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This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

The purpose of this paper is to present a study on miniaturized instruments for analytical chemistry with a microplasma as the excitation source.

The atmospheric pressure glow microdischarge could be ignited inside a ceramic structure between a solid anode and a liquid cathode. As a result of the cathode sputtering of the solution, it was possible to determine its chemical composition by analyzing the emission spectra of the discharge. Cathodes with microfluidic channels and two types of anodes were constructed. Both types were tested through experimentation. Impact of the electrodes geometry on the discharge was established. A cathode aperture of various sizes and anodes made from different materials were used.

The spectroscopic properties of the discharge and its usefulness in the analysis depended on the ceramic structure. The surface area of the cathode aperture and the flow rate of the solution influence on the detection limits (DLs) of Zn and Cd.

Constructed ceramic structures were able to excite elements and their laboratory-size systems. During the experiments, Zn and Cd were detected with DLs 0.024 and 0.053 mg/L, respectively.

This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

The main purpose of this study is to test the performance of the ink-jet printed microwave resonant circuits on Low temperature co-fired ceramics (LTCC) substrates combined with microfluidic channels for sensor applications. Normally, conductive patterns are deposited on an LTCC substrate by means of the screen-printing technique, but in this paper applicability of ink-jet printing in connection with LTCC materials is demonstrated.

A simple microfluidic LTCC sensor based on the microstrip ring resonator was designed. It was assumed the micro-channel, located under the ring, was filled with a mixture of DI water and ethanol, and the operating frequency of the resonator was tuned to 2.4 GHz. The substrate was fabricated by standard LTCC process, and the pattern of the microstrip ring resonator was deposited over the substrate by means of an ink-jet printer. Performance of the sensor was assessed with the use of various volumetric concentrations of DI water and ethanol. Actual changes in concentration were detected by means of microwave measurements.

It can be concluded that ink-jet printing is a feasible technique for fast fabrication of micro-strip circuits on LTCC substrates, including microfluidic components. Further research needs to be conducted to improve the reliability, accuracy and performance of this technique.

The literature shows the use of ink-jet printing for producing various conductive patterns in different applications. However, the idea to replace the screen-printing with the ink-jet printing on LTCC substrates in connection with microwave-microfluidic applications is not widely studied. Some questions concerning accuracy and reliability of this technique are still open.

In this study, AlCoCrFeNi–Cu (Cu-based) and AlCoCrFeNi–Ti (Ti-based) high entropy alloys (HEAs) were fabricated using a direct blown powder technique via laser additive manufacturing on an A301 steel baseplate for aerospace applications. The purpose of this research is to investigate the electrical resistivity and oxidation behavior of the as-built copper (Cu)- and titanium (Ti)-based alloys and to understand the alloying effect, the HEAs core effects and the influence of laser parameters on the physical properties of the alloys.

The as-received AlCoCrFeNiCu and AlCoCrFeNiTi powders were used to fabricate HEA clads on an A301 steel baseplate preheated at 400°C using a 3 kW Rofin Sinar dY044 continuous-wave laser-deposition system fitted with a KUKA robotic arm. The deposits were sectioned using an electric cutting machine and prepared by standard metallographic methods to investigate the electrical and oxidation properties of the alloys.

The results showed that the laser power had the most influence on the physical properties of the alloys. The Ti-based alloy had better resistivity than the Cu-based alloy, whereas the Cu-based alloy had better oxidation residence than the Ti-based alloy which attributed to the compositional alloying effect (Cu, aluminum and nickel) and the orderliness of the lattice, which is significantly associated with the electron transportation; consequently, the more distorted the lattice, the easier the transportation of electrons and the better the properties of the HEAs.

It is evident from the studies that the composition of HEAs and the laser processing parameters are two significant factors that influence the physical properties of laser deposited HEAs for aerospace applications.