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The purpose of this paper is to assess the thermo-mechanical reliability of a solder bump with different underfills, with the evaluation of different underfill materials. As there is more demand in higher input/output, smaller package size and lower cost, a flip chip mounted at the module level of a board is considered. However, bonding large chips (die) to organic module means a larger differential thermal expansion mismatch between the module and the chip. To reduce the thermal stresses and strains at solder joints, a polymer underfill is added to fill the cavity between the chip and the module. This procedure has typically, at least, resulted in an increase of the thermal fatigue life by a factor of ten, as compared to the non-underfilled case. Yet, this particular case is to deal with a flip chip mounted on both sides of a printed circuit board (PCB) module symmetrically (solder bump interconnection with Cu-Pillar). Note that Cu-Pillar bumping is known to possess good electrical properties and better electromigration performance. The drawback is that the Cu-Pillar bump can introduce high stress due to the higher stiffness of Cu compared to the solder material.

As a reliability assessment, thermal cyclic loading condition was considered in this case. Thermal life prediction was conducted by using finite element analysis (FEA) and modified Darveaux’s model, considering microsize of the solder bump. In addition, thermo-mechanical properties of four different underfill materials were characterized, such as Young’s modulus at various temperatures, coefficient of temperature expansion and glass transition temperature. By implementing these properties into FEA, life prediction was accurately achieved and verified with experimental results.

The modified life prediction method was successfully adopted for the case of Cu-Pillar bump interconnection in flip chip on the module package. Using this method, four different underfill materials were evaluated in terms of material property and affection to the fatigue life. Both predicted life and experimental results are obtained.

This study introduces the technique to accurately predict thermal fatigue life for such a small scale of solder interconnection in a newly designed flip chip package. In addition, a guideline of underfill material selection was established by understanding its affection to thermo-mechanical reliability of this particular flip chip package structure.

The purpose of this study is to investigate Thermo-mechanical limit elastic speed analysis of functionally graded (FG) rotating disks with the temperature-dependent material properties. Three different material models i.e. power law, sigmoid law and exponential law, along with varying disk profiles, namely, uniform thickness, tapered and exponential disk was considered.

The methodology adopted was variational principle wherein the solution was obtained by Galerkin’s error minimization principle. The Young’s modulus, coefficient of thermal expansion and yield stress variation were considered temperature-dependent.

The study shows a substantial increase in limit speed as disk profiles change from uniform thickness to exponentially varying thickness. At any radius in a disk, the difference in von Mises stress and yield strength shows the remaining stress-bearing capacity of material at that location.

Rotating disks are irreplaceable components in machinery and are used widely from power transmission assemblies (for example, gas turbine disks in an aircraft) to energy storage devices. During operations, these structures are mainly subjected to a combination of mechanical and thermal loadings.

The findings of the present study illustrate the best material models and their grading index, desired for the fabrication of uniform, as well as varying FG disks. Finite element analysis has been performed to validate the present study and good agreement between both the methods is seen.

Functionally graded materials are a special class of composites in which material are graded either continuously or layered wise depending upon its applications. With such variations of materials, the properties of structure vary either lengthwise or thickness wise. This paper aims to investigate models for effective estimation of material properties, as it is necessary for industries to identify the properties of composites or functionally graded materials (FGM’s) before manufacturing and also to develop novel material combinations.

Available models were compared for different material combinations and tested with experimental data for properties such as Young’s modulus, density, coefficient of thermal expansion (CTE) and thermal conductivity. Combinations of metal–ceramic and metal–metal were selected such that their ratios cover a wide range of materials.

This study reveals different models will be required depending on the material used and properties to be identified.

The results of the present work will help researchers in the effective modeling of composites or FGM’s for any analysis.

This paper presents a comparison and review of various analytical methods with experimental data graphically to find out the best suitable method. For the first time, the Halpin-Tsai model was extended in the analysis of the CTE which shows good approximations.

Aims to explain the main requirements for printed circuit boards (PCBs) and to determine the survival rate of boards in lead‐free assembly.

