DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2004

Keywords

Citation

(2004), "DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping", Microelectronics International, Vol. 21 No. 2. https://doi.org/10.1108/mi.2004.21821bad.009

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited


DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping

DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping

Keywords: DuPont, Photoresist, Semiconductors

DuPont introduced its newest offering for semiconductor fabrication, DuPont WB Series dry film photoresist for wafer bumping at the IMAPS 2003 last November. DuPont will feature WB Series resists in conjunction with its latest developments in thick film and low-temperature co-fired ceramic (LTCC) technologies and other microcircuit materials.

DuPont WB dry film photoresist is an attractive alternative for wafer bumping vs liquid resists. Thick photoresist (from 50 to over 100 μm) is applied in one step, with no solvents or drying required. The result is fewer overall process steps, and exact thickness uniformity from edge-to-edge of the wafer can be achieved, irrespective of the wafer size is being produced.

For more information, visit the Web site: www.dupont.com/pcm/icp