Search results

The purpose of this paper is to visualise the activities of three solders; Sn‐37Pb, Sn‐9Zn and Sn‐3.5Ag on Cu substrates during reflow near their melting points and to relate them with reflow reactions between solder and substrate.

Melting activities of three solders near their melting points on copper substrates are visualised in an infrared reflow furnace.

Solder balls demonstrate different ways of melting and reflowing behaviours in dissimilar times and temperature intervals. Melting of Sn‐9Zn solder balls is initiated simultaneously at the surface and joint between solder balls. This is followed by the melting at the joint between solder balls and the Cu substrate. During melting, solder balls are first merged into each other and then reflow on the substrate from top to bottom. Opposite to Sn‐9Zn, Sn‐3.5Ag solder balls start to melt at the surface and the joint between the solder and substrate, simultaneously. Balls are first reflowed from top to bottom and, in the process, liquid solder is merged. Unlike Sn‐9Zn and Sn‐3.5 Ag, melting of Sn‐37Pb solder balls is initially commenced at the surface only. This is followed by simultaneous melting at both joints. Variation in melting activities of these solders is found to be closely related to the coalescence mechanism of solder balls and the reflow reactions between the solders and the Cu substrate.

The elementary melting activities of different solders on Cu substrates is related with their reflow behaviours. This provides better understanding of solder behaviour and selection of good lead‐free solder for applications in the electronic industry.

This paper describes one of the new package cooling technology concepts using low melting point alloys in order to perform high density packaging. Two kinds of cooling alloy materials, Bi/Sn/In and Bi/Pb/Sn/ln, whose melting points were less than 80°C and whose costs were low, were selected. The experimental substrate sample was fabricated by greensheet technology on which a tungsten metallised resistor heater was formed. Two kovar weld rings were brazed together to the top side and back side surfaces of the substrate individually. One kovar metal shell was laser welded to the top side weld ring in order to protect many devices. Another kovar metal shell, with a hole in the centre, was laser welded to the back side weld ring. The low melting point alloy was melted and poured into the back side kovar shell through the hole in a liquid state. After it was cooled and changed into a solid state, the hole was sealed hermetically with a small kovar metal cap by a laser beam. The authors performed a thermal experiment and confirmed that the substrate back surface temperature was fixed at the cooling alloy material's melting point for several minutes by thermal absorption while the low melting point alloy phase changed from its original solid state into a liquid state. This new package cooling technology is extremely useful for a high power motor drive circuit package which consists of many high power transistor chips and other analogue IC chips, and whose motor drive operation is performed intermittently for several minutes with some interval times.

The purpose of this paper is the study of the electro-vortex flow (EVF) as well as heating and melting processes for mini industrial direct current electric arc furnace (DC EAF).

A mini DC EAF was designed, manufactured and installed to study the industrial processes of heating and melting a small amount of melt, being 4.6 kg of steel in the case under study. Numerical modelling of metal melting was performed using the enthalpy and porosity approach at equal values and non-equal values of the solidus and liquidus temperatures of the metal. The EVF of the liquid phase of metal was computed using the large eddy simulation model of turbulence. Melt temperature measurements were made using an infrared camera and a probe with a thermocouple sensor. The melt speed was estimated by observing the movement of particles at the top surface of melt.

The thermal flux for metal heating and melting, which is supplied through an arc spot at the top surface of metal, is estimated using the thermal balance of the furnace at melting point. The melting time was estimated using numerical modelling of heating and melting of metal. The process started at room temperature and finished once whole volume of metal was molten. The evolution of the solid/melt phase boundary as well as evolution of EVF patterns of the melt was studied.

Numerical studies of heating and melting processes in metal were performed in the case of intensive liquid phase turbulent circulation due to the Lorentz force in the melt, which results from the interaction of electrical current with a self-magnetic field.

The purpose of this study is to analyze heat transfer for solid–liquid phase change in two inclined cavities assisted with open cell and closed cell porous structures for enhancement of heat transfer and compare them.