The first two main requirements are the survival of 5‐6 cycles lead free reflow with peak temperatures of up to 260°C and an identical or even better board reliability of such boards compared to todays eutectic soldered ones. In a first series of tests the influence of base materials, reflow temperature gradient and peak temperature on PCB survival rate are investigated. Thermo‐mechanical data of different epoxy‐based materials are compared to survival rate investigations using repeated reflow tests. The impact of PCB manufacturing and design on the lead free performance is discussed. A second series of investigations is air‐to‐air life cycle tests of daisy chain boards out of different epoxy‐based materials with varying preconditioning were done.

The tests showed that dicy cured epoxy base materials are not able to withstand the thermal stress of the mentioned soldering steps. Board design and the heating gradient in reflow also influence the assembly performance. Thermal cycling tests (air‐to‐air), showed clearly the effect of reflow temperature and number of reflow cycles on through‐hole reliability. There was no significant impact of z‐axis‐expansion on the through‐hole failure rate in air‐to‐air cycling.

Provides further information on the lead‐free assembly of PCBs.

Explores the possibility of preparing elastic and hard ebonite coatings, utilizing the properties of oligobutadienes without ending functional groups. Examines the vulcanization processes leading to formation of rubberizing ebonite coatings on samples of oligobutadienes. Finds that the most effective bonding material for non‐solution compositions is ebonite coatings.

The purpose of the study was to develop the forming methodology for FML laminates with complex shapes, based on aluminium and epoxy-glass composite.

The subject of research encompassed Al/GFRP fibre metal laminates. Autoclave process has been selected for FML profiles production. The manufacturing process was followed by quality analysis for laminates produced.

The achievement of high stability and dimensional tolerance of thin-walled FML laminates is ensured by developed technology. The values of selected sections angles are significantly limited as a result of forming of FML laminates through the components performing. Failure to adhere to technological recommendations and to high regime of developer technology may lead to the occurrence of defects in FML.

Thin-walled composite structures could be applied in light-weight constructions, such as aircraft structures, which must meet rigorous requirements with regard to operation under complex load. The development of this type of technology may contribute to increased importance of FML sections in research area and finally to increased scope of their applications.

The production of thin-walled FML profiles with complex geometry, which would be characterized by dimensional stability and repeatable structural quality free of defects, is associated with many problems. No studies have been published so far on an effective forming process for FML laminates with complex shapes. Developed methodology has been verified through quality evaluation of produced profiles by means of non-destructive and destructive methods. The development of this type of technology may contribute to increased importance of FML, e.g. in aerospace technology.

The application of new technologies requires, however, modern rolling mills. Indeed, in manufacturing plants of older types, strict compliance with the developed rolling regimes is not always feasible. Improving the mechanical properties in such cases is possible only by means of cooling. Compressive deformation behavior of carbon–manganese (C-Mn) grade has been investigated at temperatures ranging from 800-900°C and strain rate from 0.01-50 s−1 on Gleeble-3800, a thermo-mechanical simulator. Simulation studies have been conducted mainly to observe the microstructural changes for various strain rate and deformation temperatures at a constant strain of 0.5 and a cooling rate of 20°C s−1.

The project begins with simulation of a hot rolling condition using the thermo-mechanical simulator; this was followed by microstructural examination and identification of phases present by using an optical microscope for hot-rolled coil and simulated samples; grain size measurement and size distribution studies; and optimization of finishing temperature, coiling temperature and cooling rate by mimicking plant processing parameters to improve the mechanical properties.

As the strain rate and temperature increase, pearlite banding decreases gradually and finally gets completely eliminated, thereby improving the mechanical properties. True stress–strain curves were plotted to extrapolate the effect of strain-hardening and strain rate sensitivity on austenite (γ) and austenite–ferrite (γ-a) regions. To validate the effect of strain rate and temperature over the grain size, the hardness of simulated samples was measured using the universal hardness tester and the corresponding tensile strength was found from the standard hardness chart.

