Search results

The primary objective of this two part study was to show theoretically how pigment cluster voids and pigment distribution can influence the critical pigment volume concentration (CPVC) and consequently the properties of a dry coating. In Part I of this study a pigment clustering model with an analytical solution has been developed that was a modification of an earlier model by Fishman, Kurtze, and Bierwagen that could only be solved numerically.

The original derivation of the clustering concept developed by Fishman et al. resulted in a mathematical analysis which was only able to be solved numerically and was found to be very tedious to utilize directly. In this study, a new successful derivation utilizing some of the original concepts of Fishman et al. was generated and shown to result in a practical and much more useable analytical analysis of the clustering concept. This new model was then applied directly to quantify the influence of flow agents or surfactants in a coating formulation on the CPVC as described by Asbeck.

It was found that the largest deviation from 100 per cent pigment dispersion with no pigment clusters occurred just before and just after the ultimate CPVC (UCPVC). A theoretical relationship was also found between the pigment cluster dispersion coefficient, C_q, and CPVC. This result was consistent with the experimental relationship between CPVC and the per cent flow additive as found by Asbeck. The density ratio of overall coating to the pigment density was found to go through a maximum at a global volume fraction of pigment that was slightly greater than the UCPVC as expected for a mechanical property. It was also identified that mechanical failure of most coating formulations should be apparent at either the “Lower Zero Limit” or the “Upper Zero Limit” global volume fraction pigment as defined in this study.

While the experimental measurement of the parameters to isolate the clustering concepts introduced in this study may be difficult, it is expected that better quantitative measurement of clustering concepts will eventually prove to be very beneficial to providing improved suspension applications including coatings.

The theoretical relationship developed in this study between the pigment cluster dispersion coefficient, C_q, and CPVC and the experimental relationship between CPVC and the per cent flow additive found by Asbeck inferred a direct relationship between C_q and the per cent flow additive. Consequently, it was shown that the theoretical pigment cluster model developed in this study could be directly related to the experimental matrix additive composition in a coating formulation. The implication is that the measurement tool introduced in this study can provide better measurement and control of clustering in coatings and other suspension applications.

In this study, a new successful derivation utilizing some of the original concepts of Fishman et al. was generated and shown to result in a practical and much more useable analytical analysis of the clustering concept. This new model was then applied directly to quantify the influence of flow agents or surfactants in a coating formulation on the CPVC as described by Asbeck.

This paper aims to present experimental and numerical analyses of fused filament fabrication (FFF) printed parts and show how mechanical characteristics of printed ABS-MG94 (acrylonitrile butadiene styrene) are influenced by the void volume fraction, cooling rate and residual thermal stresses.

Printed specimens were experimentally tested to evaluate the mechanical properties for different printing speeds, and micrographs were taken. A thermo-mechanical finite element model, able to simulate the FFF process, was developed to calculate the temperature fields in time, cooling rate and residual thermal stresses. Finally, the experimental mechanical properties and the microstructure distribution could be explained by the temperature fields in time, cooling rate and residual thermal stresses.

Micrographs revealed the increase of void volume fraction with the printing speed. The variations on voids were associated to the temperature fields in time: when the temperatures remained high for longer periods, less voids were generated. The Young's Modulus of the deposited filament varied according to the cooling rate: it decreased when the cooling rate increased. The influence of the residual thermal stresses and void volume fraction on the printed parts failure was also investigated: in the worst scenarios evaluated, the void volume fraction reduced the strength in 9 per cent, while the residual thermal stresses reduced it in 3.8 per cent.

This work explains how the temperature fields can affect the void volume fraction, Young's Modulus and failure of printed parts. Experimental and numerical results are shown. The presented research can be used to choose printing parameters to achieve desired mechanical properties of FFF printed parts.

Microstructure void volume fraction is taken into account in finite element models developed for large strain elastoplastic problems. Void nucleation rate is related to matrix effective strain rate, void growth to material strain rate and associated elastoplastic potential available for porous material, void coalescence to matrix effective strain rate. The related radial return algorithm is described. Three types of computations are proposed: first, axisymmetric Q4 element traction are given as validation example; second, collar cylinder compression are computed as reference example; third, bulk forming are analysed as large strain specific example. Void volume fraction and hydrostatic stress are mainly discussed according to microvoids nucleation, growth and coalescence. Finally, the main interests of those computations are enhanced.

In part I of this study a new dry coating analysis was developed relating pigment cluster voids and pigment particle distribution to the pigment cluster dispersion coefficient, C_q, and the critical pigment volume concentration (CPVC). Part II of this study has addressed a wet coating analysis to relate pigment particle size distribution and viscosity in a coating formulation to the pigment cluster dispersion coefficient.

This study introduced the relationships for the wet coating by building on the dry coating evaluations introduced in part I of this study. Part II of this study showed that the CPVC for a solvent based coating can be significantly influenced by a change in the viscosity measured interaction coefficient, σ, as influenced by a change in an additive such as the surfactant concentration in the matrix or polymer phase of the coating. The CPVC was also shown to be strongly influenced by a separate analysis of the pigment particle size distribution to modify the coating viscosity.

It was pointed out recently that an increase in flow additive increased the CPVC but decreased viscosity. Consequently, it was shown theoretically in this study that viscosities compared at the same relative viscosity, η/η₀, and at the same filler composition, f_i, using the generalized viscosity model would require decrease in the interaction coefficient, σ, to increase the global volume fraction of filler or pigment, Φ_F. This implied that a measurement of the interaction coefficient, σ, should be a direct measure of the ability of the CPVC to be modified. A minimum viscosity from the generalised viscosity model also resulted at the maximum packing fraction, which in turn was found to increase the CPVC of the coating. Consequently, part II of this study has yielded a useful relationship between the cluster dispersion coefficient, C_q, and the interaction coefficient, σ, from the generalised viscosity model.

While the experimental measurement of the parameters to isolate the clustering concepts introduced in this study may be difficult, it is expected that better quantitative measurement of clustering concepts will eventually prove to be very beneficial to providing improved suspension applications including coatings. The close relationship introduced in this study between clustering concepts and viscosity should provide an improved ability to measure the parameters to isolate clustering in coatings and other suspension applications.

The theoretical relationship developed in this study between the pigment cluster dispersion coefficient, C_q, and CPVC and the theoretical and experimental relationship between CPVC and the viscosity interaction coefficient, σ, inferred a direct relationship between C_q and the viscosity interaction coefficient, σ. Consequently, it was shown that the theoretical pigment cluster model developed in this study could be directly related to the experimental matrix additive composition controlling viscosity in a coating formulation. The practical implication is that the measurement tools introduced in this study should significantly influence future suspension formulations to provide better measurement and control of clustering and viscosity in coatings and other suspension applications.

Part II of this study has shown how a useful relationship can be generated between the interaction coefficient, σ, from the generalised viscosity model and the pigment cluster dispersion coefficient, C_q, developed in part I of this study. In addition, this study also showed that effective control of the CPVC of a coating can be modified by judicious control of the interaction coefficient using pigment particle size distribution and/or viscosity control additives in a wet coating analysis.

This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.

Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.

The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.

This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.

The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

The mechanisms for void formation are investigated for applications involving solder paste in surface mount technology. Generally, voids are caused by the outgassing of entrapped flux in the sandwiched solder during reflow. The voiding is dictated mainly by the solderability of metallisation, and increases with decreasing solderability of metallisation, decreasing flux activity, increasing metal load of powder, and increasing coverage area under the lead of the joint. Decrease in the solder powder particle size has only a slightly negative effect on voiding. The data indicate that voiding is also a function of the timing between the coalescing of solder powder and the elimination of immobile metallisation oxide. The sooner the paste coalescence occurs, the worse the voiding will be. Increase in voiding is usually accompanied by an increasing fraction of large voids, suggesting that factors causing voiding will have an even greater impact on the joint reliability than shown by the total‐ void‐volume analysis results. Preliminary data suggest that certain predry treatment and flux solvent with higher boiling point appear to cause increased voiding.

