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1 – 10 of 599Priya Singh, Vandana Niranjan and Ashwni Kumar
Recent advancements in the domain of smart communication systems and technologies have led to the augmented developments for very large scale integrated circuit designs in…
Abstract
Purpose
Recent advancements in the domain of smart communication systems and technologies have led to the augmented developments for very large scale integrated circuit designs in electro-magnetic applications. Increasing demands for low power, compact area and superior figure of merit–oriented circuit designs are the trends of the recent research studies. Hence, to accomplish such applications intended for optical communications, the transimpedance amplifier (TIA) was designed.
Design/methodology/approach
In this research work, the authors present a multi-layer active feedback structure which mainly composes a transimpedance stage and a gain stage followed by a low pass filter. This structure enables to achieve improved input impedance and superior gain. A simplified cascaded amplifier has also been designed in a hierarchical topology to improvise the noise effect further. The proposed TIA has been designed using Taiwan Semiconductor Manufacturing Company 45 nm complementary metal oxide semiconductor technology. Moreover, the thermal noise has been analyzed at −3 dB bandwidth to prove the reduction in thermal noise with increase in frequency for most of the devices used in the designed circuit.
Findings
The proposed differential TIA circuit was found to obtain the transimpedance gain of 50.1 dBO without applying any external bias current which is almost 8% improvised as compared to the conventional circuit. In addition to this, bandwidth achieved was 2.15 GHz along with only 38 W of power consumption, which is reasonably 100 times improvised in comparison of conventional circuit. Hence, the proposed differential TIA is suitable for the low power optical communications applications intended to work on low supply voltage.
Originality/value
The designed work is done by authors in university lab premises and is not copied from anywhere. To the best of the authors’ knowledge, it is 100% original.
Details
Keywords
- Power consumption
- Bandwidth
- Noise analysis
- Optical communication system
- Thermal noise
- 2C transimpedance amplifier
- −3 dB bandwidth
- Input impedance
- Transimpedance gain
- Cascaded amplifier
- Active feedback
- Optical receivers
- Push pull inverter
- Average noise density
- Corner analysis
- Process voltage temperature analysis
Fei Shang, Bo Sun and Dandan Cai
The purpose of this study is to investigate the application of non-destructive testing methods in measuring bearing oil film thickness to ensure that bearings are in a normal…
Abstract
Purpose
The purpose of this study is to investigate the application of non-destructive testing methods in measuring bearing oil film thickness to ensure that bearings are in a normal lubrication state. The oil film thickness is a crucial parameter reflecting the lubrication status of bearings, directly influencing the operational state of bearing transmission systems. However, it is challenging to accurately measure the oil film thickness under traditional disassembly conditions due to factors such as bearing structure and working conditions. Therefore, there is an urgent need for a nondestructive testing method to measure the oil film thickness and its status.
Design/methodology/approach
This paper introduces methods for optically, electrically and acoustically measuring the oil film thickness and status of bearings. It discusses the adaptability and measurement accuracy of different bearing oil film measurement methods and the impact of varying measurement conditions on accuracy. In addition, it compares the application scenarios of other techniques and the influence of the environment on detection results.
Findings
Ultrasonic measurement stands out due to its widespread adaptability, making it suitable for oil film thickness detection in various states and monitoring continuous changes in oil film thickness. Different methods can be selected depending on the measurement environment to compensate for measurement accuracy and enhance detection effectiveness.
Originality/value
This paper reviews the basic principles and latest applications of optical, electrical and acoustic measurement of oil film thickness and status. It analyzes applicable measurement methods for oil film under different conditions. It discusses the future trends of detection methods, providing possible solutions for bearing oil film thickness detection in complex engineering environments.
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Keywords
Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Abstract
Purpose
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Design/methodology/approach
Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.
Findings
The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.
Originality/value
A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.
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Keywords
Evagelos Varthis and Marios Poulos
This study aims to present metaGraphos, a crowdsourcing system that aids in the transcription and semantic enhancement of scanned documents by using a pool of volunteers or people…
Abstract
Purpose
This study aims to present metaGraphos, a crowdsourcing system that aids in the transcription and semantic enhancement of scanned documents by using a pool of volunteers or people willing to participate in exchange for a financial reward.
