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The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This paper aims to investigate the influence of scan speed on the corrosion and tribocorrosion features of the CoCrMoW samples fabricated via the selective laser melting (SLM) process.

CoCrMoW samples were produced by SLM at different scan speeds. Produced samples were made via structural surveys (X-ray diffraction examinations and scanning electron microscopic analyses), hardness measurements and electrochemical and tribocorrosion experiments.

Outcomes displayed that the corrosion and tribocorrosion properties of CoCrMoW alloy were significantly influenced by scanning speeds. Also, these properties of the alloy increased with increasing scanning speeds. CoCrMoW samples produced at a laser scan speed of 1,000 mm/s showed the best resistance to corrosion and tribocorrosion. This could be related to the high hardness and low grain structure of the fabricated samples.

This paper may be a practical reference and offers insight into the effect of scanning speeds on the increase of hardness, tribological and corrosion performance of CoCrMoW alloys. This study can help in the further advancement of cobalt-chromium alloy in situ produced by SLM for both electrochemical and tribocorrosion behavior for biomedical applications.

This paper aims to investigate the preparation of AlN and Al₂O₃, as well as the effect of nano-AlN and nano-Al₂O₃, on friction and wear properties of copper-steel clad plate immersed in the lubricants.

Nano-AlN or nano-Al₂O₃ (0.1, 0.2, 0.3, 0.4 and 0.5 Wt.%) functional fluids were prepared. Their tribological properties were tested by an MRS-10A four-ball friction tester and a ball-on-plate configuration, and scanning electron microscope observed the worn surface of the plate.

An increase in nano-AlN and Al₂O₃ content enhances the extreme pressure and anti-wear performance of the lubricant. The best performance is achieved at 0.5 Wt.% of nano-AlN and 0.3 Wt.% of nano-Al₂O₃ with PB of 834 N and 883 N, a coefficient of friction (COF) of approximately 0.07 and 0.06, respectively. Furthermore, the inclusion of nano-AlN and nano-Al₂O₃ particles in the lubricant enhances its extreme pressure performance and reduces wear, leading to decreased wear spot depth. The lubricating effect of the nano-Al₂O₃ lubricant on the surface of the copper-steel composite plate is slightly superior to that of the nano-AlN lubricant, with a COF reaching 0.07. Both lubricants effectively fill and lubricate the holes on the surface of the copper-steel composite plate.

AlN and Al₂O₃ as water-based lubricants have excellent lubrication performance and can reduce the COF. It can provide some reference for the practical application of nano-water-based lubricants.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-08-2023-0255/

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

In this paper, the authors aim to study the effect of hydrogen on the pitting corrosion behavior of Incoloy 825, a commonly used material for heat exchanger tubes in hydrogenated heat exchangers.

The pitting initiation and propagation behaviors were investigated by electrochemical and chemical immersion experiments and observed and analyzed by scanning electron microscope and energy dispersive spectrometer methods.

The results show that hydrogen significantly affects the electrochemical behavior of Incoloy 825; the self-corrosion potential decreased from −197 mV before hydrogen charging to −263 mV, −270 mV and −657 mV after hydrogen charging, and the corrosion current density increased from 0.049 µA/cm² before hydrogen charging to 2.490 µA/cm², 2.560 µA/cm² and 2.780 µA/cm² after hydrogen charging. The pitting susceptibility of the material increases.

Hydrogen is enriched on the precipitate, and the pitting corrosion also initiates at that location. The synergistic effect of hydrogen and precipitate destroys the passive film on the metal surface and promotes pitting initiation.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.