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Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method

Huirong He (Department of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China)
Jida Chen (Department of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China)
Shengtao Zhang (Department of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China)
Minhui Liao (Department of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China)
Lingxing Li (Department of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China)
Wei He (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Yuanming Chen (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Shijin Chen (Bomin Electronics Co., Ltd., Meizhou City, China)

Circuit World

ISSN: 0305-6120

Article publication date: 7 August 2017

Abstract

Purpose

This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.

Design/methodology/approach

Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.

Findings

MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.

Originality/value

MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of the projects of “Sail Plan for Talents Development” of Guangdong Province China (No. 2015YT02D025) and Science and Technology Planning of Guangdong Province China (No.2015B090901032).

Citation

He, H., Chen, J., Zhang, S., Liao, M., Li, L., He, W., Chen, Y. and Chen, S. (2017), "Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method", Circuit World, Vol. 43 No. 3, pp. 131-138. https://doi.org/10.1108/CW-02-2017-0004

Publisher

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Emerald Publishing Limited

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