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This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications.

The size of the antenna is 24 × 24 × 1.6 mm³. The radiating element of the antenna is derived from the Sierpinski–Knopp (SK) fractal geometry for miniaturization of the antenna size. The antenna has a single reflecting stub placed between the two orthogonal feeds, to improve isolation.

The proposed antenna system exhibits S₁₁ < −10 dB, S₂₁ < −15 dB and stable radiation characteristics in the entire operating region. It also offers an envelope correlation coefficient < 0.01, a diversity gain > 9.9 dB and a capacity loss < 0.4 bps/Hz. The simulated and measured outputs were compared and results were found to be in similarity.

The proposed UWB-MIMO antenna has significant size reduction through usage of SK fractal geometry for radiating element. The antenna uses a single radiating element with dual feed. The stub is between the antenna elements which provide a compact and miniaturized MIMO solution for high density packaging applications. The UWB-MIMO antenna provides an isolation better than −20 dB in the entire UWB operating band.

This paper aims to synthesize new screen-printing ink formula based on new derivatives of azo thiadiazol disperse dyes and evaluate their characteristics after being printed on polyester fabric substrates.

New dispersed dyes based on 1, 3, 4-Thiadiazole derivatives (dyes 1 and 2) were prepared and confirmed by different analyses, infrared (IR), mass and nuclear magnetic resonance (NMR) spectroscopy, and then formulated as colored materials in the screen-printing ink formulations. Printing pastes containing the prepared dyestuffs and other ingredients were used for printing polyester using screen-printing or traditional printing. The characteristics of printed polyester fabric substrates were measured by color measurements such as a*, b*, L*, C*, E, Ho, R% and color strength, as well as light, washing, crock and alkali perspiration fastness, and finally, the depth of penetration was evaluated.

The prepared 1, 3, 4-Thiadiazole derivatives (dyes 1 and 2) were obtained from the reaction of 5,5’-(1,4-phenylene)bis(1,3,4-Thiadiazole-2-amine) with resorcinol and m-toluidine as a coupling component. The suitability of the prepared dyestuffs for silk screen-printing on polyester fabrics has been investigated. The prints obtained from a formulation containing dye 1 possess high color strength as well as good overall fastness properties if compared to those obtained using dye 2.

The method of synthesis of the new dyestuffs and screen-printing ink provides a simple and practical solution to prepare some new heterocyclic disperse azo dyes, and they are formulated in the screen-printing inks for printing on a polyester fabric substrate.

The prepared disperse dyes based on 1,3,4-Thiadiazole derivatives (dyes 1 and 2) could be used in textile printing of polyester on an industrial scale.

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm², a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite element simulation (FEM) and continuous damage mechanics (CDM) model, a fatigue life database is built. The stacked machine learning (ML) model's iterative optimization during training enables precise fatigue predictions (2.41% root mean square error [RMSE], R² = 0.975) for diverse structural components. Outliers are found in regression analysis, indicating potential overestimation for thickness transition specimens with extended lifetimes and underestimation for open-hole specimens. Correlations between fatigue life, stress factors, nominal stress and temperature are unveiled, enriching comprehension of LCF, thus enhancing solder behavior predictions.

This paper introduces stacked ML as a novel approach for estimating LCF life of SAC305 solder in various structural parts. It builds a fatigue life database using FEM and CDM model. The stacked ML model iteratively optimizes its structure, yielding accurate fatigue predictions (2.41% RMSE, R² = 0.975). Outliers are observed: overestimation for thickness transition specimens and underestimation for open-hole ones. Correlations between fatigue life, stress factors, nominal stress and temperature enhance predictions, deepening understanding of solder behavior.

The findings of this paper highlight the successful application of the SMLA in accurately estimating the LCF life of SAC305 solder across diverse structural components. The stacked ML model, trained iteratively, demonstrates its effectiveness by producing precise fatigue lifetime predictions with a RMSE of 2.41% and an “R²” value of 0.975. The study also identifies distinct outlier behaviors associated with different structural parts: overestimations for thickness transition specimens with extended fatigue lifetimes and underestimations for open-hole specimens. The research further establishes correlations between fatigue life, stress concentration factors, nominal stress and temperature, enriching the understanding of solder behavior prediction.

The authors confirm the originality of this paper.