Search results

FOV splicing optical remote sensing instruments have a strict requirement for the focal length consistency of the lens. In conventional optical-mechanical structure design, each optical element is equally distributed with high accuracy and everyone must have a high machining and assembly accuracy. For optical remote sensors with a large number of optical elements, this design brings great difficulties to lens manufacture and alignment.

Taking the relay lens in an optical remote sensing instrument with the field of view splicing as an example, errors of the system are redistributed to optical elements. Two optical elements, which have the greatest influence on modulation transfer function (MTF) of the system are mounted with high accuracy centering and the other elements are fixed by gland ring with common machining accuracy. The reduction ratio consistency difference among lenses is compensated by adjusting the optical spacing between the two elements.

Based on optical system simulation analysis, the optimized structure can compensate for the difference of reduction ratio among lens by grinding the washer thickness in the range of ±0.37 mm. The test data for the image quality of the lens show that the MTF value declined 0.043 within ±0.4 mm of space change between two barrels. The results indicate that the reduction ratio can be corrected by adjusting the washer thickness and the image quality will not obviously decline.

This paper confirms that this work is original and has not been published elsewhere nor is it currently under consideration for publication elsewhere. In this paper, the optimum structural design of the reduction relay lens for the field of view stitching applications is reported. The method of adjusting washer thickness is applied to compensate for the reduction ratio consistency difference of lenses. The optimized structure also greatly reduces the difficulty of lenses manufacture, alignment and improves the efficiency of assembly.

The purpose of this paper is to propose a novel method of coaxial optical precision alignment based on surface roughness and reflectiveness matching.

The micro-assembly experiment system set-up was constructed according to the principle of the coaxial optical alignment. The coaxial optical alignment error is theoretically analyzed and calculated. When the prism orthogonal alignment mechanism produces the error of 0.001°, the theoretical deviation was less than 0.87 μm and the actual experimental micro-assembly platform assembly accuracy exceeded 3 μm. A peg-in-hole precise assembly of punching pin micro-assembly experiment was done in order to validate feasibility of this method.

The results indicate that coaxial optical precision alignment could be used for the assembly of complex micro-heterogeneous system which is integrated by similar devices, such as 3D complex micro-structures, silicon micro-electro-mechanical system (MEMS) devices and non-silicon MEMS devices with flat structure.

The paper provides certain methodological guidelines for MEMS for high precision automatic assembly of complex 3D micro-structures.

The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low‐cost assembly methods.

A novel method of high‐precision passive alignment and assembly to OPCBs was invented and a full evaluation platform developed to demonstrate the viability of this technique.

The technique was successfully deployed to passively align and assemble a lens receptacle onto an embedded polymer waveguide array in an electro‐OPCB. The lens receptacle formed a critical part of a dual lens pluggable in‐plane connection interface between peripheral optical devices and an OPCB. A lateral in‐plane mechanical accuracy of ±2 μm has been measured using this technique.

As this is a free space optical coupling process, surface scattering at the exposed waveguide end facet was significant.

This paper details a novel method of passively assembling arbitrary optical devices onto multi‐mode optical waveguides and outlines the procedure and equipment required. A lens coupling solution is also presented which reduces susceptibility of a connecting optical interface to contamination.

The purpose of this paper is to study fabrication of optical‐PCBs on panel scale boards in a conventional modern PCB process environment. It evaluates impacts on board design and manufacturing with the developed optical board verifiers outlining challenges and requirements for manufacturing low‐loss waveguide structures and optical building blocks. The study aims to expand the current knowledge in the field by adding results obtained by utilizing industrial production infrastructure and developed scalable manufacturing processes to fabricate optical‐PCBs and board assemblies in high‐volumes and low‐cost manner.

Impacts on board design and manufacturing were studied with the developed optical technology verifiers. One verifier is optical‐PCB with embedded waveguides, integrated i/o couplers and optical vias. Another verifier is large size PCB with optical layer. A system‐level optical board assembly with 12.5 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules is designed for optical link analysis. Fabricated optical structures on verifiers are evaluated of their physical characteristics utilizing optical, SEM, LSCM analysis methods. Performance testing is conducted using standard optical transmission measurement methods and equipment.

The paper provides empirical results about fabrication of multimode optical waveguides with conventional PCB process equipment. Results suggest that current coating and imaging equipments are capable of producing optical waveguide patterns with high resolution and size accuracy. However, fabricators would require larger process window and defect tolerance for processing optical materials to obtain low‐loss waveguides with sufficient yields.

Because of the limited amount of design variants in production verifiers evaluated in this paper, some impacts like effect of base material, board construction, optical layer location and beam coupling solution were not evaluated. Likewise, impacts on long‐term stability and cost were not addressed. These factors however require further investigation to address technical feasibility of optical PCBs technology prior commercial high volume production.

The paper includes implications for the development of a fabrication methods and testing procedures for optical polymer waveguide layers on PCBs.

This paper fulfils need to provide results on design, fabrication and characterization of optical PCBs and backplanes from industrial fabricator's perspective. The paper provides input for end‐user and developers to evaluate technical performance, robustness, and maturity of building blocks and supply chain to support polymer waveguide based technology for intra‐system optical links.

