Search results

The surface insulation resistance (SIR) test has traditionally been performed by taking measurements at certain points during a seven‐day test under well established environmental conditions. The work reported here explores the influence of test temperature and humidity when using a typical resin flux, a weak organic flux and glycol based fluxes when sampling SIR patterns every ten minutes. Results indicate that some fluxes are very sensitive to the test temperature, with volatilisation of flux residues an important issue. The frequent monitoring of the results also permitted the detection of dendrites during the SIR test. The results clearly show the importance of selecting the correct testing conditions and the benefit of frequent monitoring.

Discusses the 27 papers in ISEF 1999 Proceedings on the subject of electromagnetisms. States the groups of papers cover such subjects within the discipline as: induction machines; reluctance motors; PM motors; transformers and reactors; and special problems and applications. Debates all of these in great detail and itemizes each with greater in‐depth discussion of the various technical applications and areas. Concludes that the recommendations made should be adhered to.

The purpose of this paper is to investigate the effect of numerical boundary condition implementation on local error and convergence in L2-norm of a finite volume discretization of the transient heat conduction equation subject to several boundary conditions, and for cases with volumetric heat generation, using both fully implicit and Crank-Nicolson time discretizations. The goal is to determine which combination of numerical boundary condition implementation and time discretization produces the most accurate solutions with the least computational effort.

The paper studies several benchmark cases including constant temperature, convective heating, constant heat flux, time-varying heat flux, and volumetric heating, and compares the convergence rates and local to analytical or semi-analytical solutions.

The Crank-Nicolson method coupled with second-order expression for the boundary derivatives produces the most accurate solutions on the coarsest meshes with the least computation times. The Crank-Nicolson method allows up to 16X larger time step for similar accuracy, with nearly negligible additional computational effort compared with the implicit method.

The findings can be used by researchers writing similar codes for quantitative guidance concerning the effect of various numerical boundary condition approximations for a large class of boundary condition types for two common time discretization methods.

The paper provides a comprehensive study of accuracy and convergence of the finite volume discretization for a wide range of benchmark cases and common time discretization methods.

The reliability and corrosivity of two VOC ‐ free, no‐clean fluxes (C and D) were assessed using traditional test method such as copper mirror and copper corrosion tests. Modified surface insulation resistance (SIR) tests using coupons fluxed with various methods were performed in 50°C/90%RH environmental conditions. Printed circuit boards and assemblies were fluxed and exposed to a 50°C/90%RH chamber to assess long‐term reliability. To evaluate the corrosion rates of copper and solder sheets in as‐ received liquid fluxes, electrochemical polarisation measurements were employed. These showed that the corrosion rate of copper in flux D is 100 times higher than that in flux C. These quantitative data agreed with the qualitative copper mirror test results, i,e, flux C passed and flux D failed the test. However, both flux residues were found to corrode copper traces underneath the solder mask and copper pads on the PCB after three weeks in a 50°C/90% RH environment chamber. Large amounts of blue/green corrosion products were observed on the bare copper SIR coupons within seven days when using either flux; and SIR values were below the required 10₈ ohms. Based on the test results, neither flux was qualified for no‐clean processes because of the issues with corrosion. The corrosiveness of the VOC‐ free, no‐ clean flux residue is believed to be due to the activator packages used.

Introduces papers from this area of expertise from the ISEF 1999 Proceedings. States the goal herein is one of identifying devices or systems able to provide prescribed performance. Notes that 18 papers from the Symposium are grouped in the area of automated optimal design. Describes the main challenges that condition computational electromagnetism’s future development. Concludes by itemizing the range of applications from small activators to optimization of induction heating systems in this third chapter.

