Search results

To provide a clear picture of the current status of mechanical drilling of printed circuit boards (PCBs).

A review paper detailing the developments of micro‐drill bit and PCB mechanical drilling techniques.

Mechanical drilling will still dominate the PCB hole processing methods. A design method on the basis of theoretical analysis, numerical simulation and experimental verifications is proved as an applicable way to improve the drill bit design efficiency. Newly developed tungsten carbide, novel coating techniques and high‐performance steel‐shank micro‐drill bits are expected. Solutions of micro‐drill bits for high‐density interconnection, IC substrate flexible PCBs, halogen and lead‐free assembly compatible PCBs, as well as 2 mm shank diameter drill bit are worthy of being concerned.

The paper highlights the state‐of‐the‐art techniques of micro‐drill bit manufacturing and novel developed micro‐drill bit. The development direction of micro‐drill bit in the future is concluded.

This paper aims to present the main factors affecting the mechanical drilling of the printed circuit board (PCB for short) micro-holes and method of micro-ultrasonic powder molding (micro-UPM for short) by utilizing PCB micro-hole array.

To optimize the drilling process, the paper proposes the on-line monitoring methods for the drilling process including drilling force, drilling temperature, high-speed photography and vibration signals. Taking 0.10 and 0.15 mm micro-drilling as examples, the paper analyzes the drilling process of ultra-small micro-holes. Finally, by taking the PCBs with 0.10 and 0.15 mm micro-hole arrays as the micro-cavity inserts, utilizing ultra-high-molecule weight polyethylene powder with the average particle size of about 150 μm as raw material, two sizes of micro-cylinder array polymer parts are fabricated through micro-UPM process.

PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling has the advantages of low costs, high efficiency and good consistency. Taking 0.10 and 0.15 mm micro-drilling as examples, it is found that the both measured apertures are about 10.0 μm more than the diameter of the micro-drill bits on average. The average diameter of the micro-cylinders by micro-UPM process is smaller than that of the micro-hole with the same specification, while the value of the roughness of the cylinder surface is more than that of the hole-wall surface with the same specification.

This paper describes the challenges and the developments of mechanical drilling and by using PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling, two different micro-cylinder array polymer parts are successfully made and thus the application area of PCB micro-drilling is broadened.

The paper aims to present key points regarding the development of an ultra‐small micro drill bit for packaging substrate hole processing.

Key points for the development of ultra‐small drill bits are presented. These are based on a study of the influential mechanisms of micro drill bit material properties, key parameters and coating techniques on the behaviours of micro drill bit. Experiments were conducted to verify the drilling capability of the developed ultra‐small micro drill bits.

The material properties of micro drill bits are of great importance in ensuring the performance. Helix angle, primary face angle and point angle are three key parameters that significantly influence drill bit behaviour. Computer‐aided engineering analysis, temperature monitoring and video monitoring techniques in high‐speed drilling are useful tools for achieving the optimal design of ultra‐small drill bits. Using coating technology on ultra‐small drill bits can improve their hit limits by nearly four times.

The paper highlights key points to consider when developing ultra‐small micro drill bits. The presented points can provide an overall understanding of the challenges and solutions during ultra‐small micro drill bit design. Additionally, this paper presents a solution for packaging substrate ultra‐small hole processing by mechanical drilling.

A developmental project has been initiated to create a new type of glass fabric, whose fibers are to be uniformly distributed in the laminate so as to comply with the requirement of homogeneity. As a result, various types of glass fiber fabrics have successfully woven through the uniquely developed “MS process”, and it has been verified that each of the glass fabrics possesses the most suitable structure to attain uniform distribution in the laminates. The laminates, using the newly developed glass fabrics, have proved that the micro‐diameter drilling, that is laser drilling and mechanical drilling with 0.1mm diameter, can be performed very easily with less drill bit breakage, and produces uniform drill holes. It has also been proved that the laminates with the new glass fabrics reveal improved mechanical properties such as lower CTE, decreased warp and twist and better dimensional stability compared with conventional laminates of glass epoxy. Various styles of new glass fabric cover the wide range of thickness from 100 microns down to 27 microns.

Many small holes need to be drilled in printed circuit boards to achieve a high packing density of circuit components. Even with NC control, conventional mechanical techniques are relatively slow and holes smaller than 035 mm diameter are difficult to achieve in production. Laser drilling has been suggested as a potentially fast technique capable of drilling small holes, so trials have been conducted on thin, flexible kapton board, and on 08 mm and 16 mm thick epoxide woven glass fabric board with 12 and 36 micron thick copper cladding. Using a 600 W CO2 laser, the proposed technique was to pre‐etch holes in the copper which would then act as a mask to the beam, so drilling only where etched holes existed. This technique was feasible on the flexible board, but not on the thicker boards because of damage to the copper. Using a pulsed Nd‐YAG laser to drill through both copper and laminate gave good results, but more work is necessary to eliminate occasional delamination of the copper around the hole. Through‐hole plating of the drilled holes appeared to present no special problems.