The heat transfer analysis is done numerically. The set of conservation equations for mass, momentum and energy for phase change material (PCM) and conduction heat transfer equation for metal frame are solved. Furthermore, temperature and solid–liquid fraction distributions for a cavity filled only with PCM are also obtained for comparison. The porosity is 0.9 for both porous structures. Rayleigh number and inclination angle change from 1 to 10⁸, and from −90° to 90°, respectively.

The present study reveals that the use of closed cell structures not only can make phase change faster than open cell structure (except for Ra = 10⁸ and = 90°) but also provide more stable process. The use of a closed cell porous structure in a cavity with PCM can reduce melting period up to 55% more than a cavity with an open cell porous structure. The rate of this additional enhancement depends on Rayleigh number and inclination angle.

To the best of the authors’ knowledge, this is the first time that the comparison between closed cell and open cell porous structures for heat transfer enhancement in a solid/liquid phase change process is reported. Authors believe that the present study will lead more attentions on the use of closed cell porous structures.

The purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn‐0.4Co‐0.7Cu (wt%) lead‐free solder alloy.

Nanoparticles of Sn‐0.4Co‐0.7Cu lead‐free solder alloy were prepared by the self‐developed consumable‐electrode direct current arc technique, where ultrasonic vibration was applied during the manufacturing of the particles. X‐ray diffraction and field emission scanning electron microscope were employed to analyze the crystal structure and morphology of the nanopartiles, respectively. Differential scanning calorimetry was used to investigate the melting temperature of both the bulk alloy and as‐prepared nanoparticles.

The melting temperature of the nanoparticles was approximately 5°C lower compared to that of the bulk alloy.

As a novel developed lead‐free solder alloy, the Sn‐0.4Co‐0.7Cu (wt%) alloy provides a cost advantage compared to the extensively used Sn‐Ag‐Cu system. Some limitations still exist, however, mainly due to its relatively higher melting temperature compared to that of eutectic Sn‐37Pb solder. In view of this situation, the attempt to lower its melting temperature has recently attracted more attention based on the knowledge that the melting temperature for pure metals is reduced when the particle size is decreased down to a few tens of nanometers.

Phase change energy storage is an important solution for overcoming human energy crisis. This study aims to present an evaluation for the thermal performances of a phase change material (PCM) and a PCM–metal foam composite. Effects of pore size, pore density, thermal conductivity of solid structure and mushy region on the thermal storage process are examined.

In this paper, temperature, flow field and solid–liquid interface of a PCM with or without porous media were theoretically assessed. The influences of basic parameters on the melting process were analyzed. A PCM thermal storage device with a metal foam composite is designed and a thermodynamic analysis for it is conducted. The optimal PCM temperature and the optimal HTF temperature in the metal foam-enhanced thermal storage device are derived.

The results show that the solid–liquid interface of pure PCM is a line area and that of the mixture PCM is a mushy area. The natural convection in the melting liquid is intensive for a PCM without porous medium. The porous medium weakens the natural convection and makes the temperature field, flow field and solid–liquid interface distribution more homogeneous. The metal foam can greatly improve the heat storage rate of a PCM.

Thermal storage rate of a PCM is compared with that of a PCM–metal foam composite. A thermal analysis is performed on the multi-layered parallel-plate thermal storage device with a PCM embedded in a highly conductive porous medium, and an optimal melting temperature is obtained with the exergy optimization. The heat transfer enhancement with metal foams proved to be necessary for the thermal storage application.

This paper aims to study the effect of processing parameters and the fundamental mechanism of surface morphologies during electron beam selective melting.

From the powder-scale level, first, the discrete element method is used to obtain the powder bed distribution that is comparable with the practical condition; then, the finite volume method is used to simulate the particle melting and flowing process. A physically reliable energy distribution of the electron beam is applied and the volume of fluid method is coupled to capture the free boundary flow. Twelve sets of parameters grouped into three categories are examined, focusing on the effect of scan speed, input powder and energy density.

