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Immersion, Non‐electrolytic Tin/lead Plating Process

E.C. Couble (Shipley Company Inc., Newton, Massachusetts, USA)
O.B. Dutkewych (Shipley Company Inc., Newton, Massachusetts, USA)
S.M. Florio (Shipley Company Inc., Newton, Massachusetts, USA)
M.V. Marsh (Shipley Company Inc., Newton, Massachusetts, USA)
R.F. Staniunas (Shipley Company Inc., Newton, Massachusetts, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 April 1992



The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodeposition/selective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tin/lead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantially enhanced. Solderability is improved because of a thick, flat, co‐planar and uniform tin/lead deposit on all copper surfaces. Typical thickness and composition of the fused alloy are 150 to 300 microinches (4 to 8 microns) and 65 to 75% tin.


Couble, E.C., Dutkewych, O.B., Florio, S.M., Marsh, M.V. and Staniunas, R.F. (1992), "Immersion, Non‐electrolytic Tin/lead Plating Process", Circuit World, Vol. 19 No. 1, pp. 63-70.




Copyright © 1992, MCB UP Limited

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