Thermal Analysis of Hybrid Circuits with Mounted Components
G. De Mey
(Ghent State University, Ghent, Belgium)
L. Van Schoor
(KIHO, Ghent, Belgium)
30
Abstract
In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.
Citation
De Mey, G. and Van Schoor, L. (1988), "Thermal Analysis of Hybrid Circuits with Mounted Components", Microelectronics International, Vol. 5 No. 1, pp. 28-32. https://doi.org/10.1108/eb044306
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited