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The purpose of this paper was to study the influence of properties of printed circuit boards (PCBs) on the temperature during micro drilling and obtain the influential mechanism of PCBs based on temperature measurement.

Experiments were carried out to study the influence mechanism of PCB properties on micro hole drilling temperature under high spindle speed. The temperature measurement platform was applied, then the influence of components ratio of PCBs on the temperature of micro-drilling was analyzed by using comparative analysis method. The mass ratio of each kind of material in the PCB was defined as four levels and the influence mechanism of properties of PCBs based on temperature measurement was summarized.

Average filler and lower resin would have a positive impact on micro hole drilling temperature, and the smaller filler size and the even distribution would make it better.

An infrared temperature measurement platform was applied and influential mechanism of PCB properties on temperature was analyzed, which could provide the reference value on the optimization of temperature during micro drilling.

The purpose of this paper is to calibrate the surface emissivity of micro drill bit and to investigate the effect of different drilling parameters on the temperature of micro drill bit in printed circuit board (PCB) micro drilling process.

The surface emissivity of micro drill bit was obtained by experiments. Analysis of variance (ANOVA) was applied in this study to analysis the effect of different drilling parameters on the temperature of micro drill bit in PCB micro hole drilling. The most significant influencing factor on micro drill bit temperature was achieved by ANOVA.

First, the surface emissivity of cemented carbide rod decreased from 0.4 to 0.32 slowly with temperature in the range of 50-220°C. Second, the most significant influencing factor on the micro drill bit temperature was spindle speed among the drilling parameters including spindle speed, retract rate and infeed rate.

In this paper, the influence of roughness of black coating, carbide rod and micro drill bit on the surface emissivity calibration and the temperature measurement was not considered.

A new simple method has been presented to calibrate the surface emissivity of micro drill bit. Through calibrating the surface emissivity of micro drill bit, the temperature of micro drill bit can be measured accurately by infrared thermometry. Analyzing the influences of different drilling parameters on the temperature of micro drill bit, the mechanism of drilling parameters on drilling temperature is achieved. The basis for the selection of drilling parameters to improve the hole quality is enhanced.

The purpose of this paper is to study and obtain the influence of resin and filler properties of printed circuit board (PCB) on the drilling force during micro drilling.

Experiments were carried out to study the influence of PCB on micro-hole drilling force under high spindle speed. A drilling force measurement system was applied, and then, the influence of resin and filler properties of PCBs on the force was analyzed. The proportion of resin and filler in the PCB was defined as four levels, and the influence of PCBs based on the drilling force measurement was summarized.

The drilling force decreased with the decrease in the feed rate, and lower filler (16-30 per cent) and average resin (31-50 per cent) would have a positive impact on the drilling force. At the same time, the size of uniform and fine fillers would help to reduce the drilling force.

The drilling force measurement system was applied, and the influence of PCBs on force was analyzed, which could provide a reference value on the optimization of the drilling force during micro drilling.

The purposes of this paper are to study the characterization of drill bit breakage in printed circuit board (PCB) drilling process based on high-speed video analysis and to provide an important reference for micro drill bit breakage prediction.

Based on PCB drilling experiment, the high-speed camera was used to observe the micro drill breakage process and the chip removal process. The variation of chip in the drilling process was studied and one of the key reasons for the drill bit breakage was analysed. Finally, the swing angles’ feature during the breakage process of the micro drill was analysed and researched with the image processing tools of MATLAB.

The micro drill was prone to breakage mainly because of the blocked chips. The breakage process of the micro drill can be divided into the stage of stable chips evacuation, the stage of blocked chips and the stage of drill bit breakage. The radians of swing angles were basically in the range of ±0.01 when the drilling possess is normal. But when the radians of swing angles considerably exceeded the range of ±0.01, the micro drill bit may be fractured.

This paper presented the method to study the characterization of drill bit breakage in the PCB drilling process by using high-speed video analysis technology. Meanwhile, an effective suggestion about monitoring the radians of swing angles to predict the breakage of micro drill bit was also provided.

The purpose of this paper is to study the movement characteristics of micro drill bit during entry period in printed circuit board (PCB) high-speed drilling and to present an effective method to conduct quantitative analysis of the wandering of drill bit based on high-speed video capturing.

Based on the high-speed camera technology, experiments are conducted to get a series of time sequence images and the wandering of micro drill tip and the radial run-out of drill body, and the max-deformation of drill bit are calculated by using a quantitative analysis method. Finally, the movement characteristics of micro drill bit during entry drilling period PCB high-speed drilling are evaluated.

With the increasing spindle speed, the radial run-out of drill body decreases gradually, whereas the wandering amplitude of the drill point gradually increases; micro drill bit itself has an ability of positioning deviation correction after contacting the entry sheet; the feed rate within a certain range could slightly worsen the deformation of drill tip at the instant of impingement.

With the improvement of spindle speed, the camera’s shooting speed needed will increase accordingly, thus, the resolution of the pictures will decline, which always affects the analysis precision.

A series of effective methods to conduct quantitative analysis of the wandering micro drill bit by using high-speed camera technology is presented; a reference for the optimization of micro-hole drilling is provided.

The purpose of this paper is to present a system for accurately measuring drilling force in the printed circuit board micro drilling process and to characterize the drilling force to provide a better understanding of the micro drilling process.

The drilling force measurement system was established first. Then the drilling force in printed circuit board micro drilling process was characterized experimentally. In particular, the drilling forces in drilling halogen‐free and lead‐free assembly compatible printed circuit boards and the drilling force characteristics in ultra small hole drilling were investigated.

A drilling force measurement system, with the key component of a KISTLER 9256C2 dynamometer, can accurately measure the drilling forces in the printed circuit board micro drilling process. The micro drilling process can be characterized by drilling force. Meanwhile, drilling force is very sensitive to drill breakage and drilling force can be utilized to detect drill breakage in the micro drilling process.

The paper presents a system for accurately measuring the drilling force. Drilling force provides fundamental information for the optimal design of micro drill bits. Drilling force can also characterize the micro drilling process, especially the ultra small hole micro drilling process.

The purpose of this paper is to present a clear picture of the challenges of micro drill bit and the developments of novel micro‐drill bits for flexible circuit boards, environmental‐friendly printed circuit boards (PCBs), high aspect ratio drill bit and ultra‐small micro drill bit, as well as the developments of geometry design of micro drill bit.

The paper details the developments trend and challenges of micro drill and PCBs first. Then the current research status of novel micro drill bits for flexible circuit boards, environmental‐friendly PCBs, high aspect ratio drill bit, ultra‐small micro drill bit are described. Finally, the developments of geometry design and drilling process are reviewed.

To achieve excellent performance for drilling flexible PCB, a large helical angle, large flute/land ratio and small web thickness that guarantee the sharp evacuation capability, are adopted in drill bit design. A small helix angle and an appropriate primary face angle are employed for drill bit to process environmental‐friendly printed circuit boards. It is beneficial to implement big helix angle, small primary face angles and small point angles in the design of ultra‐small micro drill bit. An optimum web thickness and step feed should be taken into consideration in high aspect ratio drill bits design.

The paper reviews different solutions of micro drill bits for the state‐of‐the‐art PCB and the developments of geometry design of drill bit for printed circuit boards.

This paper aims to present the main factors affecting the mechanical drilling of the printed circuit board (PCB for short) micro-holes and method of micro-ultrasonic powder molding (micro-UPM for short) by utilizing PCB micro-hole array.

To optimize the drilling process, the paper proposes the on-line monitoring methods for the drilling process including drilling force, drilling temperature, high-speed photography and vibration signals. Taking 0.10 and 0.15 mm micro-drilling as examples, the paper analyzes the drilling process of ultra-small micro-holes. Finally, by taking the PCBs with 0.10 and 0.15 mm micro-hole arrays as the micro-cavity inserts, utilizing ultra-high-molecule weight polyethylene powder with the average particle size of about 150 μm as raw material, two sizes of micro-cylinder array polymer parts are fabricated through micro-UPM process.

PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling has the advantages of low costs, high efficiency and good consistency. Taking 0.10 and 0.15 mm micro-drilling as examples, it is found that the both measured apertures are about 10.0 μm more than the diameter of the micro-drill bits on average. The average diameter of the micro-cylinders by micro-UPM process is smaller than that of the micro-hole with the same specification, while the value of the roughness of the cylinder surface is more than that of the hole-wall surface with the same specification.

This paper describes the challenges and the developments of mechanical drilling and by using PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling, two different micro-cylinder array polymer parts are successfully made and thus the application area of PCB micro-drilling is broadened.

The purpose of this paper is to present a method for ultrasonically molding polymer powder in a micro plastic part mold. In the method, a printed circuit board (PCB) in which micro‐hole arrays are drilled is used as a micro cavity insert. With the utilization of ultrasonic vibration, the polymer powder, which is prefilled and compacted in a micro cavity, mutually generates great sliding friction heat so as to be rapidly plasticized and molded.

Micro carbide drill bits of which the diameters are 100.0 μm, 150.0 μm and 200.0 μm, respectively, are used for drilling the PCB to form a micro‐hole array insert. Next, two kinds of various ultra‐high molecule weight polyethylene (UHMW‐PE) powder with various grain diameters are directly filled into a charging barrel and a mold cavity with the micro‐hole array insert. Proper process parameters are set on ultrasonic plasticizing and molding equipment so that a molding test can be performed. The melt of UHMW‐PE can be rapidly filled into the cavity. Finally, micro‐column array plastic parts are successfully prepared.

The micro‐hole array PCB is a mold insert which is quite applicable for the ultrasonic molding of the powder in the mold. When a molding material is the coarse UHMW‐PE powder with the grain diameter of about 350 μm, the diameter replication rates of the micro‐column array plastic parts become good in order with the increased micro‐hole diameter of the PCB. When the fine UHMW‐PE powder with the grain diameter of about 80 μm is adopted, the diameter replication rates of the micro‐column array plastic parts become good in order with the decreased micro‐hole diameter of the PCB.

In this paper, the micro‐column array plastic parts with good replicability are successfully prepared by a technique for ultrasonically plasticizing and molding in the cavity. The technique can be applied to the fields of medical treatment, communication, optics, chemistry and so on, such as biological micro needle arrays, micro biological chips, optical memories, and micro chemical reaction chips.

The purpose of this paper is to present a method for evaluating the structural dynamic characteristics of a flying probe tester.

The dynamic characteristics of a flying probe tester framework were analyzed based on a finite element analysis method. First, modal analysis was carried out to characterize the modal parameters of the structure. Second, the harmonic response was analyzed according to the modal analysis and the response curve of the structural system was studied. Finally, transient analysis was conducted to obtain the transient response of the structures at the beginning of the vibration.

The natural frequency and the response frequency of a natural granite structure was the highest and the transient vibration displacement amplitude was the smallest compared with cast iron and artificial stone structures.

A comprehensive understanding of the dynamic characteristics of the framework of a flying probe tester with three different materials has been achieved. The results of the analyses provide a reference for the framework design of a flying probe tester.