATLAS). The modeled results are validated through the ATLAS simulation data. Therefore, an inverter circuit is implemented with the proposed device. The circuit is simulated with the Tanner EDA tool to evaluate its performances.

The proposed optimized device geometry delivers exceptionally low OFF current (order of 10^−18 A/um), fairly high ON current (5x10^−5 A/um) and a steep subthreshold slope (20 mV/decade) followed by excellent ON–OFF current ratio (order of 10^13) compared to the similar kind of heterostructures. With a very low threshold voltage, even lesser than 0.1 V, the proposed device emerged as a good replacement of MOSFET in CMOS-like digital circuits. Hence, the device is implemented to construct a resistive inverter to study the circuit performances. The resistive inverter circuit is compared with a resistive CMOS inverter circuit. Both the circuit performances are analyzed and compared in terms of power dissipation, propagation delay and power-delay product. The outcomes of the experiments prove that the performance matrices of heterojunction Tunnel FET (HTFET)-based inverter are way ahead of that of CMOS-based inverter.

Germanium–silicon HTFET with stack gate oxide is analytically modeled and optimized in terms of performance matrices. The device performances are appreciable in comparison with the device structures published in contemporary literature. CMOS-like resistive inverter circuit, implemented with this proposed device, performs well and outruns the circuit performances of the conventional CMOS circuit at 45-nm technological node.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Advancement in optimization of VLSI circuits involves reduction in chip size from micrometer to nanometer level as well as fabrication of a billions of transistors in a single die where global routing problem remains significant with a trade-off of power dissipation and interconnect delay. This paper aims to solve the increased complexity in VLSI chip by minimization of the wire length in VLSI circuits using a new approach based on nature-inspired meta-heuristic, invasive weed optimization (IWO). Further, this paper aims to achieve maximum circuit optimization using IWO hybridized with particle swarm optimization (PSO).

This paper projects the complexities of global routing process of VLSI circuit design in mapping it with a well-known NP-complete problem, the minimum rectilinear Steiner tree (MRST) problem. IWO meta-heuristic algorithm is proposed to meet the MRST problem more efficiently and thereby reducing the overall wire-length of interconnected nodes. Further, the proposed approach is hybridized with PSO, and a comparative analysis is performed with geosteiner 5.0.1 and existing PSO technique over minimization, consistency and convergence against available benchmark.

This paper provides high performance–enhanced IWO algorithm, which keeps in generating low MRST value, thereby successful wire length reduction of VLSI circuits is significantly achieved as evident from the experimental results as compared to PSO algorithm and also generates value nearer to geosteiner 5.0.1 benchmark. Even with big VLSI instances, hybrid IWO with PSO establishes its robustness over achieving improved optimization of overall wire length of VLSI circuits.

This paper includes implications in the areas of optimization of VLSI circuit design specifically in the arena of VLSI routing and the recent developments in routing optimization using meta-heuristic algorithms.

This paper fulfills an identified need to study optimization of VLSI circuits where minimization of overall interconnected wire length in global routing plays a significant role. Use of nature-based meta-heuristics in solving the global routing problem is projected to be an alternative approach other than conventional method.

The purpose of this paper is to use the corresponding magnetic sensor and detection method to detect and image the defects of small diameter pipelines. Urban gas pipeline is an energy transportation tool for urban industrial production and social life, which is closely related to urban safety. Preventing the occurrence of urban gas pipeline transportation accidents and carrying out pipeline defect detection are of great significance for the urban economic and social stability. To perform pipeline defect detection, the magnetic flux leakage internal detection method is generally used in the detection of large-diameter long-distance oil and gas pipelines. However, in terms of the internal detection of small-diameter pipelines, due to the heavy weight, large structure of the detection device and small pipe diameter, the detection is more difficult.

In order to solve the above matters, self-made three-dimensional magnetic sensor and three-dimensional magnetic flux leakage imaging direct method are proposed for studying the defect identification. Firstly, for adapting to the diameter range of small-diameter pipelines, and containing the complete information of the defect, a self-made three-dimensional magnetic sensor is made in this paper to improve the accuracy of magnetic flux leakage detection. And on the basis of it, a small diameter pipeline defect detection system is built. Secondly, as detection signal may be affected by background magnetic field interference and the jitter interference, the complete ensemble empirical mode decomposition with adaptive noise method is utilized to screen the detected signal. As a result, the useful signal is reconstructed and the interference signal is removed. Finally, the defect contour inversion imaging of detection is realized based on the direct method of three-dimensional magnetic flux leakage imaging, which includes three-dimensional magnetic flux leakage detection data and data segmentation recognition.

The three-dimensional magnetic flux leakage imaging experimental results shown that, compared to the actual defects, the typical defects, irregular defects and crack groove defects can be analyzed by the magnetic flux leakage defect contour imaging method in qualitative and quantitative way respectively, which provides a new idea for the research of defect recognition.

A three-dimensional magnetic sensor is made to adapt the diameter range of small diameter pipeline, and based on it, a small-diameter pipeline defect detection system is built to collect and display the magnetic flux leakage signal.

This study aims to provide a microfluidic blood glucose sensing platform based on integrated interdigitated electrode arrays (IDEAs) on a flexible quartz glass substrate, adhering closely to pertinent electrochemical characterizations.

Sensors are the key elements of the modern electronics era through which all the possible physical quantities can be detected and converted into their equivalent electrical form and processed further. But to make the sensing environment better, various types of innovative architectures are being developed nowadays and among them interdigitated electrodes are quite remarkable in terms of their sensing capability. They are a well-qualified candidate in the field of gas sensing and biosensing, but even their sensitivities are getting saturated due to their physical dimensions. Most of the thin film IDEAs fabricated by conventional optical lithographic techniques do not possess a high surface-to-volume ratio to detect the target specified and that reduces their sensitivity factor. In this context, a classic conductive carbon-based highly sensitive three dimensional (3D) IDEA-enabled biosensing system has been conceived on a transparent and flexible substrate to measure the amount of glucose concentration present in human blood. 3D IDEA possesses a way better capacitive sensing behavior compared to conventional thin film microcapacitive electrodes. To transmit the target biological analyte sample property for the detection purpose to the interdigitated array-based sensing platform, the design of a microfluidic channel is initiated on the same substrate. The complex 3D Inter Digital array structure improves the overall capacitance of the entire sensing platform and the reactive surface area as well. The manufactured integrated device displays a decent value of sensitivity in the order of 5.6 µA mM⁻¹ cm⁻².

Development of a low-cost array-based integrated and highly flexible microfluidic biochip to extract the quantity of glucose present in human blood.

Potential future research opportunities in the realm of integrated miniaturized, low-cost smart biosensing systems may arise from this study.

The purpose of this study is to present a novel extended hybrid analytical method (HAM) that leverages a two-dimensional (2-D) coupling between the semi-analytical Maxwell–Fourier analysis and the finite element method (FEM) in Cartesian coordinates.

The proposed model is applied to flat permanent-magnet linear electrical machines with rotor-dual. The magnetic field solution across the entire machine is established by coupling an exact analytical model (AM), designed for regions with relative magnetic permeability equal to unity, with a FEM in ferromagnetic regions. The coupling between AM and FEM occurs bidirectionally (x, y) along the edges separating teeth regions and their adjacent regions through applied boundary conditions.

The developed HAM yields accurate results concerning the magnetic flux density distribution, cogging force and induced voltage under various operating conditions, including magnetic or geometric parameters. A comparison with hybrid finite-difference and hybrid reluctance network methods demonstrates very satisfactory agreement with 2-D FEM.

The original contribution of this paper lies in establishing a direct coupling between the semi-analytical Maxwell–Fourier analysis and the FEM, particularly at the interface between adjacent regions with differing magnetic parameters.

The purpose objective of this study is to identify the friction coefficient and friction effect in electromagnetic upsetting (EMU) high-speed forming process.

Based on numerical simulation and upsetting experiment of 2A10 aluminum alloy bar, the friction coefficient between contact surfaces is obtained by combining the fitting displacement distribution function and the electromagnetic-mechanical coupling numerical model, and the influence of friction effect is analyzed.

The maximum impact velocity and acceleration during EMU are 13.9 m/s and −3.3 × 106 m/s², respectively, and the maximum strain rate is 7700 s⁻¹. The functional distribution relationship between friction coefficient combination (FS, FD) and characteristic parameters [upper diameter (D1) and middle diameter (D2)] is established. The values of FS and FD are 0.1402 and 0.0931, respectively, and the maximum relative error is 2.39%. By analyzing the distribution of equivalent stress and strain, it is found that plastic deformation has obvious zoning characteristics and there is serious failure concentration in the strong shear zone.

Friction coefficient significantly affects stress or strain distributions in material forming process, but it is difficult to obtain friction coefficients through experimental tests in the high-speed forming process. In this paper, a multi-field coupling numerical model is proposed to determine friction coefficients and applied to the electromagnetic impact loading process (a high-speed forming process).

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-05-2024-0154/

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

The paper aims to reveal the relationship among energy efficiency, thermal comfort and thermal regulation of electrically heated footwear and to investigate influencing factors on the energy efficiency and thermal comfort.

A finite volume model was proposed to simulate the two-dimensional heat transfer in electrically heated footwear (EHF) under an extremely cold condition. The model domain consists of three-layer footwear materials, a heating pad, a sock material, an air gap and skin tissues. Model predictions were verified by experimental data from cold-contact exposure. Then the influencing factors on the energy efficiency and thermal comfort were investigated through parametric analysis.

The paper demonstrated that the skin temperature control (STC) mode provided superior thermal comfort compared to the heating pad temperature control (HPTC) mode. However, the energy efficiency for the HPTC mode with a heating temperature of 38 °C was 18% higher than the STC mode. The energy efficiency of EHF while reaching the state of thermal comfort was strongly determined by the arrangement and connection of heating elements, heating temperature, thickness and thermal conductivity of footwear materials.

The findings obtained in this paper can be used to engineer the EHF that provides optimal thermal comfort and energy efficiency in cold environments.

The purpose of this study is to optimize and improve conventional welding using EMF assisted technology. Current industrial production has put forward higher requirements for welding technology, so the optimization and improvement of traditional welding methods become urgent needs.

External magnetic field assisted welding is an emerging technology in recent years, acting in a non-contact manner on the welding. The action of electromagnetic forces on the arc plasma leads to significant changes in the arc behavior, which affects the droplet transfer and molten pool formation and ultimately improve the weld seam formation and joint quality.

In this paper, different types of external magnetic fields are analyzed and summarized, which mainly include external transverse magnetic field, external longitudinal magnetic field and external cusp magnetic field. The research progress of welding behavior under the effect of external magnetic field is described, including the effect of external magnetic field on arc morphology, droplet transfer and weld seam formation law.

However, due to the extremely complex physical processes under the action of the external magnetic field, the mechanism of physical fields such as heat, force and electromagnetism in the welding has not been thoroughly analyzed, in-depth theoretical and numerical studies become urgent.