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The purpose of this study was to evaluate the possibility of using conductive polymers such as polyaniline (PANI) as corrosion inhibitors for metals.

In this study, the effect of the addition of praseodymium (Pr³⁺) cations on the corrosion inhibition performance of PANI for AZ31 magnesium alloy was appraised through electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests.

The results of EIS and potentiodynamic polarization tests indicated the improvement of corrosion resistance of AZ31 during different immersion times.

This anti-corrosion ability of PANI/Pr³⁺ composite applies as non-toxic environmentally friendly corrosion inhibitor on the self-healing corrosion protection properties.

The conductive polymers are interested for many industries. The reported data can be used by the formulators working in the R&D departments.

The anti-corrosion ability of PANI/Pr³⁺ composite present a novel and high effective route against metal corrosion besides application of toxic corrosion.

The application of titanium dioxide coating in the field of architectural heritage is a great challenge. Therefore, the main objective of this study is to study the synthesis, characterization and corrosion inhibition performance of Pr³⁺ cations doped PANI nano-fibers as an anti-corrosion additive for AZ31 magnesium alloy in 3.5 Wt.% NaCl solution.

To investigate the effects of the temperature of synthesis and of the thermal treatment of zinc chromate on the properties of the zinc chromate pigments.

Zinc chromate pigments was prepared using zinc salt solution, sodium hydroxide and potassium dichromate solutions. The reaction temperature was varied in order to evaluate the effect of the reaction temperature on the properties of the pigment synthesised. The pigment obtained was heated to 10°C above the critical temperature in order to investigate the effect of thermal treatment on the pigment properties. SEM, XRD, XFR and STA were employed for the characterisation of the pigments synthesised.

Reaction temperature had a significant effect on the properties of the resulting pigment. Thermal treatment of the pigment caused the decomposition of the zinc chromate phase to ZnO, ZnCr₂O₄ and K₂CrO₄ phases. The glaze containing zinc chromate had satisfactory colour characteristics.

The study focused on the preparation and evaluation of zinc chromate as a substitute for praseodymium zircon in glaze. The study could be extended to investigation of similar inorganic pigment for similar purposes.

The information on the effects of the reaction temperature of pigment synthesis and of thermal treatment of the pigment is useful for industrial production of the pigment of satisfactory properties.

Novel use of zinc chromate as a lower‐cost substitute for praseodymium zircon in glaze and understanding of the effects of the production conditions on the properties of the resulting pigment and the glaze.

This paper aims to obtain rare earth magnesium alloy with good adhesion and corrosion resistance.

In 353 K oil bath, cyclic voltammetry was used to study the electrochemical behavior of Pr(III), Mg(II) and Ni(II) in choline chloride-urea ionic liquid. The constant potential method was adopted for electrodeposition of Pr-Mg-Ni ternary alloy films. The content of Pr in the Pr-Mg-Ni alloy films changes with respect to the deposition potential, deposition time and concentration ratio of Pr³⁺:Mg²⁺:Ni²⁺. Response surface methodology was applied to optimize the conditions for obtaining high-quality deposition films.

The results showed that the reaction of Ni(II) to Ni is irreversible; this result can be verified by Tafel polarization curve and chronocoulometry curve. Its transfer coefficient on the platinum electrode of 0.32 and diffusion coefficient is 1.0510⁻⁶ cm².s⁻¹. Mg(II) and Pr(III) cannot solely be reduced to their elemental form, but they can be induced via codeposition by Ni(II). The result shows that under a voltage of −1.00 V, the alloy coating with even structure is obtained when the concentration ratio of Pr³⁺:Mg²⁺:Ni²⁺ is 1:1:1 and the deposition time is 20 min. Scanning electron microscopy, X-ray diffraction, energy-dispersive X-ray spectroscopy and other analyses revealed that the alloy coating is amorphous. Polarization curves of the cathode are tested, which manifest the lowest corrosion current density, stating which has good corrosion performance in alkaline solution and NaCl solution; this can be attributed to its dense film structure and good combination with the substrate.

It provides some technology for the production of corrosion-resistant materials.

The purpose of this paper is to investigate the influence of praseodymium (Pr) additions (0, 0.05 and 0.5 wt%) on the mechanical properties and microstructure of SnAgCu solder joint during aging process. Moreover, the authors aim to indicate that the decreased soldification undercooling of Sn3.8Ag0.7Cu solder can suppress the formation of Ag3Sn plate to some extent.

The shear strength evolution of SAC, SAC‐0.05Pr and SAC‐0.5Pr solder joint were studied under 150°C aging process with STR‐1000. The effect of Pr additions on the solidification behavior of SnAgCu solder was also studied by differential scanning calorimetry. To study the microstructure evolution, the cross‐sections of all specimens were observed by means of scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Meanwhile, the etchant, consisting of 20%HNO3+distilled water was used for deep etching to reveal the interfacial morphology.