THE emergence of high speed military transmission systems, led to the adoption of a Data Bus system, whose parameters were defined by Mil‐Std‐1553B. Since its introduction several years ago, it has developed into a fully matured standard, with a worldwide acceptance from Government bodies, armed forces and industry. This has meant that the large bundle of cables have been replaced by a single twisted pair of wires. The effect of this on the industry has been to reduce the number of connectors.

Technical means now exist to monitor, predict a danger and issue early warnings when something devastating is estimated to happen in the human environment. In order to adapt such means for the benefit of humanity, existing monitoring methods, basic system design principles and natural short and long environmental transformations were investigated. Finally an integrated automatic system for deformation monitoring and surveying of the Chernobyl disaster area, was proposed. The conclusion was that airborne remote sensing including GPS and photogrammetry can be considered the optimum solution.

To characterise the optical performance of organic multi‐mode optical waveguides integrated with printed circuit board (PCB) and to demonstrate the feasibility of 2.5 and 10 Gbps optical interconnection in board‐level, respectively.

This paper provides both qualitative and quantitative approaches for the characterization the wave guide performance, i.e. using loss measurement, optical beam profiling, ethernet verification, and eye‐diagram testing. In addition to wave guide loss measurement, the most significance part of the work reported in this paper is to evaluate optical wave guides with coupled VCSELs, by which a 3 dB coupling design budget can thus be identified. Furthermore, by artificially manipulating coupling conditions, practical concerns of EOPCB integration, including waveguide geometry, VCSEL driving power, alignment tolerance, coupling spacing, etc. are studied.

Thermal stability studies related to PCB lamination processes show the feasibility of organic waveguides integrated to traditional PCB manufacturing. For a direct VCSEL/PD coupling scheme, a 3 dB power budget is experimentally identified. For short reach optical interconnection, 10 Gbps up to 17 cm propagation on PCB can be achieved by using 50×50 μm multi‐mode organic waveguides, where a±25 μm tolerance of optical alignment is compatible to the design rules of PCB.

The value of the paper lies in its systematic approaches to identify the waveguide performance through both qualitative and quantitative indices. The correlation between geometry design, processes, coupling conditions, and optical performance of organic waveguides explored in detail. Not only is a standard eye‐diagram test used to verify the waveguide at 2.5 and 10 Gbps bandwidth, but also a prototype of optical data‐communication on giga‐ethernet is demonstrated for long term stability. Following these analytical methods, readers can understand more about the optical performance of waveguides when designing optical interconnection for high speed electro‐optical integrated PCBs.

To present work and characterisation results from a project to develop a pluggable optical connector for board to board interconnect.

An optical backplane connection system is described, which allows for repeatable docking and undocking of an active optical interface housed on a daughtercard to waveguides fabricated on an optical backplane.

The optical backplane connection system described has demonstrated its successful implementation with respect to optical data transfer across multimode polymer waveguides. Measurement results presented show that such a system is a viable approach toward the application of pluggable optical backplane interconnects.

The direct connection to the exposed waveguide interface results in considerable optical loss and scattering. Future designs will have to address this. Additional work should also be undertaken to develop a means of connector engagement that is autonomous and requires no user intervention.

Prior research into the problem of coupling to an optical backplane has been concerned with interfaces that deflect optical signals by 90° into and out of the waveguides. Here, an alternative approach is proposed that launches light directly into the waveguide ends.

The aim of the research was to evaluate the concept that utilizes structured planar substrates based on low temperature co‐fired ceramics (LTCC) as a precision platform for the passive alignment of a multimode fiber and wide‐stripe diode laser.

Presents the manufacturing process for realisation of 3D precision structures, heat dissipation structures and a cooling channel into the LTCC substrate. The developed methodology for 3D modelling and simulation of the system was used to optimize structures, materials and components in order to achieve optimal performance for the final product and still maintain reasonably low fabrication costs. The simulated optical coupling efficiency and alignment tolerances were verified by prototype realization and characterization.

The achieved passive alignment accuracy allows high coupling efficiency realisations of multimode fiber pigtailed laser modules and is suitable for mass production.

Provides guidance in the design of LTCC precision platforms for passive alignment and presents a hybrid simulation method for photonics module concept analysis.

The three‐dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves and cavities for the laser to fiber coupling. Thick‐film printing and via punching can be incorporated in order to integrate electronic assemblies directly into the opto‐mechanical platform.

Introduces the LTCC 3D precision structures for photonics modules enabling passive alignment of multimode fiber pigtailed laser with high efficiency optical coupling. Demonstrates the hybrid simulation methodology for concept analysis.

This describes a new automated assembly technique, developed by Leica Geosystems and the Swiss Federal Institute of Technology, which allows the automated precision assembly of miniature optical components and subsystems.

Dubbed TRIMO‐SMD (three‐dimensional miniaturised optical surface‐mounted device), this new technique is designed for use with optical components of around 2 mm in diameter such as laser diodes. It uses six‐axis robotic motion, automated optical alignment with cameras and position sensors and laser‐reflow soldering to assemble photonic modules.

This development has been commercialised and is being used in a production environment by Leica Geosystems. It fixes the optical element into position in just 2 s and the placement accuracy of each component is repeatable to within 1 μm.

This technique has allowed novel micro‐optical assemblies to be produced automatically and has improved the performance and reduced the size and weight of certain precision optical products such as laser rangefinders and Lidar transceiver modules.

This is a new technique which, by allowing the automated, precision assembly of miniature optical components, will benefit companies involved with the manufacture of optical sensing, telecommunications, medical and other products.