Search results

With the discussion on the linear relationship of determined material parameters, this study aims to propose a new method to analyze the deformation mechanism.

A modified constitutive model based on the hyperbolic sine Arrhenius equation has been established, which is applied to describe the flow behavior of Ti-6Al-4V alloy during the superplastic forming (SPF).

The modified constitutive model in this work has a good ability to describe the flow behavior for Ti-6Al-4V in SPF. Besides, a deformation map of titanium material is obtained based on the parameters. As the supplement, finite element models of high-temperature tensile tests are carried out as the application of the constitutive model.

The relationship between constitutive model parameters and forming mechanism is established, which is a new angle in rheological behavior research and constitutive model analysis.

BRITAIN's new metal—superplastic aluminium—is making headway in some of the most sophisticated industries, from aeronautics to computers. The unique properties of the new material, which allows complex components to be formed in one operation, is cutting costs for an increasing number of customers.

This paper reviews the status of lead‐free solder development works. Some of the solder systems — Bi‐Sn, Bi‐Sn‐Fe, ln‐Sn, Sn, Sn‐Ag, Sn‐Ag‐Zn, Sn‐Ag‐Zn‐Cu, Sn‐Bi‐Ag, Sn‐Cu, Sn‐Cu‐Ag, Sn‐In‐Ag, Sn‐Sb, Sn‐Zn and Sn‐Zn‐ln — are discussed in more detail, while others are briefly commented on. In general, compared with eutectic Sn‐Pb solder, all the lead‐free solder alternatives investigated more or less exhibit some shortcomings, such as price, physical, metallurgical or mechanical properties. Relatively, Sn‐ln‐containing systems are more promising in terms of solder mechanical properties and soldering performance, although the price of ln may be a concern. Eutectic Sn‐Ag solder doped with Zn, Cu or Sb exhibits good mechanical strength and creep resistance, due to refined microstructure. The Bi‐Sn systems doped with other elements may have a niche in the low temperature soldering field. Eutectic Sn‐Cu has good potential due to its good fatigue resistance. The eutectic Sn‐Zn system modified with ln and/or Ag may be promising in terms of mechanical properties. Finding a lead‐free alternative for high temperature solders presents the biggest challenge to the industry.

Quasi shear and tensile mode stress‐rupture and quasi shear mode creep behaviours were investigated for aged production surface mount soldered connections of 127 mm pitch, rigid gullwing and J‐bend configurations at ambient and 60°C (on limited specimens) environments. These joints were manufactured by the vapour phase reflow soldering process using a 63Sn‐37Pb solder composition. Metallographic examinations and fractrographic studies were also performed on appropriate specimens to characterise the metallurgical attributes of the solder and the joint failure. A relatively coarse solder microstructure was observed with both joint configurations. The steady‐state creep data of both soldered joints exhibited two distinct creep regimes. A grain boundary‐controlled regime at low loads with a slope of 042 for gullwing and 0?50 for J‐bend joints was followed by a dislocation climb‐controlled regime at high loads with a slope of 0?13 and 0?24 for gullwing and J‐bend configurations, respectively. The log‐log plot of applied load varied linearly with rupture time for the entire load range for the respective soldered joints for both modes of testing at room temperature. A transgranular fracture morphology was found to predominate for the entire load regime for the quasi shear mode tested gullwing joints. A mixed‐mode fracture morphology with predominantly transgranular features was observed for both low and high loading conditions for quasi shear mode tested J‐bend specimens. The steady‐state creep elongation in shear showed a strong dependence on the applied load for both types of soldered joints. This was primarily attributed to the presence of relatively large creep transients, especially at higher loads.

Several finite element models were proposed to investigate the effects of voids and their interactions on SMT solder joint reliability in thermal mismatch loading. Both linear elastic analysis and non‐linear and time‐dependent finite element analysis were performed on models with different sizes and locations of voids in solder joints. The focus was on the interactions of the two voids. Various distances between voids are considered. Constitutive equations accounting for both plasticity and creep for one solder material were assumed and implemented in a finite element program. The following observations have been obtained: (i) the stress and strain in a solder joint of two voids are different from those of a one void joint; (ii) the stress and strain reach a maximum for a particular void size and location either along the interface of the solder joint or at the edges of voids; (iii) the initiation of interfacial debonding may be induced by the interaction of the voids; (iv) creep due to thermal cycling has a significant effect on solder joint reliability.

The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature.

Tensile tests with different strain rates of 1.5 × 10⁻⁶, 1.5 × 10⁻⁵, 1.5 × 10⁻⁴, 1.5 × 10⁻³, 1.5 × 10⁻² and 1.5 × 10⁻¹ s⁻¹ at room temperature of 25°C were carried out on lead-free Sn-3.0Ag-0.5Cu (SAC305) solder wire. Stress-strain curves and mechanical properties such as yield strength, ultimate tensile strength and elongation were determined from the tensile tests. A microstructure analysis was performed by measuring the average grain size and the aspect ratio of the grains.

