Search results

1 – 10 of 163
Open Access
Article
Publication date: 16 July 2020

Tomasz Matusiak, Arkadiusz Dabrowski and Leszek Golonka

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

1275

Abstract

Purpose

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

Design/methodology/approach

Graphite-based resistors were made of thick-film pastes with different graphite-to-glass mass fraction were prepared and examined. Sheet resistance, temperature coefficient of resistance, impact of humidity and short-term overload were investigated. The properties of the layers fired in atmospheres of air at 550°C and nitrogen at 875°C were compared.

Findings

Graphite-based resistors with various graphite-to-glass ratios made possible to obtain a wide range of sheet resistance from single O/square to few kO/square. These values were dependent on firing atmosphere, paste composition and the number of screen-printed layers. The samples made of paste with 1:1 graphite-to-glass ratio exhibited the temperature coefficient of resistance of about −1,000 ppm/°C, almost independently on the firing atmosphere and presence of a top coating. The resistors fired in the air after coating with overglaze, exhibited significantly lower sheet resistance, reduced impact of humidity and improved power capabilities.

Originality/value

In this paper, graphite-based resistors for applications in typical high-temperature cermet thick-film circuits were presented, whereas typical graphite-based resistors were fabricated in polymer thick-film technology. Owing to very low cost of the graphite, the material is suitable for low-power passive circuits, where components are not subjected into high temperature, above the typical temperature of operation of standard electronic components.

Details

Circuit World, vol. 47 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Open Access
Article
Publication date: 28 January 2022

Kiranmai Uppuluri and Dorota Szwagierczak

The purpose of this work was to characterize NiMn2O4 spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their…

1066

Abstract

Purpose

The purpose of this work was to characterize NiMn2O4 spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their performance for different sintering temperatures of thermistor layer, with and without insulative cover, as well as to investigate stability of the fabricated thermistors and their applicability in water quality monitoring.

Design/methodology/approach

After the characterization of starting NiMn2O4 spinel-based thermistor powder, it was converted to thick film paste which was screen printed on alumina substrate. Thermistor layers were sintered at four different sintering temperatures: 980°C, 1050°C, 1150°C and 1290°C. An interdigitated pattern of Ag-Pd conductive layer was used to reduce the resistance. Temperature-resistance characteristics were investigated in air and water, with and without insulative cover atop the thermistor layer. Stability of the fabricated thermistors after aging at 120°C for 300 h was also examined.

Findings

Thick film NiMn2O4 spinel thermistors, prepared by screen printing and sintering in the temperature range 980°C–1290°C, exhibited good negative temperature coefficient (NTC) characteristics in the temperature range −30°C to 145°C, including high temperature coefficient of resistance, good stability and applicability in water.

Originality/value

This study explores the range of sintering temperature that can be applied for NiMn2O4 thermistor thick films without compromising on the temperature sensing performance in air and water, as well as stability of the thermistors after aging at elevated temperatures.

Details

Sensor Review, vol. 42 no. 2
Type: Research Article
ISSN: 0260-2288

Keywords

Content available
Article
Publication date: 1 November 2006

66

Abstract

Details

Aircraft Engineering and Aerospace Technology, vol. 78 no. 6
Type: Research Article
ISSN: 0002-2667

Keywords

Content available

Abstract

Details

Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 April 1999

35

Abstract

Details

Microelectronics International, vol. 16 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 May 2006

Martin Goosey

328

Abstract

Details

Circuit World, vol. 32 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Content available

Abstract

Details

Microelectronics International, vol. 18 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 May 2006

Brian Ellis

89

Abstract

Details

Circuit World, vol. 32 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 August 2003

Brian Ellis

35

Abstract

Details

Microelectronics International, vol. 20 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 August 2003

27

Abstract

Details

Microelectronics International, vol. 20 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Access

Only content I have access to

Year

Content type

1 – 10 of 163