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This paper aims at exploring the interactions between Japan's export curbs against Korea, dubbed as “weaponized interdependence,” and Korea's decoupling from Japan' phenomenon in response. Thereby, it sheds light on the characteristics of the semiconductor industry, where the two economies' effective division of labor takes place. In addition, it attempts to typology the “decoupling from Japan” into two types. Furthermore, it deals with the political-economic implications of bilateral trade disputes and projects in the future.

This paper segregates the economic concept of “decoupling” into “decoupling from Japan” and “decoupling from Japanese firms” to better analyze the related phenomenon that occurred in Korea in response to the Japanese government's export restrictions in 2019. Along with it, the paper attempts to observe the trade dispute between Korea-Japan from a political-economic point of view.

The main findings are: First, Korea's decoupling from Japan' does not necessarily mean “decoupling from Japanese firms”. When Korean firms had to decouple from Japan due to non-economic factors, some has circumvented the decoupling to maintain economic ties with Japanese firms in the market, stemming from long-term transaction relationships in the semiconductor industry. Second, the two countries were confronted in a modest manner, even though they seemed to be fighting like a fierce tit-for-tat chicken game as those economies are interdependent with one another. Hence, both put effort to avoid sober damages or disruptive results on two economies and the global semiconductor supply chain.

The originality of this paper is to typologize the characteristics of “decoupling from Japan” in Korea by segregating it into two types of decoupling. On the other hand, other previous studies appeal to focus on the decoupling phenomenon per se and are interested in its potential for success.

Alan Hobby has recently been appointed Applications Engineer at DEK Printing Machines Ltd, Weymouth. In 1968 he joined Ferranti at Bracknell and became one of the small team setting up the thick film production unit. Four years later he joined EMI at Hayes as the Production Engineer, where he gained experience in the manufacture of high volume but relatively simple hybrids. In 1975 Alan moved to Marconi Electronic Devices Ltd at Portsmouth, where he was one of the engineers responsible for the company's programme of qualification as a hybrid manufacturer for the European Space Agency and for their BS 9450 approval programme. Since then he has been concerned with the development of printing and firing techniques both at Portsmouth and at Marconi's high volume production unit at Swindon.

The Annual Fall Symposium took place on 11–12 November, 1985, at the Marriott‐LAX Hotel, Los Angeles, focusing on the theme: ‘PC Technology: Materials, Processes and Requirements for Entry to the '90s’.

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.