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The purpose of this study is to develop a novel general mathematical model to find the optimal product mix of commercial graphite products, which has a complex production process with alternative sub-processes in the graphite mining production process.

The network optimization was adopted to model the complex graphite mining production process through the optimal allocation of raw graphite, byproducts, and saleable products with comparable sub-processes, which has different processing capacities and costs. The model was tested on a selected graphite manufacturing company, and the optimal graphite product mix was determined through the selection of the optimal production process. In addition, sensitivity and scenario analyses were carried out to accommodate uncertainties and to facilitate further managerial decisions.

The selected graphite mining company mines approximately 400 metric tons of raw graphite per month to produce ten types of graphite products. According to the optimum solution obtained, the company should produce only six graphite products to maximize its total profit. In addition, the study demonstrated how to reveal optimum managerial decisions based on optimum solutions.

This study has made a significant contribution to the graphite manufacturing industry by modeling the complex graphite mining production process with a network optimization technique that has yet to be addressed at this level of detail. The sensitivity and scenario analyses support for further managerial decisions.

There are few reports that evolutional topology optimization methods are applied to the conductor geometry design problems. This paper aims to propose an evolutional topology optimization method is applied to the conductor design problems of an on-chip inductor model.

This paper presents a topology optimization method for conductor shape designs. This method is based on the normalized Gaussian network-based evolutional on/off topology optimization method and the covariance matrix adaptation evolution strategy. As a target device, an on-chip planer inductor is used, and single- and multi-objective optimization problems are defined. These optimization problems are solved by the proposed method.

Through the single- and multi-objective optimizations of the on-chip inductor, it is shown that the conductor shapes of the inductor can be optimized based on the proposed methods.

The proposed topology optimization method is applicable to the conductor design problems in that the connectivity of the shapes is strongly required.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

The purpose of this paper is to examine the consumer response to brands offering gendered product differentiation (i.e. products “for her” or “for him”).

Across three experiments, the effect of gendered (vs gender-unrelated) product differentiation on perceived brand sexism and word-of-mouth intention was tested. The moderating effects of feminist identity (Studies 1 and 2), endorsement of sexist beliefs (Study 2) and basis (stereotypical vs biological) for product differentiation (Study 3) were also tested.

Consumers perceive brands that offer gendered product differentiation as sexist, which in turn leads to negative word-of-mouth intention. Moreover, consumers with a strong feminist identity are more likely to perceive brands that offer gendered product differentiation as sexist, whereas consumers who endorse sexist beliefs are less likely to do so. Finally, consumers respond negatively when the gendered product differentiation is based on a gender stereotype, but much less so when it seems based on a biological difference between sexes.

Although multiple brands offering gendered products have been denounced by consumers as sexist, no research has examined this phenomenon. This paper pioneers in examining the consumer response to brands offering gendered product differentiation and in demonstrating that consumers perceive such brands as sexist.

The purpose of this review is to comprehensively consider the material properties and processing of additive titanium alloy and provide a new perspective for the robotic grinding and polishing of additive titanium alloy blades to ensure the surface integrity and machining accuracy of the blades.

At present, robot grinding and polishing are mainstream processing methods in blade automatic processing. This review systematically summarizes the processing characteristics and processing methods of additive manufacturing (AM) titanium alloy blades. On the one hand, the unique manufacturing process and thermal effect of AM have created the unique processing characteristics of additive titanium alloy blades. On the other hand, the robot grinding and polishing process needs to incorporate the material removal model into the traditional processing flow according to the processing characteristics of the additive titanium alloy.

Robot belt grinding can solve the processing problem of additive titanium alloy blades. The complex surface of the blade generates a robot grinding trajectory through trajectory planning. The trajectory planning of the robot profoundly affects the machining accuracy and surface quality of the blade. Subsequent research is needed to solve the problems of high machining accuracy of blade profiles, complex surface material removal models and uneven distribution of blade machining allowance. In the process parameters of the robot, the grinding parameters, trajectory planning and error compensation affect the surface quality of the blade through the material removal method, grinding force and grinding temperature. The machining accuracy of the blade surface is affected by robot vibration and stiffness.

This review systematically summarizes the processing characteristics and processing methods of aviation titanium alloy blades manufactured by AM. Combined with the material properties of additive titanium alloy, it provides a new idea for robot grinding and polishing of aviation titanium alloy blades manufactured by AM.

Advancement in optimization of VLSI circuits involves reduction in chip size from micrometer to nanometer level as well as fabrication of a billions of transistors in a single die where global routing problem remains significant with a trade-off of power dissipation and interconnect delay. This paper aims to solve the increased complexity in VLSI chip by minimization of the wire length in VLSI circuits using a new approach based on nature-inspired meta-heuristic, invasive weed optimization (IWO). Further, this paper aims to achieve maximum circuit optimization using IWO hybridized with particle swarm optimization (PSO).