The purpose of this paper is to predict the yield locus of porous ductile materials, evaluate the impact of void geometry and compare the computational results with existing analytical models.

A computational homogenization strategy for the definition of the elasto-plastic transition is proposed. Representative volume elements (RVEs) containing single-centred ellipsoidal voids are analysed using three-dimensional finite element models under the geometrically non-linear hypothesis of finite strains. Yield curves are obtained by means of systematic analysis of RVEs considering different kinematical models: linear boundary displacements (upper bound), boundary displacement fluctuation periodicity and uniform boundary traction (lower bound).

The influence of void geometry is captured and the reduction in the material strength is observed. Analytical models usually overestimate the impact of void geometry on the yield locus.

This paper proposes an alternative criterion for porous ductile materials and assesses the accuracy of analytical models through the simulation of three-dimensional finite element models under geometrically non-linear hypothesis.

Voiding in BGA assembly using SN63 solder bumps is primarily introduced at board‐level assembly stage. On the pretinned PCBs, voiding of BGA joints increases with increasing solvent volatility, increasing metal content and increasing reflow temperature, and with decreasing powder size. This can be explained by a viscosity dictated flux‐exclusion‐rate model. In this model, a higher viscosity in the fluxing medium at reflow temperature could hinder the exclusion of flux from the interior of the molten solder, hence increase the chance of outgassing due to the increasing amount of entrapped flux, and consequently result in higher voiding in BGA assembly. Flux activity and reflow atmosphere appear to have a negligible effect on voiding when the solderability of the immobile metallisation is not a concern. An increase in void content is accompanied by an increase in the fraction of large voids. This suggests that, similar to voiding phenomena in the SMT process, factors causing voiding in BGA will have an even greater impact on joint reliability than shown by the total‐void‐volume analysis results.

3D printing techniques such as material extrusion based additive manufacturing provide a promising and cost effective manufacturing technique. However, the main challenges in industrial applications remain with the quality assurance of mass produced parts. The purpose of this study is to investigate the effect of compression moulding as a rapid consolidation method for 3D printed composites, with an aim to reduce voids and defects and thus improving quality assurance of printed parts.

To develop an understanding of the inherent voids in 3D parts and the influence on mechanical properties, material extrusion additively manufactured (MEX) parts were post consolidated by using compression moulding at elevated temperature.

This study comparatively investigates the influence of carbon fibre length, undergoing process induced scission during filament extrusion and IM and its impact on void content and mechanical properties. It was found that the post consolidation significantly reduced the voids and the mechanical properties were significantly improved compared to the nonconsolidated material extrusion additively manufactured parts, reaching values similar to those of the IM parts.

Adaptation of extrusion-based additive manufacturing with hybridisation of reliable compression moulding technology transcends into series production of highly adaptive end user applications, such as drones, advanced sports prosthetics, competitive cycling and more.

This paper adds to the current understanding of 3D printing and provides a step towards quality assurance for mass production.

The present investigation aims to examine the reflection of plane waves from a free surface of a thermodiffusive elastic half space with void.

Generalized theory of thermoelasticity developed by Lord‐Shulma was used to investigate the problem. The amplitude ratios of various reflected waves are obtained in a closed form. The dependence of these amplitude ratios with an angle of propagation as well as other material parameter are shown graphically.

Effects of void and diffusion are observed on these amplitude ratios and have been found to be significant.

It is found that there exist four longitudinal waves (namely P‐wave, thermal wave (T‐wave), mass diffusion wave (MD‐wave), volume fraction wave (VF‐wave, carrying a change in void volume fraction) and a transverse SV wave). Some special cases of interest are also deduced from the present investigation.