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The purpose of this study was to examine the global perceptions of social equity in the fine dining business model as a result of the surprise announcement for the 2024 planned closure of the Michelin three-star restaurant, Noma.

This study used critical discourse analysis to inductively analyze 91 source documents retrieved through a lexical database search. The analysis yielded five overarching themes and six subthemes.

Findings from this study serve as a benchmark in retrospect for capturing a rapidly accelerating global conversation from January to March 2023 around the long-term viability and social sustainability of the fine dining business model.

Against the backdrop of labor challenges in the restaurant industry due to the Covid-19 pandemic and its aftermath, the announced closure of Noma precipitated criticism of the stage (unpaid intern) system and the intense pressures of attaining and maintaining Michelin star status.

Results from the discourse analysis suggest certification for fine dining restaurants, perhaps through the Michelin Guide, for demonstrating a commitment to social sustainability as a qualifier to achieve a Michelin star.

Findings from this research reveal a palpable change in societal tolerance for a more socially sustainable fine dining restaurant business model that advances equitable solutions for its workers while assuring the economic sustainability of restaurants.

This study drew upon a foodscape lens to reveal a juxtaposition between well-executed environmentally sustainable initiatives in the fine dining business model and the threats to the social sustainability among its workers.

The purpose of this paper is to develop an appropriate machine learning model for predicting soil compaction degree while also examining the contribution rates of three influential factors: moisture content, electrical conductivity and temperature, towards the prediction of soil compaction degree.

Taking fine-grained soil A and B as the research object, this paper utilized the laboratory test data, including compaction parameter (moisture content), electrical parameter (electrical conductivity) and temperature, to predict soil degree of compaction based on five types of commonly used machine learning models (19 models in total). According to the prediction results, these models were preliminarily compared and further evaluated.

The Gaussian process regression model has a good effect on the prediction of degree of compaction of the two kinds of soils: the error rates of the prediction of degree of compaction for fine-grained soil A and B are within 6 and 8%, respectively. As per the order, the contribution rates manifest as: moisture content > electrical conductivity >> temperature.

By using moisture content, electrical conductivity, temperature to predict the compaction degree directly, the predicted value of the compaction degree can be obtained with higher accuracy and the detection efficiency of the compaction degree can be improved.

This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.

Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.

MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.

MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.

The purpose of this paper is to examine fine wine’s safe-haven status with respect to US equity movements.

We use a generalized autoregressive conditional heteroscedasticity model and its variant to measure the asymmetric reaction to positive and negative shocks.

Our empirical results show an inverted asymmetric volatility in the wine market; positive shocks increase the conditional volatility more than negative shocks. That is the opposite reaction in the volatility of equity returns occurs in the wine market. As leverage effect and volatility feedback effect do not adequately explain this reaction, we follow the work of Baur (2012) and propose the safe haven effect. Several robustness tests largely confirm the empirical findings, with major implications for wine investors. Finally, we provide further evidence on the benefits of adding wine investments to an equity portfolio through an increase in risk reduction effectiveness.

Based on the results of the robustness analysis, the recommendations in terms of including fine wines in portfolios must be issued with caution.

Our findings are crucial to the needs of market participants who are interested in including wine assets in their equity portfolio.

No previous study investigates the safe haven property of fine wine return, and accounts for risk reduction effectiveness when adding wine assets to a portfolio of US equities.

The purpose of this paper is to report on the current state of arts entrepreneurship education at higher educational institutions (HEIs) in the UK and Germany. It is based on findings from questionnaire surveys among 210 lecturers in fine art at 89 HEIs in the UK and Germany.

This paper explores issues related to fine art curriculum in higher education in the UK and Germany via survey questionnaires among 210 fine art lecturers with focus on arts entrepreneurship.

The study shows evidence that an arts entrepreneurship education, although considered by lecturers to be important and necessary for the professional and entrepreneurial preparation of fine art graduates, is definitely not implemented at HEIs, in neither the UK nor Germany.

The findings stimulate the discussion in the field of arts entrepreneurship and the redesigning of fine art curriculum to prepare fine art graduates for their entrepreneurial and professional careers.

There is still a marked paucity of research that focusses on arts entrepreneurship education. This study contributes to the knowledge by presenting specific findings related to fine art curriculum.

The purpose of this paper is to elucidate the current state of arts entrepreneurship education at higher educational institutions (HEIs) by reviewing the relevant literature and surveying lecturers in Fine Art.

The analysis of fine art students’ educational situation at HEIs in the UK and Germany is conducted in two steps: first, a literature review provides an overview of the current state of arts entrepreneurship education, followed by the second step of a cross-sectional survey by questionnaires among fine art lecturers to capture their perspectives of fine art students’ professional preparation.

The study confirms the assumed poor state of arts entrepreneurship education at HEIs by showing evidence that an entrepreneurial education of fine art students is definitely not implemented at HEIs, neither in the UK nor in Germany.

The findings stimulate the discussion of HEIs’ task and responsibility to professionally prepare fine art graduates for their entrepreneurial and professional career.

The study contributes to knowledge by presenting relevant findings related to fine art curriculum and current state of fine art graduates’ vocational preparation.

The purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.

Dozens of journal and conference articles published recently are reviewed.

The problems/challenges such as possible wire sweep and decreased bonding strength due to small wire sizes, non‐sticking, metal pad peeling, narrow process windows, wire open and short tail defects are analysed. The solutions to the problems and recent findings/developments in fine and ultra‐fine pitch wire bonding are discussed.

Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.

This paper attempts to provide an introduction to recent developments and the trends in fine and ultra‐fine pitch wire bonding. With the references provided, readers may explore more deeply by reading the original articles.

A comprehensive field study of atmosphere coarse and fine particulate concentration was conducted in Jiddah, Saudi Arabia from September 1998 to April 2000. Coarse and fine particulate concentrations were investigated at five stations. The means coarse particulate concentration for 1998, 1999 and 2000 were 66mg/m³, 348mg/m³ and 192mg/m³ respectively. The corresponding means for fine particulate concentration for 1998, 1999, and 2000 were 10mg/m³, 69mg/m³ and 51mg/m³. Data reported in this paper provide emphasis with regard to the environmental and health impacts of inhalable coarse and fine particulates in the zone investigated.

The reduction in IC package lead pitches in surface mount solder assembly and the current high emphasis on quality and reliability of printed circuit assemblies have created a requirement for microanalysis of fine pitch solder joints in manufacturing situations. Of particular interest are metallographic analysis, detection of solder joint defects and mechanical strength testing of solder joints. Much has been published in the literature on the results of such evaluations in specific applications but little has been available on procedures for use in the microanalysis itself, particularly for fine pitch solder joints. Detailed procedures for fine pitch solder joint microanalysis, which the authors have verified down to 0.5 mm (0.02 in.) lead pitches, are presented. In particular, the authors present procedures for metallographic examination of tin‐lead and tin‐lead‐silver solder joints. In addition, test parameters are given for a repeatable technique of fine pitch solder joint mechanical strength testing that allows mechanical strength measurements to be obtained from almost every lead on a fine pitch surface mount IC package.