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Reviews intelligent structures through surface‐ and bulk‐micromachining. Examines the merits of these techniques and their past, present and future applications to real‐life problems.

Reviews some of the more important technologies used for fabricating microcomponents and systems – bulk silicon micromachining, surface micromachining and LIGA, a process for forming deep microstructures by lithography, electroforming and moulding. Discusses the relative merits of using synchroton, electron beam and excimer laser irradiation. Gives a comb actuator and an electrostatic motor as examples of micromachined components.

Telemetry capsules have existed since the 1950s and were used to measure temperature, pH or pressure inside the gastrointestinal (GI) tract. It was hoped that these capsules would replace invasive techniques in the diagnosis of function disorders in the GI tract. However, problems such as signal loss and uncertainty of the pills position limited their use in a clinical setting. In this paper, a review of the capabilities of microelectromechanical systems (MEMS) for the fabrication of a wireless pressure sensor microsystem is presented.

The circuit requirements and methods of data transfer are examined. The available fabrication methods for MEMS sensors are also discussed and examples of wireless sensors are given. Finally, the drawbacks of using this technology are examined.

MEMS for use in wireless monitoring of pressure in the GI tract have been investigated. It has been shown that capacitive pressure sensors are particularly suitable for this purpose. Sensors fabricated for wireless continuous monitoring of pressure have been reviewed. Great progress, especially using surface micromachining, has been made in recent years. However, despite these advances, some challenges remain.

Provides a review of the capabilities of MEMS.

Resonant sensing is a high performance technique suitable for a wide range of applications. Defines the principles of resonant sensing and describes the various fabrication techniques. Details resonant sensor performance and finally gives examples of resonant sensors in use today.

Considering its vast utility in industries, this paper aims to present a detailed review on fundamentals, classification and progresses in pressure sensors, along with its wide area of applications, its design aspects and challenges, to provide state-of-the-art gist to the researchers of the similar domain at one place.

Swiftly emerging research prospects in the micro-electro-mechanical system (MEMS) enable to build complex and sophisticated micro-structures on a substrate containing moving masses, cantilevers, flexures, levers, linkages, dampers, gears, detectors, actuators and many more on a single chip. One of the MEMS initial products that emerged into the micro-system technology is MEMS pressure sensor. Because of their high performance, low cost and compact in size, these sensors are extensively being adopted in numerous applications, namely, aerospace, automobile and bio-medical domain, etc. These application requirements drive and impose tremendous conditions on sensor design to overcome the tedious design and fabrication procedure before its reality. MEMS-based pressure sensors enable a wide range of pressure measurement as per the application requirements.

The paper provides a detailed review on fundamentals, classification and progresses in pressure sensors, along with its wide area of applications, its design aspects and challenges, to provide state of the art gist to the researchers of the similar domain at one place.

The present paper discusses the basics of MEMS pressure sensors, their working principles, different design aspects, classification, type of sensing diaphragm used and illustration of various transduction mechanisms. Moreover, this paper presents a comprehensive review on present trend of research on MEMS-based pressure sensors, its applications and the research gap observed till date along with the scope for future work, which has not been discussed in earlier reviews.

To fabricate submicrometer thin membrane of silicon nitride and silicon dioxide over an anisotropically etched cavity in (100) silicon.

PECVD of silicon dioxide and Silcion nitride layers of compatible thicknesses followed by thermal annealing in nitrogen ambients at 1,000°C for 30 min, leads to stable membrane formation. Anisotropic etching of (100) silicon below the membrane through channels on the sides has been used with controlled cavity dimensions.

Lateral front side etching through channels slows down etching rate drastically. The etching mechanism has been discussed with experimental details.

Vacuum sealed cavity membranes can be realised for micro sensor applications.

The process is new and feasible for micro sensor technologies.

This paper aims to focus on the numerical modelling of 3D structure of surface micromachined (MEMS) accelerometers.

The paper focuses on the methods of mechanical design and analysis of electrostatic accelerometers (comb drive structure) and uses computer simulation procedure leading to final structure design, then to be defined as a basic structure for stress analysis.

The strategy in computer modeling of accelerometer MEMS is satisfactory in order to simulate the electromechanical characteristics of different accelerometer structures (IMEMS).

A novel complex strategy in computer modeling of accelerometer MEMS, based on solid modeling is proposed.

This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.

This paper presents our development of a novel force and force rate sensory system to advance applications in micromanipulation using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. To allow close monitoring of magnitude and direction of microforces acting on microdevices during manipulation, PVDF ploymer films are used to fabricate highly sensitive 1D and 2D sensors to detect real‐time microforce and force rate information during the manipulation process. The sensory system with a resolution in the range of sub‐micronewtons can be applied effectively to develop a technology on the force‐reflection microassembly of surface MEMS structures. In addition, a tele‐micromanipulation platform, which can be used to perform tele‐microassembly of the MEMS structures and tele‐cell‐manipulation with force/haptic feedback via Internet was also built successfully.