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The purpose of this paper is to improve the accuracy and signal-to-noise ratio (SN) of a crop nitrogen sensor.

The accuracy and wide adaptability of two spectral calibration methods for a crop nitrogen sensor based on standard reflectivity gray plates and standard detector, respectively, were compared.

The calibration method based on standard detector could significantly improve the measurement accuracy and the SN of this crop nitrogen sensor. When compared with the method based on standard gray plates, the measurement accuracy and the SN of the crop nitrogen sensor calibrated based on the standard detector method improved by 50 and 10 per cent, respectively.

This research analysed the calibration problems faced by the crop nitrogen sensor (type CGMD302) based on standard gray plates, and proposed a sensor calibration method based on a standard detector. Finally, the results of the two calibration methods were compared in terms of measurement accuracy and the SN of the crop nitrogen sensor.

The purpose of this paper is to summarize the advances in grey system theory research and various application achievements in science and engineering. At the same time, it commemorates the 40th anniversary of the birth of grey system theory and the 10th anniversary of Grey Systems–Theory and Application.

Firstly, the innovations of theoretical research in grey system theory were summarized and some of the widely recognized new results are briefly described. By searching and combing the research results of grey system theory in China national knowledge infrastructure (CNKI) database and Web of Science by Institute for Scientific Information (ISI), this paper shows the rapid development trend of grey system theory in the past 40 years, and the successful applications of grey system theory in the fields of social sciences, natural sciences and engineering technologies.

More than 227 thousands literature were found by input 10 phrases such as grey system, grey number and sequence operator etc. in CNKI database. After entering the new century, the number of grey system papers included in CNKI database is increasing rapidly. Since 2008, more than 10 thousands papers have been included per year and more than 15 thousands papers have been included per year since 2014. Grey system method and model are widely used in physics, chemistry, biology and other fields of natural science, as well as transportation, electric power, machinery and other fields of engineering technology, and a large number of valuable results have been achieved.

It can be seen that the grey system theory plays an important role in promoting China’s scientific and technological progress, innovation and development and high-level talent training from tens of thousands of literatures marked with important national science and technology projects and a large number of grey system literatures published by China’s double first-class universities and double first-class discipline construction universities.

Both innovations of theoretical research and practical application play important role in the growth of new theory. The innovations of theoretical research provide methods and tools for practical application, which is conducive to improve application efficiency and broaden application fields. A large number of practical applications needs have become the source of theoretical innovation and the solid background for the birth of theoretical innovation achievements.

In the process of continuous casting and rolling of steel plate, due to the influence of rolling equipment and process, there are scratches, inclusions, patches, scabs and pitted surfaces on the surface of steel plate, which will not only affect the corrosion resistance, wear resistance and fatigue strength of steel plate but also may cause production accidents. Therefore, the detection of steel plate surface defect must be strengthened to ensure the production quality of steel plate and the smooth development of industrial construction.

(1) A steel plate surface defect detection technology based on small datasets is proposed, which can detect multiple surface defects and fill in the blank of scab defect detection. (2) A detection system based on intelligent recognition technology is built. The steel plate images are collected by the front-end monitoring device, then transmitted to the back-end monitoring center and processed by the embedded intelligent algorithms. (3) In order to reduce the impact of external light on the image, an improved Multi-Scale Retinex (MSR) enhancement algorithm based on adaptive weight calculation is proposed, which lays the foundation for subsequent object segmentation and feature extraction. (4) According to the different factors such as the cause and shape, the texture and shape features are combined to classify different defects on the steel plate surface. The defect classification model is constructed and the classification results are recorded and stored, which has certain application value in the field of steel plate surface defect detection. (5) The practicability and effectiveness of the proposed method are verified by comparison with other methods, and the field running tests are conducted based on the equipment commissioning field of China Heavy Machinery Institute.

When applied to small dataset, the precision of the proposed method is 94.5% and the time is 23.7 ms. In order to compare with deep learning technology, after expanding the image dataset, the precision and detection time of this paper are 0.948 and 24.2 ms, respectively. The proposed method is superior to other traditional image processing and deep learning methods. And the field recognition precision is 91.7%.