This paper projects the complexities of global routing process of VLSI circuit design in mapping it with a well-known NP-complete problem, the minimum rectilinear Steiner tree (MRST) problem. IWO meta-heuristic algorithm is proposed to meet the MRST problem more efficiently and thereby reducing the overall wire-length of interconnected nodes. Further, the proposed approach is hybridized with PSO, and a comparative analysis is performed with geosteiner 5.0.1 and existing PSO technique over minimization, consistency and convergence against available benchmark.

This paper provides high performance–enhanced IWO algorithm, which keeps in generating low MRST value, thereby successful wire length reduction of VLSI circuits is significantly achieved as evident from the experimental results as compared to PSO algorithm and also generates value nearer to geosteiner 5.0.1 benchmark. Even with big VLSI instances, hybrid IWO with PSO establishes its robustness over achieving improved optimization of overall wire length of VLSI circuits.

This paper includes implications in the areas of optimization of VLSI circuit design specifically in the arena of VLSI routing and the recent developments in routing optimization using meta-heuristic algorithms.

This paper fulfills an identified need to study optimization of VLSI circuits where minimization of overall interconnected wire length in global routing plays a significant role. Use of nature-based meta-heuristics in solving the global routing problem is projected to be an alternative approach other than conventional method.

The purpose of this study is to increase awareness of current supply chain (SC) security-related issues by providing an extensive analysis of existing SC security solutions and their limitations. The security of SCs has received increasing attention from researchers, due to the emerging risks associated with their distributed nature. The increase in risk in SCs comes from threats that are inherently similar regardless of the type of SC, thus, requiring similar defence mechanisms. Being able to identify the types of threats will help developers to build effective defences.

In this work, we provide an analysis of the threats, possible attacks and traceability solutions for SCs, and highlight outstanding problems. Through a comprehensive literature review (2015–2021), we analysed various SC security solutions, focussing on tracking solutions. In particular, we focus on three types of SCs: digital, food and pharmaceutical that are considered prime targets for cyberattacks. We introduce a systematic categorization of threats and discuss emerging solutions for prevention and mitigation.

Our study shows that the current traceability solutions for SC systems do not offer a broadened security analysis and fail to provide extensive protection against cyberattacks. Furthermore, global SCs face common challenges, as there are still unresolved issues, especially those related to the increasing SC complexity and interconnectivity, where cyberattacks are spread across suppliers.

This is the first time that a systematic categorization of general threats for SC is made based on an existing threat model for hardware SC.

This research aims to examine the US–China policy shift from Obama to Biden emphasizing the centrality of Taiwan question in the geostrategic competition with Beijing and its prospect if the US strategy remains unchanged.

A conceptual framework is outlined, illustrating how the US grand strategy is driven by the ideological foundation of Exceptionalism. The paper highlights the associated US policy changes that evolved from Obama to Trump and then Biden to advance Washington's strategic interests in its rivalry with China over Taiwan.

Biden's policy led to an escalating geopolitical competition with Beijing over Taiwan to maintain US supremacy. The Biden administration is more stringent than the previous administrations on the Taiwan question and there is the conviction that the USA must not back down on Taiwan because the alternative will be a retraction of US world primacy to Beijing. With Washington's persistent hegemonic strategy, the US–China confrontation over Taiwan seems inevitable.

The research highlights how the Biden administration managed a perpetuated Ukraine crisis and forged unprecedented high-level ties with Taiwan, indicating the administration's determination to exacerbate contentions with Beijing over Taiwan rather than de-escalate.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

This study aims to investigate the role of interpersonal influence on consumer purchase decisions regarding foreign products, specifically by exploring consumers’ social reaction styles (acquisitive and protective) when confronted with normative pressures and their subsequent impact on consumers’ purchase behavior in the context of situational animosity.

Three studies were conducted in China to empirically examine the proposed research model. The US–China Chip War of 2022 was used as the research context for situational animosity, while the Japan–China relationship representing a stable animosity condition was used for contrast.

This study establishes the mediating role of perceived normative pressure in linking animosity attitudes to purchase avoidance in situational animosity. It also validates that consumers’ social reaction styles (acquisitive and protective) help predict distinct behavioral outcomes, holding significant implications for advancing research in the field of product and brand consumption.

This research provides a novel perspective by exploring consumers’ social reaction styles when dealing with normative pressure in situational animosity. The distinction between acquisitive and protective reaction styles adds depth and originality to the study. Moreover, this study examines consumer behavior in two distinct consumption contexts: switching intentions to local products and purchase intentions for products from offending countries in hidden consumption situations. This dual perspective offers a comprehensive exploration of consumers’ purchase behavior under normative pressure, contributing to the novelty of this research.