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Selective jet electrodeposition (SJED) is an emerging additive manufacturing (AM) technology for realizing metallic components of nano and micro sizes. The deposited parts on the substrate form metallurgical bonding, so separating them from the substrate is an unsolved issue. Therefore, this paper aims to propose a method for separating the deposited micro parts from a sacrificial substrate. Furthermore, single and multi-bead optimization is performed to fabricate microparts with varying density.

A typical SJED process consists of a nozzle (to establish a column of electrolytes) retrofitted on a machine tool (to provide relative motion between substrate and nozzle) that deposits material atom-by-atom on a conductive substrate.

A comprehensive study of process parameters affecting the layer height, layer width and morphology of the deposited micro-parts has been provided. The uniformity in the deposited parts can be achieved with the help of low applied voltage and high scanning speed. Multi-bead analysis for the flat surface condition is experimentally performed, and the flat surface condition is achieved when the centre distance between two adjacent beads is kept at half of the width of a single bead.

Although several literatures have demonstrated that the SJED process can be used for the fabrication of parts; however, part fabrication through multi-bead optimization is limited. Moreover, the removal of the fabricated part from the substrate is the novelty of the current work.

This paper aims to discuss the ethical aspects of hardware reverse engineering (HRE) and propose an ethical framework for HRE when used to mitigate cyber risks of the digital supply chain of critical infrastructure operators.

A thorough review and analysis of existing relevant literature was performed to establish the current state of knowledge in the field. Ethical frameworks proposed for other areas/disciplines and identified pertinent ethical principles have been used to inform the proposed framework’s development.

The proposed framework provides actionable guidance to security professionals engaged with such activities to support them in assessing whether an HRE project conforms to ethical principles. Recommendations on action needed to complement the framework are also proposed. According to the proposed framework, reverse engineering is neither unethical nor illegal if performed honourably. Collaboration with vendors and suppliers at an industry-wide level is critical for appropriately endorsing the proposed framework.

To the best of the authors’ knowledge, no ethical framework currently guides cybersecurity research, far less of cybersecurity vulnerability research and reverse engineering.

The purpose of this paper is to investigate the impact of mechanical vibration on the heat transfer and pressure drop characteristics of semicircular channel printed circuit heat exchangers (PCHEs), while also establishing correlations between vibration parameters and thermal performance.

By combining experimental and numerical simulation methods, the heat transfer coefficient and pressure drop characteristics of supercritical carbon dioxide (S-CO₂) in a semicircular channel with a diameter of 2 mm under vibration conditions were studied. Reinforce the research by conducting computational fluid dynamics studies using ANSYS Fluent 22.0, the experimental results were compared with the numerical simulation results to verify the accuracy of the numerical method.

The use of vibration has the potential to attenuate the degradation of wall heat transfer caused by buoyancy-induced PCHEs on the upward-facing surface. The heat transfer enhancement (HTE) was maximized by an increase of 18.2%, while the pressure drop enhancement (PDE) was elevated by over 25-fold. The capacity to enhance the heat exchange between S-CO₂ and channel walls through increasing vibration intensity is limited, indicating maximum effectiveness in improving thermal performance.

Conducting heat transfer experiments on PCHEs with mechanical vibration enhancement and verifying the accuracy of the vibration numerical model. The relation based on the dimensionless factor is derived. To provide theoretical support for using vibration to enhance the heat transfer capability of PCHEs.

Current flexible printed circuit (FPC) assembly relies heavily on manual labor, limiting capacity and increasing costs. Small FPC size makes automation challenging as terminals can be visually occluded. The purpose of this study is to use 3D tactile sensing to mimic human manual mating skills for enabling sensing offset between FPC terminals (FPC-t) and FPC mating slots (FPC-s) under visual occlusion.

The proposed model has three stages: spatial encoding, offset estimation and action strategy. The spatial encoder maps sparse 3D tactile data into a compact 1D feature capturing valid spatial assembly information to enable temporal processing. To compensate for low sensor resolution, consecutive spatial features are input to a multistage temporal convolutional network which estimates alignment offsets. The robot then performs alignment or mating actions based on the estimated offsets.

Experiments are conducted on a Redmi Note 4 smartphone assembly platform. Compared to other models, the proposed approach achieves superior offset estimation. Within limited trials, it successfully assembles FPCs under visual occlusion using three-axis tactile sensing.

A spatial encoder is designed to encode three-axis tactile data into feature maps, overcoming multistage temporal convolution network’s (MS-TCN) inability to directly process such input. Modifying the output to estimate assembly offsets with related motion semantics overcame MS-TCN’s segmentation points output, unable to meet assembly monitoring needs. Training and testing the improved MS-TCN on an FPC data set demonstrated accurate monitoring of the full process. An assembly platform verified performance on automated FPC assembly.

Three-dimensional (3D) casting means using additive manufacturing (AM) techniques to print the mould for casting the cast tool. The printed mould, however, should be checked for its dimensional accuracy. 3D scanning can be used for the same. The purpose of this study is to combine the different AM techniques for 3D casting with 3D scanning to produce parts with close tolerance for preparing electrical discharge machining (EDM) electrodes.

