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Live Streaming Marketing has emerged as a transformative medium, facilitating real-time product promotion and brand messaging and reshaping consumer engagement. However, knowledge of the impact of Store Atmospheric cues within live streaming contexts remains scarce. This research delves into the dynamic interplay between streamers and viewers across diverse live streaming platforms, with a focus on the impact of distinct atmospheric cues. It also seeks to explore prosocial behavior and integrate elements of social comparison theory.

We conducted semi-structured interviews with 14 streamers and 26 viewers. Participants who were active on streaming platforms and had experience of multiple live streaming sessions were purposively identified. The thematic coding approach and NVivo 12 software were employed to gain a nuanced understanding of live streaming dynamics.

Our findings highlight the significant role of emerging atmospheric cues in shaping immersive streaming experiences and fostering prosocial behavior. Additionally, we observed three formats of upward social comparisons between streamers and viewers, wherein viewers compared themselves with streamers and peers, and streamers engaged in comparisons with more experienced counterparts. This finding contributes to a sense of digital community and positive interactions because of live streaming adoptions.

By extending the application of social comparison theory, this study provides valuable insights for practitioners and scholars, enriching the understanding of both streamers’ and viewers’ psychological behavior and the dynamics of virtual retail settings.

Capital controls restrict cash withdrawals and international transfers, among other restrictions. The purpose of the study is to explore how capital controls have influenced m-banking usage and disclose the underlying factors that explain m-banking usage intentions.

Grounded on the Technology Acceptance Model (TAM), this study assumes that usage behavior may be different from intentions to adopt. In-depth interviews (study 1) were employed with both consumers and bank employees to explore the factors of m-banking adoption under capital controls, followed by an online survey (study 2) pertaining to examine the relationships between underlying factors.

Study 1 reveals that the growth of m-banking usage is strongly associated with capital controls that perceived ease of use, usefulness, risk, technology anxiety and decision comfort are significant attributes in influencing usage intention. Study 2 verifies that most underlying factors are important predictors of m-banking usage intention, except technology anxiety does not impact m-banking usage.

The respective effects on usage intentions may be different in the absence of capital controls. A similar study could examine the importance of the respective constructs in conditions of no forced use. The case of forcing consumers to adopt a technological innovation could be further explored.

Retail banking consumers have changed their banking and financing behaviors because of capital controls. Forced usage may cause customers to cultivate positive attitudes towards the technology and consider it for continuous usage.

Capital controls were found to impact positively customer behavior towards m-banking. It is revealed that capital controls have forced bank customers to adopt and use m-banking for their financial needs.

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.

In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.

The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO₂ hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.

To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.