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1 – 10 of 181
Article
Publication date: 7 June 2019

Jakub Krzeminski, Bartosz Blicharz, Andrzej Skalski, Grzegorz Wroblewski, Małgorzata Jakubowska and Marcin Sloma

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly…

Abstract

Purpose

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.

Design/methodology/approach

This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.

Findings

This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.

Originality/value

The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

Details

Circuit World, vol. 45 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 5 May 2015

Martin Joseph Guillot and Steve C McCool

The purpose of this paper is to investigate the effect of numerical boundary condition implementation on local error and convergence in L2-norm of a finite volume discretization…

Abstract

Purpose

The purpose of this paper is to investigate the effect of numerical boundary condition implementation on local error and convergence in L2-norm of a finite volume discretization of the transient heat conduction equation subject to several boundary conditions, and for cases with volumetric heat generation, using both fully implicit and Crank-Nicolson time discretizations. The goal is to determine which combination of numerical boundary condition implementation and time discretization produces the most accurate solutions with the least computational effort.

Design/methodology/approach

The paper studies several benchmark cases including constant temperature, convective heating, constant heat flux, time-varying heat flux, and volumetric heating, and compares the convergence rates and local to analytical or semi-analytical solutions.

Findings

The Crank-Nicolson method coupled with second-order expression for the boundary derivatives produces the most accurate solutions on the coarsest meshes with the least computation times. The Crank-Nicolson method allows up to 16X larger time step for similar accuracy, with nearly negligible additional computational effort compared with the implicit method.

Practical implications

The findings can be used by researchers writing similar codes for quantitative guidance concerning the effect of various numerical boundary condition approximations for a large class of boundary condition types for two common time discretization methods.

Originality/value

The paper provides a comprehensive study of accuracy and convergence of the finite volume discretization for a wide range of benchmark cases and common time discretization methods.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 25 no. 4
Type: Research Article
ISSN: 0961-5539

Keywords

Content available
Article
Publication date: 22 June 2012

204

Abstract

Details

Soldering & Surface Mount Technology, vol. 24 no. 3
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 17 August 2012

John Ling

195

Abstract

Details

Circuit World, vol. 38 no. 3
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 27 July 2012

John Ling

251

Abstract

Details

Microelectronics International, vol. 29 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 17 August 2012

145

Abstract

Details

Circuit World, vol. 38 no. 3
Type: Research Article
ISSN: 0305-6120

Content available
Article
Publication date: 27 July 2012

John Ling

179

Abstract

Details

Microelectronics International, vol. 29 no. 3
Type: Research Article
ISSN: 1356-5362

Content available
Article
Publication date: 22 June 2012

107

Abstract

Details

Soldering & Surface Mount Technology, vol. 24 no. 3
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 6 January 2012

321

Abstract

Details

Pigment & Resin Technology, vol. 41 no. 1
Type: Research Article
ISSN: 0369-9420

Article
Publication date: 1 August 2023

Dhinesh S.K. and Senthil Kumar Kallippatti Lakshmanan

The purpose of this study is to increasing the gauge factor, reducing the hysteresis error and improving the stability over cyclic deformations of a conductive polylactic acid…

Abstract

Purpose

The purpose of this study is to increasing the gauge factor, reducing the hysteresis error and improving the stability over cyclic deformations of a conductive polylactic acid (CPLA)-based 3D-printed strain sensor by modifying the sensing element geometry.

Design/methodology/approach

Five different configurations, namely, linear, serpentine, square, triangular and trapezoidal, of CPLA sensing elements are printed on the thermoplastic polyurethane substrate material individually. The resistance change ratio of the printed sensors, when loaded to a predefined percentage of the maximum strain values over multiple cycles, is recorded. Finally, the thickness of substrate and CPLA and the included angle of the triangular strain sensor are evaluated for their influences on the sensitivity.

Findings

The triangular configuration yields the least hysteresis error with high accuracy over repeated loading conditions, because of its uniform stress distribution, whereas the conventional linear configuration produces the maximum sensitivity with low accuracy. The thickness of the substrate and sensing element has more influence over the included angle, in enhancing the sensitivity of the triangular configuration. The sensitivity of the triangular configuration exceeds the linear configuration when printed at ideal sensor dimensional values.

Research limitations/implications

The 3D printing parameters are kept constant for all the configurations; rather it can be varied for improving the performance of the sensor. Furthermore, the influences of stretching rate and nozzle temperature of the sensing material are not considered in this work.

Originality/value

The sensitivity and accuracy of CPLA-based strain sensor are evaluated for modification in its geometry, and the performance metrics are enhanced using the regression modelling.

Details

Rapid Prototyping Journal, vol. 29 no. 9
Type: Research Article
ISSN: 1355-2546

Keywords

1 – 10 of 181