According to the results, both melting pool width and depth have a positive relation with the energy density, whereas the melting pool length is insensitive to the scan velocity change. The balling effect is attributed to either an insufficient energy input or the flow instability; the hump effect originates from the mismatch between electron beam moving and the fluid flow. The scan speed is a key parameter closely related to melting pool size and surface morphologies.

Through a number of case studies, this paper gives a comprehensive insight of the parameter effects and mechanisms of different surface morphologies, which helps to better control the manufacturing quality of electron beam selective melting.

Selective laser melting (SLM) is a powder metallurgical (PM) additive manufacturing process whereby a three‐dimensional part is built in a layer‐wise manner. During the process, a high intensity laser beam selectively scans a powder bed according to the computer‐aided design data of the part to be produced and the powder metal particles are completely molten. The process is capable of producing near full density (∼98‐99 per cent relative density) and functional metallic parts with a high geometrical freedom. However, insufficient surface quality of produced parts is one of the important limitations of the process. The purpose of this study is to apply laser re‐melting using a continuous wave laser during SLM production of 316L stainless steel and Ti6Al4V parts to overcome this limitation.

After each layer is fully molten, the same slice data are used to re‐expose the layer for laser re‐melting. In this manner, laser re‐melting does not only improve the surface quality on the top surfaces, but also has the potential to change the microstructure and to improve the obtained density. The influence of laser re‐melting on the surface quality, density and microstructure is studied varying the operating parameters for re‐melting such as scan speed, laser power and scan spacing.

It is concluded that laser re‐melting is a promising method to enhance the density and surface quality of SLM parts at a cost of longer production times. Laser re‐melting improves the density to almost 100 per cent whereas 90 per cent enhancement is achieved in the surface quality of SLM parts after laser re‐melting. The microhardness is improved in the laser re‐molten zone if sufficiently high‐energy densities are provided, probably due to a fine‐cell size encountered in the microstructure.

There has been extensive research in the field of laser surface modification techniques, e.g. laser polishing, laser hardening and laser surface melting, applied to bulk materials produced by conventional manufacturing processes. However, those studies only relate to laser enhancement of surface or sub‐surface properties of parts produced using bulk material. They do not aim at enhancement of core material properties, nor surface enhancement of (rough) surfaces produced in a PM way by SLM. This study is carried out to cover the gap and analyze the advantages of laser re‐melting in the field of additive manufacturing.

A numerical study is conducted for natural convection dominated melting inside discretely heated rectangular enclosures. This study finds applications in the design and operation of thermal energy storage units and the cooling of electric equipment. Results show the benefits of discrete heating over uniform heating for optimizing the melting process. For enclosures of high aspect ratios (A ∼> 4), configurations leading to well controlled heat source temperatures and long melting times are obtained. For cavities of low aspect ratios (A ∼< 4), it is found that the source span η is the most influential parameter. For η ∼ < 0.45, the melting times are shorter and the heat source temperatures remain equal and moderate during the entire melting process. A map for determining the cavity size and the source distribution that optimizes the melting process is presented.

There is a requirement to match selective laser melting (SLM) technologies to a wider range of polymeric materials, as the existing market for SLM powders is dominated by polyamide PA12. Drivers include the tailoring of physical properties to individual applications or cost reduction. Polypropylene (PP) currently has limited use in SLM; so, this paper aims to explore the potential use of PP materials of varying molecular weight (Mw).

PP polymers of differing Mw were characterised using a range of analytical techniques, including differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rotational rheometry and real-time hot-stage (optical) microscopy.

The techniques are sufficiently sensitive to distinguish Mw effects, notably in terms of material viscosity. The stable sintering region for SLM has been defined clearly. Some success was achieved in melting parts using all grades of PP, including higher Mw grades, which potentially offer improved mechanical performance.

The range of techniques (DSC, oxidative induction time and TGA) form an effective analytical package with which to consider new polymeric materials for SLM.

High-Mw PP polymers, in tape or powder form, have potential use in SLM processes, providing scope to enhance part properties in future.

This is believed to be the first in-depth study noting the influence of PP Mw on important physical performance in a proprietary SLM process, using holographic beam manipulation.