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The purpose of this paper is to examine how the levels of athletic identity influenced the relationships among college experiences, career self-efficacy, and the career barriers faced by semi-professional student-athletes in Taiwan.

Survey data of athletic identity, college experiences (involvement in social, academic, career orientation activities, etc.), career self-efficacy, and career barriers (inherent difficulties in career exploration in a dual student-professional role) were collected from 345 varsity student-athletes in Taiwan sport universities. The conditional process analysis was conducted to test whether the mediating role of career self-efficacy in the association between college experiences and career barriers was dependent on athletic identity levels.

The results indicated that enriching college experiences contributed to fewer barriers regarding career exploration post graduation through high levels of career self-efficacy. Particularly for assorted and social experiences, the indirect effect reduced as the levels of athletic identity increased.

These findings may be applied to athletes who pursue early specialization and students who engage heavily in a specific sport or other co-curricular activities while neglecting the importance of scholastic learning and career exploration. Career counseling practitioners and sport psychologists are advised to take account of athletic identity and contextual specificity while providing career interventions to student-athletes.

This study extends the understanding of the impacts of athletic identity on college student-athletes’ career explorations within a specific sport context.

Since business competition has become more intense throughout the world, most enterprises are seeking to engage in business cooperation with other partners in order to enhance their competitive strengths. However, they do not necessarily develop mature information technologies’ (ITs) capabilities and skills internally but rather outsource them to IT providers. Therefore, the benefits received by firms which adopt the approach of business cooperation with IT providers have become an interesting issue for managers and shareholders.

This study adopted an event study methodology for apprising the short-term business value from the stock market. The authors predicted that investors will react as they receive news coverage about the strategy of business cooperation between outsourcing firms and an IT provider, International Business Machines (IBM) Corporation. The authors then collected all news coverage regarding the firms which had announced business cooperation with IBM and observed different types of abnormal returns.

On analyzing 53 announcements of cooperation with IBM from 2008 to 2016, the authors found that the announcement of business cooperation had a significantly positive influence on companies' market value.

To the best of the authors’ knowledge, this is the first study to investigate the issue for market reaction to the announcement of business cooperation with IBM.

This paper has two primary purposes: to explore common copyright‐related problems that arise when librarians promote the use of digital library resources; and to investigate college students' misconceptions of copyright laws that arise when the students use these resources.

Four librarians in charge of the management of digital library resources were interviewed regarding student‐users' problematic copyright‐infringement behaviors that these librarians often encountered when they promoted the use of digital library resources. Also, a semi‐structured questionnaire with nine questions about copyright‐related behaviors was developed and distributed to college students. Students needed not only to identify whether the behavior was acceptable, but also to explain the reasons for their identification. A total of 109 valid sets of data were collected from 18 universities or colleges, the sets comprising responses from 48 undergraduate, 56 postgraduate, and five doctoral students.

The librarian‐interview results indicate that students' problematic behaviors included systematic downloading, distribution to unauthorized users, and going beyond the purpose and character of academic use. The student‐survey results indicate that students had four major areas of misunderstanding about copyright laws when using digital library resources: the digital resources should be shared; the downloaded digital resources are all legitimately authorized and permitted; all educational use is fair use; and any downloading is permitted as long as students are paying tuition.

This paper explores students' understanding and misunderstandings that arose when students used the school digital library resources and discusses implications of these results for librarians and libraries with regard to the design of related instruction. The paper also presents interpretations of students' thoughts and conduct, as well as some future possible research topics.

Wireless sensor networks consist of a large number of nodes with limited battery power and sensing components, which can be used for sensing specified events and gather wanted or interesting information via wireless links. It will enable the reliable monitoring of a variety of environments for both civil and military applications. There is a need of energy‐efficient message collection and power management methods to prolong the lifetime of the sensor network. Many methods, such as clustering algorithm, are investigated for power saving reason, however, they only consider reducing the amount of message deliveries by clustering but not the load balance of the clusters to extend the maximum lifetime of the network. Therefore, in this paper, we propose a fully distributed, randomized, and adaptable clustering mechanism named autonomous clustering and message passing (ACMP) protocol for improving energy efficiency in wireless sensor networks. Sensor nodes, according to ACMP, can cluster themselves autonomously by their remaining energy and dynamically choose a corresponding cluster head (CH) to transfer the collected information. Sensor nodes adjust an appropriate power level to form clusters and use minimum energy to exchange messages. The network topology is changed dynamically depending on the CH's energy. Moreover, by maintaining the remaining energy of each node, the traffic load is distributed to all nodes and thus prolong the network lifetime efficiently. Simulation results show that ACMP can achieve a highly energy saving effect as well as prolong the network lifetime.

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

A four‐factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has two levels, 30 and 90 s. The thermally shocked test vehicles are subjected to air‐to‐air thermal shock conditioning from −40 to 125°C with 30 min dwell times (or 1 h/cycle) for 500 cycles. Samples both from the initial time zero and after thermal shock are cross‐sectioned. The IMC thickness is measured using scanning electron microscopy. Statistical analyses are conducted to compare the difference in IMC thickness growth between SAC305 solder joints and SnPb solder joints, and the difference in IMC thickness growth between after thermal shock and after thermal aging.