The IPC‐SF‐818 surface insulation resistance (SIR) test data taken with the use of a variety of halide‐free, no‐clean fluxes are analysed against Bellcore TR‐NWT‐000078 electromigration (EM) test data. Neither test results show correlation with bulk flux resistivity, flux water extract resistivity, flux residue moisture pick‐up, and flux corrosivity without bias. However, in the case of rosin fluxes, the insulation resistance behaviour in both SIR and EM tests is a function of the pH value of fluxes. This phenomenon is more significant in the SIR test. In the case of low‐residue, no‐clean fluxes, only the SIR test displays such a pH dependent relationship. Data suggest that the 50 volts bias voltage used in the SIR test may be responsible for this, and can be explained with a high‐bias‐voltage‐induced electrolysis mechanism which is further promoted by a high pH environment. This failure mechanism is absent in the EM test which utilises 10 volts bias voltage, and probably will not occur under the normal 5 volts application conditions. Overall, the SIR test seems to be more stringent while the EM test appears to be more realistic.

The radiation conduction coupling leads to particular problems due to computation time and high heat fluxes. Because of the hemispheric nature of the radiation, it is difficult to take into account symmetric or periodic conditions for the reduction of the modelled domain. We developed a finite element model of radiative heat transfers between grey diffuse surfaces with a nonparticipating medium with periodic or symmetric boundary conditions. The approaches used to decrease the computation time allowed the modelling of moving radiative surfaces. We introduced this model into a finite element convection diffusion code in order to simulate heat transfers in an electrical rotating engine. The main originality of this study lies in the use of periodic radiative conditions with moving surfaces and in the use of a method which is not based on the isothermal approximation.

A challenge in selecting and applying lead‐free solders lies in separating the influences of materials' properties, fluxes and processes to obtain robust assembly conditions that are compatible with PCB finishes and all component terminations. This paper discusses simple steps towards establishing a lead‐free assembly process. With reference to results of solder paste spread and wetting tests and component solderability tests, some of the current limitations in applying standard test methods to lead‐free evaluations are highlighted.

Joint descriptions of both heat and mass transfer and thermodynamic aspects of air‐cooling applications cannot be easily found in the literature. Numerical analyses are a notable exception since suitable physical models and realistic boundary conditions are a prerequisite of accurate simulations. Thus, it is believed that the experience gained with numerical simulations might be of some help also to designers of air‐conditioning and drying systems. This paper seeks to address this issue.

In the text, the physical implications of governing equations and boundary conditions utilized in numerical simulations are extensively discussed. Particular attention is paid to the thermodynamically consistent definition of latent and sensible heat loads, and to the correct formulation of the heat and mass transfer analogy.

Comparisons of analytical and numerical results concerning forced flows of humid air over a cooled plate validate the assumptions made in numerical simulations, both for air‐conditioning applications (almost always characterized by low rates of mass convection) and drying applications (almost always characterized by high rates of mass convection).

Finally, with reference to the cold plate problem investigated here, the effects of the suction flow induced by condensation on the Nusselt number are quantified.

The aim of this paper is to study two-dimensional numerical simulations of the flow and temperature fields inside the bend (turn) part of a U-duct.

Several turbulence models based on two and five equations were used to solve the momentum and energy equations inside the bend (turn) part of the U-duct. For two-equation models, both the renormalization group and realizable k-ɛ turbulence models were implemented. The five-equation model used is a Reynolds stress model with different wall boundary conditions. Standard, non-equilibrium and enhanced wall functions were used in parallel with the two- and five-equation models to treat the turbulent flow near the duct walls.

Several turbulence models were used to simulate the flow and temperature fields along the bend part of a U-duct with different inlet and thermal boundary conditions. The numerical results indicate that the renormalization and realizable k-ɛ turbulence models with standard wall function treatment gave the best results when compared with experimental data obtained for similar conditions.

For heat transfer analysis, two different thermal boundary conditions, i.e. constant wall temperature and constant heat flux at the wall are implemented. The results are calculated for Reynolds number equal 20,000.

The results can be used in designing heat exchangers, piping and duct systems, and internal passage cooling of gas turbine blades.

The numerical results obtained here concentrate on the detailed investigation of flow and temperature field at the outer wall of the bend part. Different boundary conditions at the inlet and the outer bend walls of the U-duct were applied to study how these boundary conditions affect the flow and temperature fields.