DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Keywords

Citation

(2004), "DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe", Soldering & Surface Mount Technology, Vol. 16 No. 3. https://doi.org/10.1108/ssmt.2004.21916cad.010

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe

DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe

Keywords: Photoresists, Semiconductors

DuPont Electronic Technologies introduced its newest offering in Europe for semiconductor packaging, DuPont WB Series dry photoresist for wafer bumping, at Semicon Europa, 2004 at the New Munich Trade Fair Centre, Munich, Germany, back in April. DuPont featured WB Series dry photoresists in conjunction with offerings from EKC Technology, Europe’s leading manufacturer of high-quality, value-added process materials and chemicals for the semiconductor industry, including solvent photoresist stripers; aqueous and semi aqueous etch residue removes; choline base developers as TMAH replacement, strippers and cleaning solutions.

DuPont WB dry photoresist is an attractive alternative for wafer bumping vs liquid resists. This thick, dry photoresist (from 50 to over 100 microns) is applied in one step, with no solvents or drying required. The result is fewer overall process steps, and exact thickness uniformity from edge to edge of the wafer can be achieved, no matter what wafer size is being produced. A range of WB dry photoresist thicknesses and formulations are available for use in lead free, photostencil and standard electroplating applications.

For further information visit our Web site: www.dupont.com/pcm/icp