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FOV splicing optical remote sensing instruments have a strict requirement for the focal length consistency of the lens. In conventional optical-mechanical structure design, each optical element is equally distributed with high accuracy and everyone must have a high machining and assembly accuracy. For optical remote sensors with a large number of optical elements, this design brings great difficulties to lens manufacture and alignment.

Taking the relay lens in an optical remote sensing instrument with the field of view splicing as an example, errors of the system are redistributed to optical elements. Two optical elements, which have the greatest influence on modulation transfer function (MTF) of the system are mounted with high accuracy centering and the other elements are fixed by gland ring with common machining accuracy. The reduction ratio consistency difference among lenses is compensated by adjusting the optical spacing between the two elements.

Based on optical system simulation analysis, the optimized structure can compensate for the difference of reduction ratio among lens by grinding the washer thickness in the range of ±0.37 mm. The test data for the image quality of the lens show that the MTF value declined 0.043 within ±0.4 mm of space change between two barrels. The results indicate that the reduction ratio can be corrected by adjusting the washer thickness and the image quality will not obviously decline.

This paper confirms that this work is original and has not been published elsewhere nor is it currently under consideration for publication elsewhere. In this paper, the optimum structural design of the reduction relay lens for the field of view stitching applications is reported. The method of adjusting washer thickness is applied to compensate for the reduction ratio consistency difference of lenses. The optimized structure also greatly reduces the difficulty of lenses manufacture, alignment and improves the efficiency of assembly.

To characterise the optical performance of organic multi‐mode optical waveguides integrated with printed circuit board (PCB) and to demonstrate the feasibility of 2.5 and 10 Gbps optical interconnection in board‐level, respectively.

This paper provides both qualitative and quantitative approaches for the characterization the wave guide performance, i.e. using loss measurement, optical beam profiling, ethernet verification, and eye‐diagram testing. In addition to wave guide loss measurement, the most significance part of the work reported in this paper is to evaluate optical wave guides with coupled VCSELs, by which a 3 dB coupling design budget can thus be identified. Furthermore, by artificially manipulating coupling conditions, practical concerns of EOPCB integration, including waveguide geometry, VCSEL driving power, alignment tolerance, coupling spacing, etc. are studied.

Thermal stability studies related to PCB lamination processes show the feasibility of organic waveguides integrated to traditional PCB manufacturing. For a direct VCSEL/PD coupling scheme, a 3 dB power budget is experimentally identified. For short reach optical interconnection, 10 Gbps up to 17 cm propagation on PCB can be achieved by using 50×50 μm multi‐mode organic waveguides, where a±25 μm tolerance of optical alignment is compatible to the design rules of PCB.

The value of the paper lies in its systematic approaches to identify the waveguide performance through both qualitative and quantitative indices. The correlation between geometry design, processes, coupling conditions, and optical performance of organic waveguides explored in detail. Not only is a standard eye‐diagram test used to verify the waveguide at 2.5 and 10 Gbps bandwidth, but also a prototype of optical data‐communication on giga‐ethernet is demonstrated for long term stability. Following these analytical methods, readers can understand more about the optical performance of waveguides when designing optical interconnection for high speed electro‐optical integrated PCBs.

To present work and characterisation results from a project to develop a pluggable optical connector for board to board interconnect.

An optical backplane connection system is described, which allows for repeatable docking and undocking of an active optical interface housed on a daughtercard to waveguides fabricated on an optical backplane.

The optical backplane connection system described has demonstrated its successful implementation with respect to optical data transfer across multimode polymer waveguides. Measurement results presented show that such a system is a viable approach toward the application of pluggable optical backplane interconnects.

The direct connection to the exposed waveguide interface results in considerable optical loss and scattering. Future designs will have to address this. Additional work should also be undertaken to develop a means of connector engagement that is autonomous and requires no user intervention.

Prior research into the problem of coupling to an optical backplane has been concerned with interfaces that deflect optical signals by 90° into and out of the waveguides. Here, an alternative approach is proposed that launches light directly into the waveguide ends.

In the last few years many new types of light‐guiding optical film structures have been developed. Several applications have been published in the field of optical and optoelectronic integrated circuits, sensor‐elements, etc. The basic component of these systems is the optical waveguide which can be realised with optical fibres or fabricated as a layer structure from different dielectrics and many kinds of glasses. The purpose of this paper is to describe some problems and solutions of optical waveguide thick film manufacturing and also connecting techniques with optical fibres.

