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This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

Induction heating processes need to adapt to complex geometries or variable processes that require a high degree of flexibility in the induction heating setup. This is usually done using complex inductors or adaptable resonant tanks, which leads to costly and constrained implementations. This paper aims to propose a multi-level, versatile power supply able to adapt the output to the required induction heating process.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The methodology followed includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and laboratory tests after building a 10-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 1 kVpp and 100 A at 250 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced tests and processes on induction heating system. The proposed system allows for multifrequency generation using a single inductor and converter, or advanced tests for inductive and capacitive components used on induction heating systems. Unlike previous multifrequency proposals, the proposed generator enables a significantly improved versatility in terms of operational frequency and amplitude in a single converter.

As data centres grow in size and complexity, traditional air-cooling methods are becoming less effective and more expensive. Immersion cooling, where servers are submerged in a dielectric fluid, has emerged as a promising alternative. Ensuring reliable operations in data centre applications requires the development of an effective control framework for immersion cooling systems, which necessitates the prediction of server temperature. While deep learning-based temperature prediction models have shown effectiveness, further enhancement is needed to improve their prediction accuracy. This study aims to develop a temperature prediction model using Long Short-Term Memory (LSTM) Networks based on recursive encoder-decoder architecture.

This paper explores the use of deep learning algorithms to predict the temperature of a heater in a two-phase immersion-cooled system using NOVEC 7100. The performance of recursive-long short-term memory-encoder-decoder (R-LSTM-ED), recursive-convolutional neural network-LSTM (R-CNN-LSTM) and R-LSTM approaches are compared using mean absolute error, root mean square error, mean absolute percentage error and coefficient of determination (R²) as performance metrics. The impact of window size, sampling period and noise within training data on the performance of the model is investigated.

The R-LSTM-ED consistently outperforms the R-LSTM model by 6%, 15.8% and 12.5%, and R-CNN-LSTM model by 4%, 11% and 12.3% in all forecast ranges of 10, 30 and 60 s, respectively, averaged across all the workloads considered in the study. The optimum sampling period based on the study is found to be 2 s and the window size to be 60 s. The performance of the model deteriorates significantly as the noise level reaches 10%.

The proposed models are currently trained on data collected from an experimental setup simulating data centre loads. Future research should seek to extend the applicability of the models by incorporating time series data from immersion-cooled servers.

The proposed multivariate-recursive-prediction models are trained and tested by using real Data Centre workload traces applied to the immersion-cooled system developed in the laboratory.

This paper aims to explore the past and future impacts of automation on family businesses, with a focus on the opportunities for human capital empowerment.

This paper draws upon a contemporary literature search to examine a range of scholarly and practitioner perspectives of the challenges and benefits of automation, exploring the evolvement towards hyperautomation and the empowerment of human capital in family businesses.

Automation, transforming to hyperautomation, general purpose artificial intelligence (AI) and beyond has the possibility of radically improving productivity. Fear of job obsolescence has been present since the birth of modern automation, and whilst some jobs are at risk of redundancy, a net gain towards higher-skilled labour is already evident. Family business leaders must be prepared to react appropriately to the accelerating war for talent by implementing a strategy for human capital empowerment.

This unique paper synthesises developments in automation and proposes a future perspective centred upon the empowerment of human capital in family businesses.

Plasma technology has become of great interest in a wide variety of industrial and domestic applications. Moreover, the application of plasma in the domestic field has increased in recent years due to its applications to surface treatment and disinfection. In this context, there is a significant need for versatile power generators able to generate a wide range of output voltage/current ranging from direct current (DC) to tens of kHz in the range of kVs. The purpose of this paper is to develop a highly versatile power converter for plasma generation based on a multilevel topology.

This paper proposes a versatile multilevel topology able to generate versatile output waveforms. The followed methodology includes simulation of the proposed architecture, design of the power electronics, control and magnetic elements and test laboratory tests after building an eight-level prototype.

The proposed converter has been designed and tested using an experimental prototype. The designed generator is able to operate at 10 kVpp output voltage and 10 kHz, proving the feasibility of the proposed approach.

The proposed converter enables versatile waveform generation, enabling advanced studies in plasma generation. Unlike previous proposals, the proposed converter features bidirectional operation, allowing to test complex reactive loads. Besides, complex waveforms can be generated, allowing testing complex patterns for optimized cold-plasma generation methods. Besides, unlike transformer- or resonant-network-based approaches, the proposed generator features very low output impedance regardless the operating point, exhibiting improved and reliable performance for different operating conditions.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.