The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. The IMC layer of SAC305 soldered joints is statistically significantly thicker than that of SnPb soldered joints when reflowed at comparable peak temperatures above liquidus and the same time above liquidus. Thermal conditioning leads to a smoother and thicker IMC layer. Thermal shock contributes to IMC growth merely through high‐temperature conditioning. The IMC thickness increases in SAC305 soldered joints after thermal shock or thermal aging are generally in agreement with prediction models such as that proposed by Hwang.

It is still unknown which thickness of IMC layer could result in damage to the solder.

The IMC thickness of all samples is below 3 μm for both SnPb and SAC305 solder joints reflowed at the peak temperature ranging from 12 to 32°C above liquidus temperature and at times above liquidus ranging from 30 to 90 s. The IMC thickness is below 4 μm after subjecting to air‐to‐air thermal shock from −40 to 125°C with 30 min dwell time for 500 cycles or thermal aging at 125°C for 250 h.

The paper reports experimental results of IMC thickness at different thermal conditions. The application is useful for understanding the thickness growth of the IMC layer at various thermal conditions.

The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.

Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear forces for the resistors were measured after assembly. The fracture interfaces were inspected using scanning electron microscopy with energy dispersive spectroscopy in order to determine the failure mode and failure surface morphology.

The results show that the effects of the peak temperature and the time above solder liquidus temperature are not consistent between different component sizes and between Sn37Pb and Sn3.0Ag0.5Cu solder. The shear force of SnPb solder joints is higher than that of Sn3.0Ag0.5Cu solder joints because the wetting of SnPb is better than that of SnAgCu.

This study finds that fracture occurred partially in the termination metallization and partially in the bulk solder joint. To eliminate the effect of the termination metallization, future research is recommended to conduct the same study on solder joints without component attachment.

The shear strength of both SnPb and SnAgCu solder joints is equal to or higher than that of the termination metallization for the components tested.

Fracture was observed to occur partially in the termination metallization (Ag layer) and partially in the bulk solder joint. Therefore, it is essential to inspect the fracture interfaces when comparing solder joint shear strength.

Most studies on tie strength have focused on its definition, calculation and applications, but have not paid much attention to how tie strength can help analyse online social networks. Because ties play different roles in a network depending on their strength, the purpose of this paper is to explore the relationship between tie strength and network behaviours.

The authors propose a simple metric for tie strength measurement and then apply it to an online social network extracted from a blog network. These networks are massive in size and have technology for efficient data collection, thereby presenting the possibility of measuring tie strength objectively. From the results several key social network properties are studied to see how tie strength may be used as a metric to explain certain characteristics in social networks.

The online networks exhibit all the structural properties of an actual social network, not only in following the power law but also with regard to the distribution of tie strength. The authors noted a strong association between tie strength and reciprocity, and tie strength and transitivity in online social networks.

This paper highlights the importance of analysing online social networks from a tie strength perspective. The results have important implications for the development of efficient search mechanisms and appropriate group leaders in virtual communities.

With an increasing air cargo demand in the global air cargo transport industry, not only domestic airlines but also foreign carriers are actively investing in the air cargo service sector and trying to provide a differentiated service in order to gain a competitive advantage. There are a variety of service quality models available but most research to date has not found an optimal model for the air cargo service sector.

Using questionnaire data collected from air freight forwarders in Korea with respect to the air cargo service provided by Korean Air, Asiana Airlines, and foreign carriers(JAL or China Eastern), this paper compares four models in measuring the service quality in the air cargo sector and identifies the best model. We then analyze the weakness of each airline’s service operation and make suggestions for improvement.

For demonstration analysis, the survey of domestic air cargo forwarders revealed that Reliability>Responsiveness> Supply ability>Security in important order in air cargo service quality dimension. In the context of this paper, we considered four models-unweighted SERVQUAL, unweighted SERVPERF, weighted SERVQUAL, and weighted SERVPERF–for our investigation into which is the most suitable model in the air cargo service sector with testing of goodness of fit by three criteria. Our results indicate that the most suitable model for the air cargo service sector is the weighted SERVPERF model.

This research explored how COVID-19 affects Shenzhen high school students' reading behavior and preference and their parents' attitudes toward reading during the lockdown.

This research adopted a qualitative approach to conduct one-on-one semi-structured interviews with parents of a boarding high school in Shenzhen, China. Thirteen parents were recruited through a purposeful sampling method, and NVivo12 software was used to analyze the results with a theme-based approach guided by the 5E instructional model.

The results revealed the effectiveness and problems of high school students' use of electronic resources and discovered changes in the reading behavior of high school students and their parents' attitudes during COVID-19.

There are few studies specifically on the reading behavior of boarding students from a parental view, especially in Asia. This research can fill the gaps in related research during COVID-19.