The results of the study carried out have projected a new technology of thermo-mechanical simulation for the studied C-Mn grade. These results were used to optimize the plant processing parameter like finishing and coiling temperature and finishing stands strain rate.

By controlling the hot rolling conditions like finishing, coiling temperature and cooling rate, structures differing in mechanical properties can be obtained for the same material. Accurate understanding of a structure being formed when different temperatures are applied enables the control of the process that assures intended structures and mechanical properties are achieved.

This paper aims to establish a multiscale topology optimization method for the optimal design of non-periodic, self-supporting cellular structures subjected to thermo-mechanical loads. The result is a hierarchically complex design that is thermally efficient, mechanically stable and suitable for additive manufacturing (AM).

The proposed method seeks to maximize thermo-mechanical performance at the macroscale in a conceptual design while obtaining maximum shear modulus for each unit cell at the mesoscale. Then, the macroscale performance is re-estimated, and the mesoscale design is updated until the macroscale performance is satisfied.

A two-dimensional Messerschmitt Bolkow Bolhm (MBB) beam withstanding thermo-mechanical load is presented to illustrate the proposed design method. Furthermore, the method is implemented to optimize a three-dimensional injection mold, which is successfully prototyped using 420 stainless steel infiltrated with bronze.

By developing a computationally efficient and manufacturing friendly inverse homogenization approach, the novel multiscale design could generate porous molds which can save up to 30 per cent material compared to their solid counterpart without decreasing thermo-mechanical performance.

This study is a useful tool for the designer in molding industries to reduce the cost of the injection mold and take full advantage of AM.

In this work, the effect of porosity volume fraction, porosity types, material grading index, variable disk profiles and aspect ratio on disk performance was studied by performing limit elastic speed analysis of functionally graded porous rotating disks (PFGM) under thermo-mechanical loading.

The composition change was varied by employing the power law function. The thermo-mechanical properties of PFGM such as Young's modulus and yield strength were estimated using modified rule of mixture, for density and coefficient of thermal expansion rule of mixture was used. The even and uneven distribution of porosity in a disk was taken as uniform, symmetrical, inner maximum and outer maximum. The problem was then solved with the help of the variational principle and Galerkin's error minimization theory.

The research reveals that the grading parameter, disk geometry and porosity distribution have a significant impact on the limit elastic speed in comparison to the aspect ratio.

The study determines a range of operable speeds for porous and non-porous disk profiles that the industry can utilize to estimate structural performance.

A finite element investigation was conducted to validate the findings of the present study. Limit elastic analysis of porous FG disks under thermo-mechanical loading has not been studied before.

Under fix-position preload, the high rotation speed of the angular contact ball bearing exacerbates the frictional heat generation, which causes the increase of the bearing temperature and the thermal expansion. The high rotation speed also leads to the centrifugal expansion of the bearing. Under the thermal and centrifugal effect, the structural parameters of the bearing change, affecting the mechanical properties of the bearing. The mechanical properties of the bearing determine its heat generation mechanism and thermal boundary conditions. The purpose of this paper is to study the effect of centrifugal and thermal effects on the thermo-mechanical characteristics of an angular contact ball bearing with fix-position preload.

Because of operating conditions, elastic deformation occurs between the ball and the raceway. Assuming that the surfaces of the ball and channel are absolutely smooth and the material is isotropic, quasi-static theory and thermal network method are used to establish the thermo-mechanical coupling model of the bearing, which is solved by Newton–Raphson iterative method.

The higher the rotation speed, the greater the influence of centrifugal and thermal effects on the bearing dynamic parameters, temperature rise and actual axial force. The calculation results show that the effects of thermal field on bearing dynamic parameters are more significant than the centrifugal effect. The temperature rise and actual axial force of the bearing are measured. Comparing the calculation and the experimental results, it is found that the temperature rise and the actual axial force of the bearing are closer to reality considering thermal and centrifugal effects.

In the past studies, the thermo-mechanical coupling characteristics research and experimental verification of angular contact ball bearing with fix-position preload are not concerned. Research findings of this paper provide theoretical guidance for spindle design.