Design/methodology/approach
The metaGraphos can be used in circumstances where optical character recognition fails to produce satisfactory results, semantic tagging or assigning thematic headings to texts is considered necessary or even when ground-truth data has to be collected in raw form.
Findings
The system automatically provides a Web-based interface comprising a static HTML page and JavaScript code that displays the scanned images of the document, coupled with the corresponding incomplete texts side by side, allowing users to correct or complete the texts in parallel.
Social implications
By assisting the parallel transcription and the semantic enhancement of difficult scanned documents, the system further reveals the hidden cultural wealth and aids in knowledge dissemination, a fact that contributes significantly to the academic-scientific dialog and feedback.
Originality/value
Individual researchers, libraries and organizations in general may benefit from the system because it is cost-effective, practical and simple to set up client–server architecture that provides a reliable way to transcribe texts or revise transcriptions on a large scale.
Details
Keywords
Lezhi Ye, Xuanjie Song and Chang Yue
Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement…
Abstract
Purpose
Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement stroke, position calibration error and low production efficiency in optical alignment, this paper aims to propose a new wafer magnetic alignment technology (MAT) which is based on tunnel magneto resistance effect. MAT can realize micro distance alignment and reduces the design and manufacturing difficulty of wafer bonding equipment.
Design/methodology/approach
The current methods and existing problems of wafer optical alignment are introduced, and the mechanism and realization process of wafer magnetic alignment are proposed. Micro magnetic column (MMC) marks are designed on the wafer by the semiconductor manufacturing process. The mathematical model of the space magnetic field of the MMC is established, and the magnetic field distribution of the MMC alignment is numerically simulated and visualized. The relationship between the alignment accuracy and the MMC diameter, MMC remanence, MMC thickness and sensor measurement height was studied.
Findings
The simulation analysis shows that the overlapping double MMCs can align the wafer with accuracy within 1 µm and can control the bonding distance within the micrometer range to improve the alignment efficiency.
Originality/value
Magnetic alignment technology provides a new idea for wafer bonding alignment, which is expected to improve the accuracy and efficiency of wafer bonding.
Details
Keywords
Zujin Jin, Zixin Yin, Siyang Peng and Yan Liu
Large optical mirror processing systems (LOMPSs) consist of multiple subrobots, and correlated disturbance terms between these robots often lead to reduced processing accuracy…
Abstract
Purpose
Large optical mirror processing systems (LOMPSs) consist of multiple subrobots, and correlated disturbance terms between these robots often lead to reduced processing accuracy. This abstract introduces a novel approach, the nonlinear subsystem adaptive dispersed fuzzy compensation control (ADFCC) method, aimed at enhancing the precision of LOMPSs.
Design/methodology/approach
The ADFCC model for LOMPS is developed through a nonlinear fuzzy adaptive algorithm. This model incorporates control parameters and disturbance terms (such as those arising from the external environment, friction and correlation) between subsystems to facilitate ADFCC. Error analysis is performed using the subsystem output parameters, and the resulting errors are used as feedback for compensation control.
Findings
Experimental analysis is conducted, specifically under the commonly used concentric circle processing trajectory in LOMPS. This analysis validates the effectiveness of the control model in enhancing processing accuracy.
Originality/value
The ADFCC strategy is demonstrated to significantly improve the accuracy of LOMPS output, offering a promising solution to the problem of correlated disturbances. This work holds the potential to benefit a wide range of practical applications.
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Keywords
Heng Liu, Yonghua Lu, Haibo Yang, Lihua Zhou and Qiang Feng
In the context of fixed-wing aircraft wing assembly, there is a need for a rapid and precise measurement technique to determine the center distance between two double-hole…
Abstract
Purpose
In the context of fixed-wing aircraft wing assembly, there is a need for a rapid and precise measurement technique to determine the center distance between two double-hole components. This paper aims to propose an optical-based spatial point distance measurement technique using the spatial triangulation method. The purpose of this paper is to design a specialized measurement system, specifically a spherically mounted retroreflector nest (SMR nest), equipped with two laser displacement sensors and a rotary encoder as the core to achieve accurate distance measurements between the double holes.
Design/methodology/approach
To develop an efficient and accurate measurement system, the paper uses a combination of laser displacement sensors and a rotary encoder within the SMR nest. The system is designed, implemented and tested to meet the requirements of precise distance measurement. Software and hardware components have been developed and integrated for validation.
Findings
The optical-based distance measurement system achieves high precision at 0.04 mm and repeatability at 0.02 mm within a range of 412.084 mm to 1,590.591 mm. These results validate its suitability for efficient assembly processes, eliminating repetitive errors in aircraft wing assembly.
Originality/value
This paper proposes an optical-based spatial point distance measurement technique, as well as a unique design of a SMR nest and the introduction of two novel calibration techniques, all of which are validated by the developed software and hardware platform.
Details
Keywords
Yunzhou Gu, Boyu Yuan and Liang Li
The purpose of this paper is to review the application of digital holography in studies of the corrosion of metallic materials.
Abstract
Purpose
The purpose of this paper is to review the application of digital holography in studies of the corrosion of metallic materials.
Design/methodology/approach
Digital holography is used for in situ observation of the dynamic processes at the electrode | electrolyte interface and on the electrode surface during the corrosion dissolution of metallic materials.
Findings
Digital holography is an effect method to in situ observe the corrosion processes, and it can provide a direct experimental foundation for studying the corrosion mechanism.
Originality/value
Even though there are several challenges, digital holography will play a significant role in studying corrosion processes.
Details
Keywords
Nehem Tudu, Mayuri Baruah and Shashi Bhushan Prasad
Prior to manufacturing, designing plays a vital role in the selection of materials and other design parameters. Therefore, during the deposition of materials, substrate materials…
Abstract
Purpose
Prior to manufacturing, designing plays a vital role in the selection of materials and other design parameters. Therefore, during the deposition of materials, substrate materials provide support and affect the microstructure of the deposits, which may not be desirable in the manufactured product. Hence, the main purpose of the study is to analyse the behaviour of the microstructure at the interface of deposited material and substrate.
Design/methodology/approach
In this study, two blocks of Inconel 625 (IN625) and Stainless steel 304L (SS304L) metal powders were deposited on an SS304L substrate using laser directed energy deposition (DED) technique. Deposited blocks comprised 50% IN625 + 50% SS304L or 100% IN625. After deposition, microstructural behaviour at the interface of the deposits and substrates was analysed using different tests such as optical microscopy (OM), microhardness testing, X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). An improvement in microstructure was proposed by performing heat treatment of the deposited sample.
Findings
Formation of martensite and precipitates at the interface of the deposit and substrate was observed. Formation of martensite and precipitates such as α, carbide and δ phases were observed in OM and SEM images. Due to the formation of these phases, interface regions showed a peak in the hardness graphs. Post-heat treatment of the samples was one of the solutions to resolve these issues.
Originality/value
This paper suggests the formation of a heat-affected zone (HAZ) at the interface of the deposit and substrate, which may negatively affect the overall utility of the deposited part. The properties of the HAZ were investigated. To suppress these detrimental effects, post-heat treatment of the deposited sample was performed, and the samples were further analysed. The post-heat-treated samples exhibited as reduction in HAZ thickness and had more uniform hardness throughout the cross-section compared with the untreated samples.
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Keywords
The purpose of this paper is to discuss how retracted scientific papers become zombie papers and why they are problematic and to encourage librarians to become active in…
Abstract
Purpose
The purpose of this paper is to discuss how retracted scientific papers become zombie papers and why they are problematic and to encourage librarians to become active in addressing these problems.
Design/methodology/approach
This paper explains what zombie papers are, how they are created and the potential impact they can have on the body of scientific literature. It explains how and why they are different than other common types of misleading scientific publications. It also explores recent developments such as the growth of artificial intelligence (AI) technologies and changes to organizations that make data about paper retractions available.
Findings
While journal retractions are as old as scientific publishing itself, the seriousness of retractions persisting and being used in the body of scientific literature has recently been recognized as a serious concern. The rise of new AI technologies such as ChatGPT has made the presence of zombie papers in the data used to train large language models (LLMs) extremely concerning.
Originality/value
While librarians are well-aware of journal retractions and most include information about them in their information literacy training, concerns around zombie papers and their potential presence in the data used to train LLMs will likely be a new consideration for most.
Details