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The curing reaction of a promising “no flow” flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill can reach complete cure within 20 minutes at various cure temperatures. It is also shown that this “no flow” underfill could fully cure within one minute at 160°C after being heated at 220°C for one minute, demonstrating that this “no flow” underfill can be completely cured during the solder reflow cycle. The reaction order and the rate constant are determined to describe the curing progress. It is shown that the autocatalytic effect dominates the reaction kinetics.

The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 90° peel test.

In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system.

The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm−1) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.

It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro- and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials.

From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.

Reports results from studies conducted on a polyfunctional amine adduct epoxy curing agent (EPI‐CURE DPC‐3293) as a means to design low temperature cure coatings. Through the judicious choice of epoxide resins and amine‐functional curing agents, relatively fast reaction rates and resistance to moisture and humidity are maintained under low‐temperature cure conditions, and that is evidenced by a good balance of performance properties of coating films. We have used differential scanning calorimetry (DSC) to study the extent of reaction as well as the glass transition temperatures (T_g). Electrochemical impedance spectroscopy (EIS) has been used to predict the barrier properties of coating films. These results are compared with epoxide resins cured with a phenalkamine curing agent to illustrate some of the unique advantages of using multifunctional amine adduct curing agents for the curing of epoxide resins under sub‐ambient cure conditions for a multitude of end‐use applications.

UV light curing of adhesives has become the method of choice for many more industrial bonding, sealing, coating, potting and tacking applications. Because faster cures provide more efficient manufacturing processes and lower total assembly cost, and because light curing adhesives are being used in more kinds of applications, both the range of resins and curing equipment now available has expanded dramatically. Outlines the performances of currently available UV adhesives, their application and selection of UV light sources.

This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in the curing conditions.

In‐situ monitoring of the various processes that were used to cure the ICA revealed that electrical conduction in the ICA specimens depends on both the high‐temperature curing conditions and the conditions during cooling to temperatures below the glass transition temperature (T_g).

The electrical resistivity of the cured ICA specimens after cooling to ambient temperature decreased with increasing degree of conversion, tending towards a convergence value that decreased with increasing curing temperature. The electrical resistivity of the specimens also varied significantly depending on the subsequent annealing process. However, the electrical resistivity achieved after annealing at temperatures above the curing temperatures clearly depended on the particular curing temperature that was used. The characteristics of the polymer structure in the adhesive binder are considered to be different, depending on the curing temperature, and this affects the electrical properties of the ICA;, i.e. the characteristics of the polymer structure obtained during the curing process affect the electrical resistance of the ICA, even after subsequent annealing processes.

This paper discusses generalities of variation in the electrical properties of ICAs during heating and cooling processes. The variation in behaviour in practice will differ depending on the type of adhesive binder in the ICA.

This paper clarifies how the electrical properties of ICAs evolve during the curing, annealing and cooling processes.

In order to study its cure response and to understand its kinetic behaviour, this paper seeks to examine how a multifunctional epoxy resin, N,4‐bis(4‐(bis(2‐oxiranylmethyl)amino)‐2‐chlorobenzyl)‐3‐chloro‐N‐(2‐oxiranylmethyl)benzenamine (BCCOMB), synthesised from amine functional chloroaniline formaldehyde condensate (AFCFC) and epichlorohydrine, is cured with AFCFC as curing agent.

For effective curing, AFCFC (12.5 phr, part per 100 resin) was added to BCCOMB resin and mixed thoroughly for 15 minutes. The clear viscous solution was then subjected to DSC analyses for kinetics study of the curing reaction.

The AFCFC was successfully utilised as curing agents for BCCOMB as the DSC curves show complete curing exotherm. The presence of oxirane group in the BCCOMB was able to react with active hydrogen atoms of amine. This led to conversion of liquid monomers of thermoset resin into three‐dimensional network.

In the present discussion, the curing study of BCCOMB had been done using AFCFC as a curing agent. However, other curing agents, synthesised from other amine and aldehyde, could also be used to see whether they would be effective for curing study of BCCOMB.

The method for curing study of multifunctional epoxy resin (BCCOMB) was novel and the cured epoxy network could find numerous applications as surface coating and adhesive on to an intricate structure.

The purpose of this paper is to investigate the curing efficiency of amine functional aniline furfuraldehyde condensate (AFAFFC) for diglycidyl ether of bisphenol A (DGEBA) resin to achieve toughness, chemical resistance, etc.

To study curing reaction, the curing agent AFAFFC is synthesised first from the reaction of aniline and furfuraldehyde in acid medium and characterised by Fourier transform infrared spectroscopic analysis, elemental analysis, concentration of primary and secondary amine analysis. Then, equimolecular mixture of AFAFFC and DGEBA is subjected to curing reaction and the reaction is followed by differential scanning calorimetry (DSC) analysis. The kinetic studies of this curing reaction, mechanical properties, dynamic mechanical analysis and thermogravimetric analysis (TGA) of cured epoxy are also reported.

The DSC analysis shows the complete exotherms of effective curing reaction indicating the efficiency of AFAFFC as curing agent for DGEBA resin. The kinetic studies reveal that the curing reaction is first order. Mechanical properties reflect the brittleness of cured matrix and TGA shows that the cured matrixes are stable up to around 240°C.

The curing agent AFAFFC has been synthesised by using aniline and furfuraldehyde. By changing amine and aldehyde, other curing agents could be synthesised and the curing efficiency of these for epoxy resin could also be studied.

The method for curing study of epoxy resin (DGEBA) is novel and relevant as the cured products have high performance applications in protective coatings and adhesives for most substrates.

Reports the effects of composition and curing temperature on the film properties of three water reducible enamels prepared from palm stearin alkyds. The properties studied were hardness, flexibility, and adhesion. While all the formulations exhibit excellent adhesion, generally increasing the melamine content and curing temperature can increase the hardness but reduce the resistance to cracking and deformation of the coating. Applies Fourier transform infra‐red spectroscopy (FTIR) to the study of the curing reactions. Finds that FTIR is able to identify the predominant cross‐linking reactions.

Faster, more automated means for curing coatings as well as techniques in which the monomer polymerises to the polymer during curing readily captured the paint industry's imagination. Such concepts spell greater efficiency, greater automation and, in the long run, lower costs and greater profitability. Electron beam curing and ultra‐violet curing have emerged as the two most formidable contenders in this new area. Both methods make possible curing at near ambient temperature and both rely on high energy radiation — a highly effective form of energy for chemical reactions.

The purpose of this paper is to study the curing mechanisms, anticorrosive properties and protective mechanisms of three kinds of amine curing agents applied in a new kind of light colored water‐borne epoxy antistatic anticorrosive paint.

Using light color‐conductive mica, titanium oxides and environmentally‐friendly anticorrosive pigments in the two‐component water‐borne epoxy system, the light colored water‐borne antistatic anticorrosive paint was prepared. The molecular structure and curing mechanisms of the curing agents was analyzed by Fourier transform infra‐red spectroscopy, and the influence of the curing agents on anticorrosive properties and protective mechanisms was studied by electrochemical impedance spectroscopy.

The paints cured by the modified amine curing agent possessed optimal integrated properties with a coating surface resistivity of 10⁶ Ω and the best anticorrosive performance.

A novel light colored water‐borne epoxy antistatic anticorrosive paint cured by the optimal curing agent could be used in corrosion protection for oil tanks to replace the traditional oil‐based antistatic anticorrosive paints.