To read the full version of this content please select one of the options below:

Photonic curing of silver paths on 3D printed polymer substrate

Jakub Krzeminski (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)
Bartosz Blicharz (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)
Andrzej Skalski (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)
Grzegorz Wroblewski (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)
Małgorzata Jakubowska (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)
Marcin Sloma (Institute of Metrology and Biomedical Engineering, Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland)

Circuit World

ISSN: 0305-6120

Article publication date: 7 June 2019

Issue publication date: 7 June 2019

Abstract

Purpose

Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate.

Design/methodology/approach

This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques.

Findings

This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications.

Originality/value

The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

Keywords

Acknowledgements

This research is part of the “Functional heterophase materials for structural electronics” project carried out within the First TEAM/2016-1/7 program of the Foundation for Polish Science, co-financed by the European Union under the European Regional Development Fund and part of the Warsaw University of Technology, Faculty of Mechatronics, Institute of Metrology and Biomedical Engineering Fund.

Citation

Krzeminski, J., Blicharz, B., Skalski, A., Wroblewski, G., Jakubowska, M. and Sloma, M. (2019), "Photonic curing of silver paths on 3D printed polymer substrate", Circuit World, Vol. 45 No. 1, pp. 9-14. https://doi.org/10.1108/CW-11-2018-0084

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited