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Analysis of the thermal effects during the packaging process or in the actual operating environment is necessary to develop small monolithic integrated sensing chips with heterogeneous integration. The use of multiple layers and various materials in monolithic integrated sensing chips addresses the coefficient of thermal expansion (CTE) mismatch issue. The purpose of this study is to focus on the residual stress analysis of the shielding electrode, which is a metal film that prevents pull-in of proof-mass during anodic bonding in microelectromechanical system (MEMS) chips with pressure sensors embedded in an accelerometer.

The finite element model of the chip was built by the commercial software ANSYS, and the residual stress was evaluated during the die attachment process for the shielding electrode. Various shielding electrode materials and a proposed design with a keep-out zone to reduce the residual stress are discussed, with a focus on the relationship between the geometric parameters of the chip and the residual stress for copper shielding electrodes of different thicknesses.

The results of the finite element analysis showed that the use of polysilicon as a shielding electrode in the proposed design generated the lowest residual stress because of its low CTE. The maximum stresses in both of in-plane and out-of-plane directions in the finite element model were reduced by keep-out zone design for the proposed design of the copper shielding electrode, and had 11 times reduction in out-of-plane direction especially, according to the nonlinear analysis as the stress concentration point in the shielding electrode moved. Moreover, the design with a thinner shielding electrode, thinner glass substrate and higher CTE of the glass substrate also lowered the maximum von Mises stress. On the other hand, the stress level during the operating temperature, without considering residual stress, overestimated up to five times in the proposed design.

In this study, valuable suggestions are proposed for the design of chips with pressure sensors embedded in accelerometers.

This study aims to design and validate a theoretical model for capacitive imaging (CI) sensors that incorporates the interelectrode shielding and surrounding shielding electrodes. Through experimental verification, the effectiveness of the theoretical model in evaluating CI sensors equipped with shielding electrodes has been demonstrated.

The study begins by incorporating the interelectrode shielding and surrounding shielding electrodes of CI sensors into the theoretical model. A method for deriving the semianalytical model is proposed, using the renormalization group method and physical model. Based on random geometric parameters of CI sensors, capacitance values are calculated using both simulation models and theoretical models. Three different types of CI sensors with varying geometric parameters are designed and manufactured for experimental testing.

The study’s results indicate that the errors of the semianalytical model for the CI sensor are predominantly below 5%, with all errors falling below 10%. This suggests that the semianalytical model, derived using the renormalization group method, effectively evaluates CI sensors equipped with shielding electrodes. The experimental results demonstrate the efficacy of the theoretical model in accurately predicting the capacitance values of the CI sensors.

The theoretical model of CI sensors is described by incorporating the interelectrode shielding and surrounding shielding electrodes into the model. This comprehensive approach allows for a more accurate evaluation of the detecting capability of CI sensors, as well as optimization of their performance.

The aim of this study was to prove that radio-frequency (RF) energy with 13.56 MHz can be used for heating building structures in a controlled manner exploiting the advantage that homogeneous heating with sufficient penetration depths can be achieved.

Because parallel electrodes on both sides of the heated structure cannot be used in many practical applications, two special electrode designs have been developed by modeling the field distribution and energy absorption and by carrying out test experiments to validate the simulation results.

One solution is based on a two-dimensional surface capacitor providing certain penetration depths and being especially suitable for treating thin structures such as wooden parquet floor. Such an arrangement can be particularly used for pest control even when sensitive surfaces have to be protected. The other solution uses a capacitive coupling between the grounded shielding and an electrode or an equivalent structure (e.g. moist soil) at the other side of the masonry to establish a sufficiently strong electrical field between a “hot” electrode on the side of the shielding and the coupled rear electrode.

Both solutions significantly enhance the application potential of RF heating.

The purpose of this paper is to consider the optimization of an 8‐electrode cylindrical electrical capacitance tomography (ECT) sensor. The aim is to obtain maximum uniformity and value of the sensitivity distribution of the sensor, while keeping the mutual capacitances between the electrodes above a predefined level.

The optimization methods that have been used are response surface methodology, genetic algorithm and a combination of both.

As results, optimum dimensions for the gap, mounting pipe, shield and insulation are determined, which ensure more uniform distribution of sensitivity in the sensing area.

The optimization strategies used – RSM and the combined RSM+GA – make the optimization of ECT sensors feasible. The results show the effectiveness of the RSM+GA strategy which could also be used for optimization of 3D multilayer ECT sensors.

The purpose of this paper is to present the sensing mechanism, design issues, performance evaluation and applications for planar capacitive sensors. In the context of characterisation and imaging of a dielectric material under test (MUT), a systematic study of sensor modelling, features and design issues is needed. In addition, the influencing factors on sensitivity distribution, and the effect of conductivity on sensor performance need to be further studied for planar capacitive sensors.

While analytical methods can provide accurate solutions to sensors of simple geometries, numerical modelling is preferred to obtain sensor response to different design parameters and properties of MUT, and to derive the sensitivity distributions of various electrode designs. Several important parameters have been used to evaluate the response of the sensors in different sensing modes. The designs of different planar capacitive sensor arrays are presented and experimentally evaluated.

The response features and design guidelines for planar capacitive sensors in different sensing modes have been summarised, showing that the sensor in the transmission mode or the single‐electrode mode is suitable for material characterisation and imaging, while the sensor in the shunt mode is suitable for proximity/displacement measurement. The sensitivity distribution of the sensor depends largely on the geometry of the electrodes. Conductivity causes positive changes for the sensor in the transmission and single‐electrode mode, but negative changes for the sensor in the shunt mode. Experimental results confirm that sensing depths of the sensor arrays and the influence of buried conductor on capacitance measurements are in agreement with simulations.

Experimental verification is needed when a sensor is designed.

This paper provides a comprehensive study for planar capacitive sensors in terms of sensor design, evaluation and applications.

Introduces the fourth and final chapter of the ISEF 1999 Proceedings by stating electric and magnetic fields are influenced, in a reciprocal way, by thermal and mechanical fields. Looks at the coupling of fields in a device or a system as a prescribed effect. Points out that there are 12 contributions included ‐ covering magnetic levitation or induction heating, superconducting devices and possible effects to the human body due to electric impressed fields.

The purpose of the study is to evaluate Cr-Mn ASS weld using different heat inputs for its microstructure, mechanical properties and electrochemical behavior. The microstructural examination used optical and scanning electron microscopy. It was observed that ferrite content decreases with increasing heat input. The length of dendrites, inter-dendritic space and volume of lathy ferrite increase with increasing heat input. The increasing heat input caused grain coarsening near the fusion boundary and produced wider heat-affected zone (HAZ). It also decreases hardness and tensile strength. This is attributed to formation of more δ ferrite in the weld. The electrochemical evaluation suggested that the δ ferrite helps in improving the pitting potential in 3.5 per cent NaCl solution saturated with CO₂. Whereas in 0.5-M H2SO4 + 0.003-M NaF solution, higher passivation current density was observed because of dissolution of dferrite. The interphase corrosion resistance decreased with increasing heat input.

The Cr-Mn austenitic stainless steel or low-nickel ASS was procured in form of 3-mm sheets in rolled condition. The tungsten inert gas welding was performed at three different heat inputs (100 A, 120 A and 140 A), argon as shielding gas with a flow rate of 15 L/min. Different welded regions were observed using optical microscope and scanning electron microscope. Electrochemicals test were performed in solutions containing 3.5 per cent NaCl with saturated CO₂ solution and 0.5 M sulfuric acid + 0.003 M NaF at a scan rate of 0.1667 mV/s at room temperature (30 °C ± 1 °C) using a potentiostat.

The test steel Cr-Mn ASS is suitable with the selected electrode (308 L) and it produces no defects. Vermicular ferrite and lathy ferrite form in welds of various heat inputs. The increase in heat input reduces the formation of lathy ferrite. The width of HAZ and un-mixed zone increases with increase in heat input. The weld zone of low heat input (LHI) has the highest hardness and tensile strength because of higher δ ferrite content and small grain size in the weld zone. The hardness at high heat input (HHI) is found to be lowest because of grain coarsening in the weld. With increase in δ ferrite, the pitting resistance increases. In 0.5-M sulfuric acid + 0.003-M NaF, the increase in ferrite content reduces the passivation current density. Interphase corrosion resistance increases with increase in δ ferrite content as higher per cent degree of sensitization was observed in LHI welds as compared to medium heat input and HHI welds.

This work focuses on welding of ASS by tungsten inert gas welding at different heat inputs. Welding is a critical process for joining metals in most of the fabrication industries and proper heat input is required for getting desired microstructure in the weld metal. This would highly affect the strength and corrosion behavior of the alloy. This paper would give an understanding of how the change in heat input by tungsten inert gas welding affects the microstructural and corrosion behavior in the weld metal.

In common with many engaged in engineering manufacture, the welding fabricator is under continuing pressure to increase productivity in order to remain competitive in home and international markets.

With the development of artificial intelligence, proximity sensors show their great potential in intelligent perception. This paper aims to propose a new planar capacitive sensor for the proximity sensing of a conductor.

Different from traditional structures, the proposed sensor is characterized by sawtooth-structured electrodes. A series of numerical simulations have been carried out to study the impact of different geometrical parameters such as the width of the main trunk, the width of the sawtooth and the number of sawtooths. In addition, the impact of the lateral offset of the approaching graphite block is investigated.

It is found that sensitivity is improved with the increase of the main trunk with, sawtooth width and sawtooth number while a larger lateral offset leads to a decrease in sensitivity. The performance of the proposed planar capacitive proximity sensor is also compared with two conventional planar capacitive sensors. The results show that the proposed planar capacitive sensor is obviously more sensitive than the two conventional planar capacitive sensors.

In this paper, a new planar capacitive sensor is proposed for the proximity sensing of a conductor. The results show that the capacitive sensor with the novel structure is obviously more sensitive than the traditional structures in the detection of the proximity conductor.

The purpose of this paper is to calculate the two‐dimensional (2D) centre position of objects with known shapes based on the reconstruction image of a square sensing area estimated with simulated and measured data by using electrical capacitance tomography (ECT).

A 2D electrostatic finite element model is used to calculate the capacitances between electrode pairs. A reconstruction algorithm with low computation time provides suitable images for subsequent image processing techniques. The results based on numerical data are verified by measurements.

It is possible to calculate the centre position of up to four rods (cross‐sectional area about 5 per cent of the measuring area) with an accuracy of 3 per cent in both coordinate directions related to the dimensions of the measuring area.

The paper presents an efficient method for position determination of several objects with known shape and uniform permittivity distribution by using ECT measurements with low‐cost electronic for industrial application.