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Internet‐based remote assembly of micro‐electro‐mechanical systems (MEMS)

Yantao Shen (Department of Electrical and Computer Engineering, Michigan State University, Michigan, USA)
Ning Xi (Department of Electrical and Computer Engineering, Michigan State University, Michigan, USA)
King W.C. Lai (Center for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China)
Wen J. Li (Center for Micro and Nano Systems, The Chinese University of Hong Kong, Hong Kong SAR, China)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 September 2004

Abstract

This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.

Keywords

Citation

Shen, Y., Xi, N., Lai, K.W.C. and Li, W.J. (2004), "Internet‐based remote assembly of micro‐electro‐mechanical systems (MEMS)", Assembly Automation, Vol. 24 No. 3, pp. 289-296. https://doi.org/10.1108/01445150410549782

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited