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The purpose of this paper is to present a hybrid manufacturing system that integrates stereolithography (SL) and direct print (DP) technologies to fabricate three‐dimensional (3D) structures with embedded electronic circuits. A detailed process was developed that enables fabrication of monolithic 3D packages with electronics without removal from the hybrid SL/DP machine during the process. Successful devices are demonstrated consisting of simple 555 timer circuits designed and fabricated in 2D (single layer of routing) and 3D (multiple layers of routing and component placement).

A hybrid SL/DP system was designed and developed using a 3D Systems SL 250/50 machine and an nScrypt micro‐dispensing pump integrated within the SL machine through orthogonally‐aligned linear translation stages. A corresponding manufacturing process was also developed using this system to fabricate 2D and 3D monolithic structures with embedded electronic circuits. The process involved part design, process planning, integrated manufacturing (including multiple starts and stops of both SL and DP and multiple intermediate processes), and post‐processing. SL provided substrate/mechanical structure manufacturing while interconnections were achieved using DP of conductive inks. Simple functional demonstrations involving 2D and 3D circuit designs were accomplished.

The 3D micro‐dispensing DP system provided control over conductive trace deposition and combined with the manufacturing flexibility of the SL machine enabled the fabrication of monolithic 3D electronic structures. To fabricate a 3D electronic device within the hybrid SL/DP machine, a process was developed that required multiple starts and stops of the SL process, removal of uncured resin from the SL substrate, insertion of active and passive electronic components, and DP and laser curing of the conductive traces. Using this process, the hybrid SL/DP technology was capable of successfully fabricating, without removal from the machine during fabrication, functional 2D and 3D 555 timer circuits packaged within SL substrates.

Results indicated that fabrication of 3D embedded electronic systems is possible using the hybrid SL/DP machine. A complete manufacturing process was developed to fabricate complex, monolithic 3D structures with electronics in a single set‐up, advancing the capabilities of additive manufacturing (AM) technologies. Although the process does not require removal of the structure from the machine during fabrication, many of the current sub‐processes are manual. As a result, further research and development on automation and optimization of many of the sub‐processes are required to enhance the overall manufacturing process.

A new methodology is presented for manufacturing non‐traditional electronic systems in arbitrary form, while achieving miniaturization and enabling rugged structure. Advanced applications are demonstrated using a semi‐automated approach to SL/DP integration. Opportunities exist to fully automate the hybrid SL/DP machine and optimize the manufacturing process for enhancing the commercial appeal for fabricating complex systems.

This work broadly demonstrates what can be achieved by integrating multiple AM technologies together for fabricating unique devices and more specifically demonstrates a hybrid SL/DP machine that can produce 3D monolithic structures with embedded electronics and printed interconnects.

With India becoming world’s second largest user of smartphones (Ming, 2017) and with more users adopting mobile devices for online shopping, Indian online retailers now have to manage mobile channel in addition to existing traditional channel (of computers). Hence, the purpose of this study is to investigate the mapping of product characteristics with individual channel capabilities and its effect on online consumer behaviour, so that e-tailers can create enhanced online shopping experience for consumers.

A comprehensive research model is developed on the basis of the knowledge gained from multichannel retailing and e-commerce literature. Then, the model is empirically tested, with primary data collected from 344 customers, using structural equation modelling. The data are collected from customers across two product categories: electronics and fashion.

The results reveal that perceived usefulness, perceived risk and perceived self-efficacy are important drivers of online consumer behaviour for continued usage. The multi-group analysis confirms the moderation influence of platform type for some relationships across electronics and fashion.

The findings underline the importance of multichannel complementarity across electronics and fashion. The preference of mobile devices for fashion and traditional devices such as computers for electronics provides valuable insights for online retailers towards management of multichannel e-commerce ecosystem.

In Indian context, this is the first empirical research on online multichannel retail setting, studying the impact of diverse channel formats on different product categories. The study’s findings give empirical basis to online retailers to look out for right product–channel fit strategy for engaging consumers in the long run.

Forecasting product returns plays an important role in the operations of reverse logistics (RL). However, their contribution to sustainability performance is yet to be explored. The purpose of this paper is to explore the product returns in Indian electronics industry and examine the relationship of forecasting product returns with triple bottom line performance of RL.

In this study, based on past literature review, four hypotheses, relating to forecasting of product returns and its association with performance, were developed. A questionnaire was sent to 700 respondents from the Indian electronics industry. Overall, 208 received responses were found suitable for the research. The necessary statistical analysis was carried out to ensure the reliability and validity of the questionnaire. In order to test different hypotheses, partial least square path modelling (PLSPM) technique of structural equation modeling was utilized.

Measurement model had shown sufficient data fit for the modeling. PLSPM results reveal that the accuracy in forecasting product returns is positively associated with operational performance of RL. It also plays an important role in the sustainability efforts of an organization.

Managers can utilize results of study for exploring and emphasizing issues of product returns for improving RL performance. One of the limitations is that data are collected only from Indian electronics industry. Another limitation is that only product returns are considered for the operational and TBL performance of RL. In future, study may be carried out considering different factors in other sectors and countries.

The intent of forecasting product returns is considered to be operational efficiency. It can make significant contributions to the sustainability efforts of an organization. Review of the past literature indicates that research in the field of RL is in developing stage, and issues related to forecasting product returns are under-represented. The paper adds value to the few available articles on product returns.

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.

This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.

This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10⁻⁸ Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.

The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

This paper aims to identify the antecedents of firm’s supply chain agility (SC agility) and how SC agility impacts on firm’s performance.

