Advances in Flux Technology for the Soldering of Surface Mounted Devices

Abstract

Recent developments in synthetic resin based non‐corrosive fluxes for soft soldering have coincided with completion of the work of the international flux standard committee. With the increasing usage of surface mounted components these special synthetic resin‐based, zero‐halide, low solids fluxes can be used to leave minimal residues after soldering, which without removal do not affect long‐term reliability of soldered assemblies. Similar chemistry has been applied to devise flux cored solders and solder pastes which also leave minimal, safe residues, thereby avoiding cleaning processes.

Citation

Rubin, W. (1988), "Advances in Flux Technology for the Soldering of Surface Mounted Devices", Microelectronics International, Vol. 5 No. 1, pp. 25-27. https://doi.org/10.1108/eb044305