The four processes, namely, stereolithography, selective laser sintering, fused deposition modelling and vacuum casting, are used to print the casting mould. The mould is designed in two halves, assembled to form a complete mould. The mould is 3D scanned in two stages: before and after using it as a casting mould. The mould's average and maximum dimensional deviations are calculated using 3D-scanned results. The eutectic Sn-Bi alloy is cast in the mould. The surface roughness of the mould and the cast tool are measured.

The cast tool is selected from the four processes in terms of dimensional accuracy and surface finish. The same is electroplated with copper. The microstructure of the cast tool (low-melting-point alloy) and deposited copper is analysed using a scanning electron microscope. Energy dispersive spectroscopy and X-ray diffraction techniques are used to verify the composition of the cast and coated alloy. The electroplated tool is finally tested on the EDM setup. The material removal rate and tool wear are measured. The performance is compared with a solid copper tool. The free-form customised EDM mould is also prepared, and the profile is cast out. The same is tested on the EDM. Thus, the developed path can be successfully used for rapid tooling applications.

The eutectic composition of Sn-Bi is cast in the 3D-printed mould using different AM techniques combined with 3D scanning quality to check its feasibility as an EDM electrode, which is a novel work and has not been done previously.

The purpose of this study is to assess a novel method for creating tangible three-dimensional (3D) morphologies (scaled models) of neuronal reconstructions and to evaluate its cost-effectiveness, accessibility and applicability through a classroom survey. The study addresses the challenge of accurately representing intricate and diverse dendritic structures of neurons in scaled models for educational purposes.

The method involves converting neuronal reconstructions from the NeuromorphoVis repository into 3D-printable mold files. An operator prints these molds using a consumer-grade desktop 3D printer with water-soluble polyvinyl alcohol filament. The molds are then filled with casting materials like polyurethane or silicone rubber, before the mold is dissolved. We tested our method on various neuron morphologies, assessing the method’s effectiveness, labor, processing times and costs. Additionally, university biology students compared our 3D-printed neuron models with commercially produced counterparts through a survey, evaluating them based on their direct experience with both models.

An operator can produce a neuron morphology’s initial 3D replica in about an hour of labor, excluding a one- to three-day curing period, while subsequent copies require around 30 min each. Our method provides an affordable approach to crafting tangible 3D neuron representations, presenting a viable alternative to direct 3D printing with varied material options ensuring both flexibility and durability. The created models accurately replicate the fidelity and intricacy of original computer aided design (CAD) files, making them ideal for tactile use in neuroscience education.

The development of data processing and cost-effective casting method for this application is novel. Compared to a previous study, this method leverages lower-cost fused filament fabrication 3D printing to create accurate physical 3D representations of neurons. By using readily available materials and a consumer-grade 3D printer, the research addresses the high cost associated with alternative direct 3D printing techniques to produce such intricate and robust models. Furthermore, the paper demonstrates the practicality of these 3D neuron models for educational purposes, making a valuable contribution to the field of neuroscience education.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint.

Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO₂) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO₂, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven.

Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance R_thj-a of MOSFETs depends on TiO₂ concentration in the composite solder joint reaching the minimum R_thj at 0.25 Wt.% of TiO₂.

Mechanical strength: TiO₂ reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO₂ concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO₂ does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly.

Incorporating TiO₂ enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO₂ composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength.

The integration of TiO₂ reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO₂ concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry.

The research shows the importance of the soldering technology used to assemble MOSFET devices.

The purpose of this paper is to develop a familiarity analysis of resistive-capacitive (RC) network active circuit operating with unfamiliar low-pass (LP) type negative group delay (NGD) behavior. The design method of NGD circuit is validated by simulation with commercial tool and experimental measurement.

The present research work methodology is structured in three main parts. The familiarity theory of RC-network LP-NGD circuit is developed. The LP-NGD circuit parameters are expressed in function of the targeted time-advance. Then, the feasibility study is based on the theory, simulation and measurement result comparisons.

The RC-network based LP-NGD proof of concept is validated with −1 and −0.5 ms targeted time-advances after design, simulation, test and characterized. The LP-NGD circuit unity gain prototype presents NGD cut-off frequencies of about 269 and 569 Hz for the targeted time-advances, −1 and −0.5 ms, respectively. Bi-exponential and arbitrary waveform signals were tested to verify the targeted time-advance.

The performance of the unfamiliar LP-NGD topology developed in the present study is limited by the parasitic elements of constituting lumped components.

The NGD circuit enables to naturally reduce the undesired delay effect from the electronic and communication systems. The NGD circuit can be exploited to reduce the delay induced by electronic devices and system.

As social impacts of the NGD circuit application, the NGD function is one of prominent solutions to improve the technology performances of future electronic device in term of communication aspect and the transportation system.

The originality of the paper concerns the theoretical approach of the RC-network parameters in function of the targeted time-advance and the input signal bandwidth. In addition, the experimental results are also particularly original.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.