Based on a comprehensive literature review, a conceptual model was proposed, in which the interrelated hypotheses were tested by structural equation modelling methodology using a dataset collected from 266 Chinese electronics firms.

Initially, it was found that SC integration and external learning positively influenced SC agility. Second, the results indicated that firm’s performance is positively impacted by SC agility. Moreover, SC agility also fully mediated the effect of SC integration on firm’s performance and the effect of external learning on firm’s performance.

The generalizability of this research sample might be the major limitation of this study. Therefore, future research can adopt other industry sectors samples, such as automobile manufacturing, or other country samples to validate the research model.

This research outlines strategies for better preparedness to achieve SCs to be agile which is a core competency of electronic firms in emerging market. Findings reveal that the external coordination practices – external learning and SC integration – are important factors of SC agility. In addition, the findings contribute to understanding the important role of SC agility in improving firm’s performance.

This research examines the impact of two antecedents (i.e. SC integration and external learning) on SC agility and is the first empirical research to analyze the mediation effect of SC agility on the relationship between SC integration and firm performance and the relationship between external learning and firm performance.

This study aims to combine the literature on green marketing and relationship marketing into a new managerial framework of green trust. In addition, this study seeks to elaborate the relationships among green perceived quality, green perceived risk, green satisfaction, and green trust.

The research object of this paper focuses on Taiwan's consumers who have the purchase experience of information and electronics products. This study undertakes an empirical study by means of the questionnaire survey method. The questionnaires were randomly mailed to consumers who had the purchase experience of information and electronics products. Structural equation modeling (SEM) is applied to test the research framework.

The empirical results indicate that green perceived quality would positively affect green satisfaction and green trust, whereas green perceived risk would negatively influence both of them. In addition, this study points out that the relationships between green trust and its two antecedents – green perceived quality and green perceived risk – are partially mediated by green satisfaction. Hence, investing resources in the increase of green perceived quality and the decrease of green perceived risk is useful to enhance green satisfaction and green trust.

Although previous research has explored the relevant issues about trust, none highlights trust about green or environmental issues from the perspectives of perceived quality and perceived risk. This study proposes a research framework, which can help companies enhance their green trust via its three determinants: green perceived quality, green perceived risk, and green satisfaction.

The purpose of this paper is to rank the importance of the critical success factors (CSFs) for best practices in technology product development in the Thailand electronics industry and to determine the relationships between these factors in terms of their impact on project success.

Interviews with experts and a review of past studies are used to design an instrument for data collection. A case analysis is conducted to classify CSFs. Interpretive structural modeling (ISM) methodology is applied to analyze CSFs and investigate their relationships.

The authors identified 14 “driving” and “dependent” factors, which were then classified into four factor categories: linkage, autonomous, dependent, or independent factors. The results show that strategic alignment was the most significant CSF. Three factors which had a high driving power and were less dependent on others were: follow-up work, co-ordination, and relationships with clients.

The results may inform and assist technology project management in the little understood business cultures of the developing world. These finding may allow practitioners to prioritize the factors that drive project success when allocating their limited resources.

This research contributes to the field of project management by identifying the relative importance of the CSFs which enhance the management of technology projects. Despite the abundance of studies on CSFs, their importance has still not been fully explained. The findings provide insights into the degree of importance of the factors and their interdependencies, which can either drive or undermine project success. In addition, the ISM methodology the authors used is a unique approach in the project management field.

This paper investigates how companies become resilient to supply chain (SC) piracy through using transactional and relational governance mechanisms to develop strategies effective in environments characterized by weak regulative institutions and mistrust.

This study developed case studies of nine large manufacturers with operations in Brazil.

The companies employed transactional and relational governance mechanisms to learn from past incidents, anticipate, and respond to the threat of SC piracy, becoming more resilient over time. Transactional governance mechanisms reduced risk triggers through technology, while relational governance mechanisms enhanced trust between SC and non-SC members, allowing the members to build social capital.

The authors provide practical guidance for managers and policymakers in developing risk management strategies based on technology and collaboration to reduce SC piracy in environments characterized by mistrust.

SC piracy is a serious problem for global operations and SCs in many low-cost manufacturing locations. Besides the cost and service level consequences, the authors also highlight worker safety consequences, including the potential for kidnapping, psychological trauma, injuries, and death.

This study focuses on the little-researched topic of SC piracy. The authors examine the negative effects of a weak institutional environment, while most prior research focuses on the positive effects of a strong institutional environment. The authors position transactional and relational governance mechanisms as essential elements of SC risk resilience.

This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined “internal” thick laminates will be suitable for embedding components in the direction of the axis “z,” i.e. this method of manufacturing multilayer laminates can be used for incoming miniaturization in electronics.

Laminates with a low glass transition temperature (Tg) and high Tg with E-glass type were treated, tested and compared. Testing samples were manufactured by nonstandard two steps unidirectional lamination as a multilayer structure based on prepreg layers and as “a sandwich structure” to explore its effect on thermo-mechanical properties. The proposed tested method determines the time and temperature-dependent viscoelastic properties of the board by using dynamic mechanical analysis, thermo-mechanical analysis and three-point bend tests.

This testing method was chosen because the main property that promotes sandwich structure is their high stiffness. Glass/epoxy stiff and thermal stabile sandwich structure prepared by nonstandard two-stage lamination is proper for embedding components and the next miniaturization in electronics.

Compared with by-default applied glass-reinforced homogenous laminates, novel architecture sandwich structure is attractive because of a combination of strength, stiffness and all while maintaining the miniaturization requirement and multifunctional application in electronics.

This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics.

This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials.

The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die.

This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.