The purpose of this paper is to present a new method to optimize the micro drill bit based on finite element analysis, and analyze the performance of the asymmetric helix groove micro drill bit and provide a way to conduct the optimization of micro drill bits.

First, the stress and deform of the micro drills were analyzed in ANSYS. Second, the influence of helix angle, web thickness and ratio of flute to land on stiffness was explored. Combining the former two results, a better set of parameters were optimized. Third, the modal analysis and harmonic response analysis of the optimized micro drill bit were analyzed in ANSYS. Finally, an experiment was carried out to verify the performance of the asymmetric helix groove micro drill bit.

The stress and deform of the asymmetric helix groove micro drill bit are not symmetric. The rigidity is getting better with the web thickness increasing in the selected range; while, the rigidity is getting worse with the helix angle and ratio of flute to land increasing in the selected range. The natural frequencies of the optimized micro drill bit are far away from the excitation frequency, and the response displacement is very small under the excitation of the spindle. In the drilling experiment, the optimized micro drill bit performs well.

In this paper, the diameter of the asymmetric helix groove micro drill bit was 0.3 mm and the cross-section shape was not considered. The future research work should consider different diameters and cross-section shapes.

Analyzing the influence of three main geometry parameters on the rigidity in ANSYS, a better set of parameters were optimized from the analysis results. The drilling experimental results show that this method is of great significance for obtaining the appropriate parameters of asymmetric helix groove micro drill bits.

This paper aims to investigate and document the effects of copper-clad laminate (CCL) inorganic filler on the hole performance in printed circuit boards drilling process.

Drilling of brittle laminates can result in hole cracking, layer-to-layer delamination and drill-bit wear and tool breakage. Adding large amount of fillers not only shortens the life of the drilling tool but also affects the drilling properties significantly regarding hole quality. This paper introduces the influence of filler content, type, hardness, particle size and the compounding method in the manufacture of the CCL on the drilling performance.

The filler content, filler type, hardness of filler, particle size of filler and the compounding method used for the filler have a great influence on the drilling properties of CCL. The higher the filler content, the larger the particle size and the more the hardness of the filler, the worse the drilling properties. The combination of hard particles like silica with softer particles can improve the drilling performance of CCL.

The paper describes what affects the drilling performance of CCL and how this knowledge can be used to design CCL with good drilling performance.

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO₂ laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

The purpose of this paper is to present a clear picture of the challenges of micro drill bit and the developments of novel micro‐drill bits for flexible circuit boards, environmental‐friendly printed circuit boards (PCBs), high aspect ratio drill bit and ultra‐small micro drill bit, as well as the developments of geometry design of micro drill bit.

The paper details the developments trend and challenges of micro drill and PCBs first. Then the current research status of novel micro drill bits for flexible circuit boards, environmental‐friendly PCBs, high aspect ratio drill bit, ultra‐small micro drill bit are described. Finally, the developments of geometry design and drilling process are reviewed.

To achieve excellent performance for drilling flexible PCB, a large helical angle, large flute/land ratio and small web thickness that guarantee the sharp evacuation capability, are adopted in drill bit design. A small helix angle and an appropriate primary face angle are employed for drill bit to process environmental‐friendly printed circuit boards. It is beneficial to implement big helix angle, small primary face angles and small point angles in the design of ultra‐small micro drill bit. An optimum web thickness and step feed should be taken into consideration in high aspect ratio drill bits design.

The paper reviews different solutions of micro drill bits for the state‐of‐the‐art PCB and the developments of geometry design of drill bit for printed circuit boards.

Presents a survey of build‐up technologies based on the manufacture of microvia in thin dielectric sheets (< 100µm) deposited on PWB materials. These technologies will permit the PWB industry to manufacture high density interconnect substrates and answer the routeing requirements of high number I/Os, BGAs and new area array components. Bull Electronics Angers (BEA) has developed an HDI technology where microvias with hole diameters lower than 100µm are mechanically or laser drilled and interconnected lines at pitch down to 200µm are manufactured. In the frame of a European MEDEA project, ATEMAES, the design of an electronic subsystem manufactured by Magnetti Marelli in ceramic thick film technology has been adapted to the design rules of the HDI technology developed by Bull. This is part of an evaluation program for the use of HDI technology for automotive applications.