In brief, the steel plate surface defect detection technology based on computer vision is effective, but the previous attempts and methods are not comprehensive and the accuracy and detection speed need to be improved. Therefore, a more practical and comprehensive technology is developed in this paper. The main contributions are as follows: (1) A steel plate surface defect detection technology based on small datasets is proposed, which can detect multiple surface defects and fill in the blank of scab defect detection. (2) A detection system based on intelligent recognition technology is built. The steel plate images are collected by the front-end monitoring device, then transmitted to the back-end monitoring center and processed by the embedded intelligent algorithms. (3) In order to reduce the impact of external light on the image, an improved MSR enhancement algorithm based on adaptive weight calculation is proposed, which lays the foundation for subsequent object segmentation and feature extraction. (4) According to the different factors such as the cause and shape, the texture and shape features are combined to classify different defects on the steel plate surface. The defect classification model is constructed and the classification results are recorded and stored, which has certain application value in the field of steel plate surface defect detection. (5) The practicability and effectiveness of the proposed method are verified by comparison with other methods, and the field running tests are conducted based on the equipment commissioning field of China Heavy Machinery Institute.

This study aims at investigating the effect of bolt hole-making processes on the post-fire behavior of S235 steel plates.

A total of nine steel plates with a single bolt hole are tested. The single bolt holes are fabricated using three different hole-making processes: drilling, waterjet and plasma. Among the nine steel plates, three fabricated specimens are control specimens and are tested at ambient temperature. The six remaining steel plates with a single bolt hole are subjected to a complete heating-cooling cycle and then monotonically loaded until failure. The six fabricated specimens are first heated up to two different temperatures 800 and 925 °C, and then cooled back to the ambient prior to loading.

The results show that after being exposed to post-fire temperatures (800 and 925 °C), the maximum decrease in strength of the S235 steel plate was 6% (at 925 °C), 14% (at 925 °C) and 22% (at 800 °C) when compared to the results of ambient specimens for waterjet, drilled and plasma bolt holes, respectively. For post-fire temperature tests, drilled and waterjet bolt hole-making processes result in having approximately the same load-displacement response, and both have larger strength and ductility than those obtained using plasma cutting.

This study provides preliminary data to guide the steel designers and fabricators in choosing the most suitable hole-making process for fire applications and to quantify the post-fire reduction in capacity of S235 plates.

This paper aims to investigate the effects of the pia matter on cerebral cortical folding.

A three-layer buckling simulation model composited by the white matter, gray matter and the pia matter is adopted to analyze the effect of the pia matter on cortical folding. The volume growth of brain tissues is simulated using thermal expansion. The effects of the pia matter growth rate, thickness and stiffness on cortical folding is investigated.

The simulation results show that all of these three aforementioned factors of pia matter have obvious effects on cerebral cortical folding. Especially, the thickening of the pia matter may lead to cortical folding malformation such as polymicrogyria, which is in good agreement with the recent reported anatomical findings.

The three-layer model in this paper composited by the white matter, gray matter and the pia matter is different from the usually used two-layer model only composited by the white matter and gray matter. This three-layer model has successfully validated the effect of the pia matter on cerebral cortical folding. The simulation results can explain the anatomical findings very well.

The tenting of via holes has been a controversial issue in the military arena for several years. This issue has gained importance with MIL‐STD‐2000's requirement that all circuitry and vias under components be coated to preclude entrapment of flux. This paper addresses this issue by evaluating the MIL‐Spec thermal shock reliability of solder mask as a hole fill material and as a via tent cover. The relationship of via hole to pad size on tent reliability and solder mask thickness is also investigated. This paper concludes that solder mask as a hole fill material will not pass military thermal shock requirements and that standard dry film solder mask is very sensitive to via hole and pad dimensions. The thinner and more flexible high conformance solder mask is the only material capable of passing MIL‐Spec thermal shock requirements for all via hole to pad relationships.

ONCE upon a time, in the true spirit of fairy stories, it was our job to get fewer people to produce more of whatever they were making. It certainly did not make us popular. There were times when the appearance of a work study engineer in any factory was enough to start off a strike. Even the best regulated workers were known to slow down deliberately if only to give them and their mates some leeway when the “rate for the job” (whether the pay rate or production rate) was under consideration.

