Search results

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

Polymer laser powder bed fusion (PBF-LB/P) is an additive manufacturing technology that is sustainable due to the possibility of recycling the powder multiple times and allowing the fabrication of gears without the aid of support structures and subsequent assembly. However, there are constraints in the process that negatively affect its adoption compared to other additive technologies such as material extrusion to produce gears. This study aims to demonstrate that it is possible to overcome the problems due to the physics of the process to produce accurate mechanism.

Technological aspects such as orientation, wheel-shaft thicknesses and degree of powder recycling were examined. Furthermore, the evolving tooth profile was considered as a design parameter to provide a manufacturability map of gear-based mechanisms.

Results show that there are some differences in the functioning of the gear depending on the type of powder used, 100% virgin or 50% virgin and 50% recycled for five cycles. The application of a groove on a gear produced with 100% virgin powder allows the mechanism to be easily unlocked regardless of the orientation and wheel-shaft thicknesses. The application of a specific evolutionary profile independent of the diameter of the reference circle on vertically oriented gears guarantees rotation continuity while preserving the functionality of the assembled mechanism.

In the literature, there are various studies on material aging and reuse in the PBF-LB/P process, mainly focused on the powder deterioration mechanism, powder fluidity, microstructure and mechanical properties of the parts and process parameters. This study, instead, was focused on the functioning of gears, which represent one of the applications in which this technology can have great success, by analyzing the two main effects that can compromise it: recycled powder and vertical orientation during construction.

Steel-reinforced concrete-filled steel tubular (SRCFST) columns have been increasingly popular in engineering practice for the columns' excellent seismic and fire performance. Significant design progress guidance has been made through continuous numerical and experimental research in recent years. This paper tested and analysed the residual loading capacity of SRCFST columns under axial loading after experiencing non-uniform ISO-834 standard fire.

The experimental research covered the main parameter of heating conditions, 1-side and 2-side fire, through two specimens. Two specimens were heated and loaded simultaneously in the furnace for 240 min. After cooling, the columns were moved to the hydraulic loading system and loaded to failure to determine the columns' residual capacity.

The experimental results indicated that the non-uniform heating area plays an essential role in the overall performance of SRCFST columns, the increasing heating area of columns results in lower residual loading capacity and stiffness. The SRCFST columns still had a high loading capacity after heating and loading in the fire.

The comparison of experimental data against design results showed that the design method generated a 16% safety margin for S2H4 and a 39% safety margin for S1H4.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.

The purpose of this study is to investigate the bending analysis of metal (Ti-6Al-4V)-ceramic (ZrO₂) functionally graded material (FGM) sandwich plate with material property gradation along length and thickness direction under thermo-mechanical loading using inverse trigonometric shear deformation theory (ITSDT). FGM sandwich plate with a ceramic core and continuous variation of material properties has been modelled using Voigt’s micro-mechanical model following the power law distribution method. The impact of bi-directional gradation of material properties over the bending response of FGM plate under thermo-mechanical loading has been investigated in this work.

In this study, gradation of material properties for FGM plates is considered along length and thickness directions using Voigt’s micromechanical model following the power law distribution method. This type of FGM is called bi-directional FGMs (BDFGM). Mechanical and thermal properties of BDFGM sandwich plates are considered temperature-dependent in the present study. ITSDT is a non-polynomial shear deformation theory which requires a smaller number of field variables for modelling of displacement function in comparison to poly-nominal shear deformation theories which lead to a reduction in the complexity of the problem. In the present study, ITSDT has been utilized to obtain the governing equations for thermo-mechanical bending of simply supported uni-directional FGM (UDFGM) and BDFGM sandwich plates. Analytical solution for bending analysis of rectangular UDFGM and BDFGM sandwich plates has been carried out using Hamilton’s principle.

The bending response of the BDFGM sandwich plate under thermo-mechanical loading has been analysed and discussed. The present study shows that centre deflection, normal stress and shear stress are significantly influenced by temperature-dependent material properties, bi-directional gradation exponents along length and thickness directions, geometrical parameters, sandwich plate layer thickness, etc. The present investigation also reveals that bi-directional FGM sandwich plates can be designed to obtain thermo-mechanical bending response with an appropriate selection of gradation exponents along length and thickness direction. Non-dimensional centre deflection of BDFGM sandwich plates decreases with increasing gradation exponents in length and thickness directions. However, the non-dimensional centre deflection of BDFGM sandwich plates increases with increasing temperature differences.

For the first time, the FGM sandwich plate with the bi-directional gradation of material properties has been considered to investigate the bending response under thermo-mechanical loading. In the literature, various polynomial shear deformation theories like first-order shear deformation theory (FSDT), third-order shear deformation theory (TSDT) and higher-order shear deformation theory (HSDT) have been utilized to obtain the governing equation for bending response under thermo-mechanical loading; however, non-polynomial shear deformation theory like ITSDT has been used for the first time to obtain the governing equation to investigate the bending response of BDFGM. The impact of bi-directional gradation and temperature-dependent material properties over centre deflection, normal stress and shear stress has been analysed and discussed.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

The purpose of this study is to explore numerical scrutinization of micropolar and Walters-B non-Newtonian fluids motion under the influence of thermal radiation and chemical reaction.

The two fluids micropolar and Walters-B liquid are considered to start flowing from the slot to the stretching sheet. A magnetic field of constant strength is imposed on their flow transversely. The problems on heat and mass transport are set up with thermal, chemical reaction, heat generation, etc. to form partial differential equations. These equations were simplified into a dimensionless form and solved using spectral homotopy analysis method (SHAM). SHAM uses the basic concept of both Chebyshev pseudospectral method and homotopy analysis method to obtain numerical computations of the problem.

The outcomes for encountered flow parameters for temperature, velocity and concentration are presented with the aid of figures. It is observed that both the velocity and angular velocity of micropolar and Walters-B and thermal boundary layers increase with increase in the thermal radiation parameter. The decrease in velocity and decrease in angular velocity occurred are a result of increase in chemical reaction. It is hoped that the present study will enhance the understanding of boundary layer flow of micropolar and Walters-B non-Newtonian fluid under the influences of thermal radiation, thermal conductivity and chemical reaction as applied in various engineering processes.

All results are presented graphically and all physical quantities are computed and tabulated.

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

Polymethyl methacrylate (PMMA) is a remarkable biocompatible material for bone cement and regeneration. It is also considered 3D printable but requires in-depth process–structure–properties studies. This study aims to elucidate the mechanistic effects of processing parameters and sterilization on PMMA-based implants.

The approach comprised manufacturing samples with different raster angle orientations to capitalize on the influence of the filament alignment with the loading direction. One sample set was sterilized using an autoclave, while another was kept as a reference. The samples underwent a comprehensive characterization regimen of mechanical tension, compression and flexural testing. Thermal and microscale mechanical properties were also analyzed to explore the extent of the appreciated modifications as a function of processing conditions.

Thermal and microscale mechanical properties remained almost unaltered, whereas the mesoscale mechanical behavior varied from the as-printed to the after-autoclaving specimens. Although the mechanical behavior reported a pronounced dependence on the printing orientation, sterilization had minimal effects on the properties of 3D printed PMMA structures. Nonetheless, notable changes in appearance were attributed, and heat reversed as a response to thermally driven conformational rearrangements of the molecules.

This research further deepens the viability of 3D printed PMMA for biomedical applications, contributing to the overall comprehension of the polymer and the thermal processes associated with its implementation in biomedical applications, including personalized implants.