High density interconnect (HDI) printed circuits are now being designed in ever‐increasing quantities for very high‐speed applications. The challenge of opto‐electronics and integration of photonics into the printed circuit has started to take off. In the next 7 years, expectations are that photonic printed circuit boards will grow to a $2.5 billion industry. This paper looks at the issues, materials and current processes being researched by European, Japanese and North American organizations to create this integrated opto‐electronic circuit board. In addition to reviewing the global players in polymer photonics, this paper will review the current programs of four of the six groups globally, namely EOBC‐OptoFoil (University of Ulm, Fraunhafer Inst., Daimler‐Chrysler, Siemens), PolyGuide (Dupont, HP), TOPCat (NIST, 3M, Goodyear), Truemode™ (Terahertz), NTT and JIEP.

The purpose of this paper is to provide a detailed review of radiation dosimetry techniques based on optical fibre dosimeters. It presents a comprehensive bibliography of the current research activities in the area.

A range of published work on optical fibre radiation dosimeters are presented, with the merits and limitations discussed. Each radiation dosimetry technique is discussed in turn, providing examples of dosimeters using such techniques reviewed. The main focus is on gamma radiation although other radiation dosimeters are considered.

This paper provides information on the wide range of research activity into radiation dosimeters. The dose ranges of these dosimeters are presented, along with the advantages and disadvantages of different dosimetry techniques.

A comprehensive review of published research in the area of solid radiation dosimetry is presented in this paper. It provides an individual with a review of the various techniques used and most recent research in that field.

To review and explore optical fiber and carbon nanotube (CNT) as prospective alternatives to copper in VLSI interconnections.

As the technology moves to deep submicron level, the interconnect width also scales down. Increasing resistivity of copper with scaling and rising demands on current density drives the need for identifying new wiring solutions. This paper explores various alternatives to copper. Metallic CNTs, optical interconnects are promising candidates that can potentially address the challenges faced by copper.

Although, the theoretical aspects proves CNTs and optical interconnect to be better alternative against copper on the ground of performance parameters such as power dissipation, switching delay, crosstalk. But copper would last for coming decades on integration basis.

This paper reviews the state‐of‐the‐art in CNT interconnect and optical interconnect research; and discusses both the advantages and challenges of these emerging technologies.

The paper describes a new electro‐optical board technology, based on the discrete wiring principle. Isolated copper wires are embedded in the circuit board to realise the electrical interconnections. Glass optical fibres are embedded to obtain optical interconnections. The technology allows for crossovers and for electrical and optical interconnections on one layer of interconnection. As the technology can be applied on the level of package or multichip module, circuit board and backpanel, it has the ability to offer a complete solution for chip to chip electrical and optical interconnections. The paper will describe the basic manufacturing technology of the boards. The benefits of the technology from a system designer's viewpoint will be addressed. The problem of coupling light in and out of the embedded optical fibres will be discussed and the realisation of a first on‐board optical link via embedded optical fibres will be described.

This paper gives a brief overview of requirements within the aerospace market sector for which optical sensors are of potential benefit, and goes on to describe sensors currently under development at Lucas Electrical and Electronic Systems which are primarily intended to meet some of these requirements. These sensors, based on the combination of silicon micromachining and optical sensing technologies, are sufficiently robust to provide the capability of directly measuring on‐engine parameters such as pressure and temperature. In association with FADEC‐mounted interface units, to which the sensor heads are coupled via optical fibre links, the sensors have the potential to provide measurement data for a number of aero‐engine control requirements.

This paper seeks to develop a reliable and computationally efficient method for estimating and predicting large‐amplitude optical flows via taking into consideration their coherence along the time dimension.

Although the differential‐based techniques for estimating optical flows have long been in wide use owing to the relative simplicity of their mathematical description, their applicability is known to be limited to the situations, when the optical flow has a relatively small norm. In order to extend such method to deal with large‐amplitude optical flows, it is proposed to model the optical flow as a composition of its time‐delayed version and a complementary optical flow. The former is used to predict the current optical flow and, subsequently, to warp forward the preceding image of the tracking sequence, while the latter accounts for the residual displacements that are estimated using Kalman filtering based on the “small norm” assumption.

The study shows that taking into consideration the temporal coherence of optical flows results in considerable improvement in the quality of their estimation in the case when the amplitude of the optical flow is relatively large and, hence, the “small norm” assumption is not applicable.

In the present work, the algorithm is formulated under the assumption that the optical flow is affine. This assumption may be restrictive in practice. Consequently, an important direction to extend this work is to consider more general classes of optical flows.

The main contribution of the present study is the use of multigrid methods and a projection scheme to relate the state equation to the apparent image motion.