The shear force reduction rate of SAC solder joint during aging was restrained by 0.05%Pr addition but promoted with 0.5% Pr addition. The growth of IMC layer of SnAgCu joint in the aging process was suppressed significantly by different amounts of Pr additions. However, the beneficial effect of Pr addition due to the suppression of IMC layer growth was weakened by the micro‐cracks formed in PrSn3 compounds in SnAgCu‐0.5Pr joint. Pr additions (0.05, 0.5 wt%) decrease the solidification undercooling of SnAgCu solder, which will suppress the formation of Ag3Sn plate to some extent.

Further studies are necessary for confirmation of the practical application, especially of the manufacturing technology of solder paste containing Pr.

The appropriate amount of Pr in Sn3.8Ag0.7Cu solder is about 0.05 wt%. It is found that SAC‐0.05Pr solder has an improvement in solder joint reliability in long aging processes. The results suggested the novel solder alloys can meet the requirements of high reliability application.

The paper demonstrates that: Pr additions promote the solidification of SAC solder; shear force reduction rate of SAC solder joint was reduced by 0.05%Pr addition; the IMC layer growth rate of SnAgCu solder joint was suppressed by Pr additions; and micro‐cracks were found in PrSn3 phases after aging.

This paper aims to fabricate and characterize ZnO-based multilayer varistors.

Tape casting technique was utilized for preparation of multilayer varistors based on ZnO doped with Pr, Bi, Sb, Co, Cr, Mn and Si oxides. Scanning electron microscope (SEM), energy-dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD) methods were used to study the microstructure, elemental and phase compositions, respectively, of the varistors. Dielectric properties were investigated by impedance spectroscopy. Current–voltage (I–U) dependences were measured to characterize nonlinear behavior of the fabricated varistors.

XRD, SEM and EDS studies revealed dense microstructure of ceramic layers with ZnO grains sized 1-4 μm surrounded by nanometric Bi-rich films, submicrometer Zn₇Sb₂O₁₂ spinel grains and needle-shaped Pr₃SbO₇ crystallites. Praseodymium oxide was found to be very effective as an additive restricting the ZnO grain growth. I–U characteristics of the fabricated multilayer varistors were nonlinear, with the nonlinearity coefficients of 23-27 and 19-51 for the lower and higher Pr₂O₃ content, respectively. The breakdown voltages were 60-150 V, decreasing with increasing sintering temperature.

Low-temperature cofired ceramics technology enables attaining a significant progress in miniaturization of electronic passive components. Literature concerning application of this technology for multilayer varistors fabrication is limited. In the present work, the results of XRD, SEM and EDS studies along with the I–U and complex impedance dependences are analyzed to elucidate the origin of the observed varistor effect. The influence of sintering temperature and Pr₂O₃-doping level was investigated.

The purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications.

The effects of Praseodymium on property and Sn whisker growth under aging treatment in Sn−9Zn lead‐free solder were investigated.

The results indicate that with the addition of rare earth Pr, the wettability and mechanical properties of Sn−9Zn solder were improved. The best wettability and comprehensive property of soldered joint is obtained when the content of Pr is 0.08 wt.%. After aging treatment at 150°C for 360 h, the mechanical properties of Sn−9Zn−0.08Pr decreased but are still obviously higher than that of Sn−9Zn. Moreover, when the content of Pr reached 0.1 wt.%, plenty of Sn−Pr compounds were found in the Sn−9Zn solder. The inevitable oxidation of Sn−Pr compounds would cause a high stress accumulated within PrSn3 phases, which would be served as driving force to induce the Sn whisker sprout and growth after aging treatment at 150°C for 120 h to 360 h. Compared with the results in Sn−9Zn−0.5Ga−0.7Pr solder that Sn whisker observed until the addition of Pr reached 0.7 wt.%, it could be inferred that the addition of Ga may react against the sprout of Sn whisker.

It is found that the addition of Pr can improve the properties of solder and avoid Sn whisker growth in the right range and proper conditions. The cost of the solder with added Pr is limited to RMB 2 yuan/kg so it can be widely used in industry.

The purpose of this study is the synthesis and characterization of a CMYK palette (cyan of Cr-BiVO₄, magenta of Pr-CeO₂, yellow of Bi-(Ce,Zr)O₂ composite and black of YMnO₃) as an eco-friendly polyfunctional palette that combines (a) high near-infrared reflectance (cool pigments) that allows moderate temperatures in indoor environments and the urban heat island effect; (b) photocatalytic activity for the degradation of organic contaminants of emerging concern of substrates in solution (such as Orange II or methylene blue) and gaseous (NO_x and volatile organic compounds such as acetaldehyde or toluene); (c) X-ray radiation attenuators associated with bismuth ions; and (d) biocidal effect combined with co-doping with bactericidal agents.

Pigments were prepared by a solid-state reaction and characterized by X-ray diffraction, diffuse reflectance spectroscopy, photocatalytic activity over Orange II and scanning electron microscopy.

The behaviour of the proposed palette was compared to that of a commercial inkjet palette, and an improvement in all functionalities was observed.

The functionalities of pigments allow the building envelope and indoor walls to exhibit temperature-moderating effects (with the additional effects of moderating global warming and increasing air conditioning efficiency), purification and disinfection of both indoor and outdoor air, and radiation attenuation.

The proposed palette and its polyfunctional characterization are novel.

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series.

The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets.

The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials.

This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.