It was observed that higher strain rates showed pronounced dynamic recrystallization on the stress-strain curve. The increase in the strain rates also decreased the grain size of the SAC305 solder wire. It was found that higher strain rates had a pronounced effect on changing the deformation or shape of the grain in a longitudinal direction. An increase in the strain rates increased the tensile strength and ductility of the SAC solder wire. The primary deformation mechanism for strain rates below 1.5 × 10⁻¹ s⁻¹ was grain boundary sliding, whereas the deformation mechanism for strain rates of 1.5 × 10⁻¹ s⁻¹ was diffusional creep.

Most of the studies regarding the deformation behaviour of lead-free solder usually consider the effect of the elevated temperature. For the current analysis, the effect of the temperature is kept constant at room temperature to analyze the deformation of lead-free solder wire solely because of changes of strain rates, and this is the originality of this paper.

Aerospace industry was pioneered in the use of superplastic forming (SPF) process. Weight saving is the most important need in this industry. For this reason, there is special attention paid to this method. Blow forming is a common method for SPF process. Process parameters such as temperature and pressure have significant effects on part accuracy, quality and desired characteristics. The purpose of this paper is to present a numerical and experimental investigation of process parameters in superplastic free bulge forming.

In this paper, superplastic free bulge forming of Al‐5083 has been studied. First, free bulge tests have been done at two different pressures. Bulge height variations were recorded for different pressure and temperature. The forming time was determined according to the forming pressure and temperature. Then, simulation of free bulge process has been carried out using creep behavior model at high temperature. Bulge height and thickness distribution are obtained at two different pressure settings. These results have been compared with experimental results presenting a good agreement. Also the effects of temperatures and pressure on the required process time are compared for a certain bulge height. Finally, thickness distribution profile for different temperatures, pressures and initial thicknesses have been studied.

A numerical and experimental investigation has been presented that can be used to study the process parameters. These findings show the effects of temperatures, pressure and initial thicknesses on sheet forming.

The results of this work show that higher temperature and forming pressure will reduce the required process time for a certain bulge height. Reduction of these parameters can improve thickness distribution. Also, by considering the effects of both pressure and temperature, it is shown that using lower forming pressure at higher temperature is more suitable for forming. The findings of this work can provide more understanding of the process for aircraft part designers and manufacturing process planners.

To analyse the heating process of an aluminum billet rotating in a static magnetic field produced by superconducting coils.

The idea is to force the billet to rotate in a static magnetic field produced by a DC superconducting magnet. Since, a static superconducting magnet has no losses, the efficiency of the system is the efficiency of the motor used. In order to evaluate the temperature distribution arising from the field profile produced by a given coil configuration, a numerical model, based on an equivalent electric network with temperature‐dependent parameters, is used.

The main heating parameters, i.e. heating time, total power injected and temperature difference, are evaluated for different values of angular velocity and magnetic field. The field profile suitable to meet the specifics of an industrial heating process in terms of temperature homogeneity and heating time is determined. Starting form this profile the layout of the magnet is arrived at and some considerations on the operating condition of the superconducting windings are reported.

The mechanical stress in the billet due to weight, centrifugal effects, applied torque and resonance is examined by taking into account the weakening of the material properties with the increase of temperature and the practical limits of the heating process are evaluated.

DC induction heating of aluminum billet using superconducting magnets can be done fulfilling the specifics of the industrial processes.

A high‐efficiency induction heater for aluminum billets using superconducting coils in a novel scheme is investigated.

The purpose of this paper is to analyse the heating process of an aluminum billet rotating in a static magnetic field produced by optimized supercoducting coils.

In order to meet the technical specifications of industrial heating, many processes with low speed in the given high magnetic field have been simulated. The mechanical stresses in the billet are examined by taking into account the temperature dependence of the mechanical properties.

The main heating parameters, i.e. heating time, average temperature and temperature homogeneity, are evaluated for different values of angular velocity. The simulation results show that an optimal angular speed can be chosen with respect to the heating time.

The mechanical stress in the billet due to weight, centrifugal effects, applied torque and resonance is examined by taking into account the weakening of the material properties with the increase of temperature. The practical limits of the heating process are evaluated; while resonance does not seem to be a concern, the safety against yielding, in order to avoid plastic deformation of the billet during the heating, seems to be a constraint.

DC induction heating of aluminum billet using superconducting magnets can be done fulfilling the specifics of the industrial processes.

The operational and mechanical constraints on a high‐efficiency DC induction heater for aluminum billets using superconducting coils are investigated.

This paper gives a review of the finite element techniques (FE) applied in the area of material processing. The latest trends in metal forming, non‐metal forming, powder metallurgy and composite material processing are briefly discussed. The range of applications of finite elements on these subjects is extremely wide and cannot be presented in a single paper; therefore the aim of the paper is to give FE researchers/users only an encyclopaedic view of the different possibilities that exist today in the various fields mentioned above. An appendix included at the end of the paper presents a bibliography on finite element applications in material processing for 1994‐1996, where 1,370 references are listed. This bibliography is an updating of the paper written by Brannberg and Mackerle which has been published in Engineering Computations, Vol. 11 No. 5, 1994, pp. 413‐55.