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Fine Line Conductor Formation

H. Nakahara (N.T. Information Ltd, New York, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1992

31

Abstract

Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.

Citation

Nakahara, H. (1992), "Fine Line Conductor Formation", Circuit World, Vol. 18 No. 2, pp. 42-46. https://doi.org/10.1108/eb046158

Publisher

:

MCB UP Ltd

Copyright © 1992, MCB UP Limited

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