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Semiconductor Seal Testing

T. Gillespie (Trio‐Tech Ireland, Deansgrange, Co. Dublin, Ireland)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1988

35

Abstract

Increasing awareness of the consequences of device failures has resulted in increased reliance on Environmental Testing as an additional means of enhancing the integrity and reliability of a device. The key consideration is not the cost of the device itself, but the cost of subsequent failure, which can be as much as a hundred times greater. Seal tests are undertaken to ensure that moisture cannot get into the internal cavities of sealed ceramic, metal or glass packages. Seal security is vital to the long‐term reliability of all hermetically sealed devices. This paper outlines the techniques involved and the requirements of the MIL, BS and IEC specifications.

Citation

Gillespie, T. (1988), "Semiconductor Seal Testing", Microelectronics International, Vol. 5 No. 1, pp. 46-48. https://doi.org/10.1108/eb044310

Publisher

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MCB UP Ltd

Copyright © 1988, MCB UP Limited

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