New products

Abstract

Two die attach adhesive products, manufactured by Furane Products Co., claim to meet the military specification for epoxy electronic adhesives (MIL‐STD‐883C, Method 5011) without exception. The products are EPIBOND 7002 which is a thermally conductive adhesive and EPIBOND 7200, an electrically and thermally conductive die attach adhesive. Both are 100% solids and contain no solvents or diluents. Consequently, the likelihood of outgassing and void formation is greatly reduced. Both are extremely high purity systems, and have a hot die‐shear strength of over 6,000 N/M2 at 150°C. Both materials are screen printable and undergo virtually no bleed‐out during processing.

Citation

(1988), "New products", Microelectronics International, Vol. 5 No. 1, pp. 104-107. https://doi.org/10.1108/eb044315