Nowadays, in building structures, dampers are connected to the building structure to reduce the damages caused by seismicity in addition to enhancing structural stability, and to connect dampers with the structure, joints are used. In this paper, three different configurations of double-lap joints were designed, developed and tested.

This paper aims to analyze three different categories of double-lap single-bolted joints that are used in connecting dampers with concrete and steel frame structures. These joints were designed and tested using computational, numerical and experimental methods. The studies were conducted to examine the reactions of the joints during loading conditions and to select the best joints for the structures that allow easy maintenance of the dampers and also withstand structural deformation when the damper is active during seismicity. Also, a computational analysis was performed on the designed joints integrated with the M25 concrete beam column junction. In this investigation, experimental study was carried out in addition to numerical and computational methods during cyclic load.

It was observed from the result that during deformation the double-base multiplate lap joint was suitable for buildings because the deformations on the joint base was negligible when compared with other joints. From the computational analysis, it was revealed that the three double joints while integrated with the beam column junction of M25 grade concrete structure, the damages induced by the double-base multiplate joint was negligible when compared with other two joints used in this study.

To prevent the collapse of the building during seismicity, dampers are used and further connecting the damper with the building structures, joints are used. In this paper, three double-lap joints in different design configuration were studied using computational, numerical and experimental techniques.

Radiative heat transfer in the laminar boundary layer flow of an absorbing, emitting and anisotropically scattering gray fluid over a flat plate, with the surface of the plate reflecting radiation in diffuse‐cum‐specular fashion is analyzed. The discrete ordinates method is used to model the radiative transfer. The governing dimensionless momentum and energy equations, in the form of a partial differential system, are solved by a finite difference method. The effect of various parameters like, emittance, the degree of anisotropy in scattering, scattering albedo and the nature of surface reflection on the total heat flux from the plate to the fluid are studied and results are presented.

Lapping is a vital flattening process to improve the quality of processed semiconductor wafers such as single-crystal sapphire wafers. This study aims to optimise the lapping process of the fixed-abrasive lapping plate of sapphire wafers with good overall performance [i.e. high material removal rate (MRR), small surface roughness (Ra) of the wafers after lapping and small lapping plate wear ratio (η)].

The influence of process parameters such as lapping time, abrasive size, abrasive concentration, lapping pressure and lapping speed on MRR, Ra and η of lapping-processed sapphire wafers was studied, and the results were combined with experimental data to establish a regression model. The multi-evaluation index optimisation problem was transformed into a single-index optimisation problem via an entropy method and the grey relational analysis (GRA) to comprehensively evaluate the performance of each parameter.

The results revealed that lapping time, abrasive size, abrasive concentration, lapping pressure and lapping speed had different influence degrees on MRR, Ra and η. Among these parameters, lapping time, lapping speed and abrasive size had the most significant effects on MRR, Ra and η, and the established regression equations predicted the response values of MRR, Ra and η to be 99.56%, 99.51% and 93.88% and the relative errors between the predicted and actual measured values were <12%, respectively. With increased lapping time, MRR, Ra and η gradually decreased. With increased abrasive size, MRR increased nearly linearly, whereas Ra and η initially decreased but subsequently increased. With an increase in abrasive concentration, MRR, Ra and η initially increased but subsequently decreased. With increased lapping pressure, MRR and η increased nearly linearly and continuously, whereas Ra decreased nearly linearly and continuously. With increased lapping speed, Ra initially decreased sharply but subsequently increased gradually, whereas η initially increased sharply but subsequently decreased gradually; however, the change in MRR was not significant. Comparing the optimised results obtained via the analysis of influence law, the parameters optimised via the entropy method and GRA were used to obtain sapphire wafers lapping with an MRR of 4.26 µm/min, Ra of 0.141 µm and η of 25.08, and the lapping effect was significantly improved.

Therefore, GRA can provide new ideas for ultra-precision processing and process optimisation of semiconductor materials such as sapphire wafers.