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Microscale metal additive manufacturing of multi‐component medical devices

Adam Cohen (Microfabrica Inc., Van Nuys, California, USA)
Richard Chen (Microfabrica Inc., Van Nuys, California, USA)
Uri Frodis (Microfabrica Inc., Van Nuys, California, USA)
Ming‐Ting Wu (Microfabrica Inc., Van Nuys, California, USA)
Chris Folk (Microfabrica Inc., Van Nuys, California, USA)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 27 April 2010

2706

Abstract

Purpose

The purpose of this paper is to familiarize the reader with the capabilities of EFAB technology, a unique additive manufacturing process which yields fully assembled, functional mechanisms from metal on the micro to millimeter scale, and applications in medical devices.

Design/methodology/approach

The process is based on multi‐layer electrodeposition and planarization of at least two metals: one structural and one sacrificial. After a period of initial commercial development, it was scaled up from a prototyping‐only to a production process, and biocompatible metals were developed for medical applications.

Findings

The process yields complex, functional metal micro‐components and mechanisms with tight tolerances from biocompatible metals, in low‐high production volume.

Practical implications

The process described has multiple commercial applications, including minimally invasive medical instruments and implants, probes for semiconductor testing, military fuzing and inertial sensing devices, millimeter wave components, and microfluidic devices.

Originality/value

The process described in this paper is unusual among additive fabrication processes in being able to manufacture in high volume, and in its ability to produce devices with microscale features. It is one of only a few additive manufacturing processes that can produce metal parts or multi‐component mechanisms.

Keywords

Citation

Cohen, A., Chen, R., Frodis, U., Wu, M. and Folk, C. (2010), "Microscale metal additive manufacturing of multi‐component medical devices", Rapid Prototyping Journal, Vol. 16 No. 3, pp. 209-215. https://doi.org/10.1108/13552541011034889

Publisher

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Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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