Polymeric Copper Pastes for Additive Multilayer Circuits

Abstract

The paper describes a newly developed economical method of fabricating multilayers by means of polymeric copper paste, chemical copper and dielectric paste. The parameters discussed include thermal shock, solder joint strength, electrical performance and environmental studies coupled with the fabrication processes involved in producing high volume PTH multilayer circuits. The materials outlined show the use of polymer copper conductors as the interconnection segment in conjunction with chemical plating and dielectric paste in producing hybrid PCBs with more than two layers of interconnection.

Citation

Kabe, A. and Morooka, I. (1988), "Polymeric Copper Pastes for Additive Multilayer Circuits", Microelectronics International, Vol. 5 No. 1, pp. 70-73. https://doi.org/10.1108/eb044311