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This paper aims to study the influence of microparticles on the surface cavitation behavior of 2Cr3WMoV steel; microparticle suspensions of different concentration, particle size, material and shape were prepared based on ultrasonic vibration cavitation experimental device.

2Cr3WMoV steel was taken as the research object for ultrasonic cavitation experiment. The morphology, quantity and distribution of cavitation pits were observed and analyzed by metallographic microscope and scanning electron microscope.

The study findings showed that the surface cavitation process produced pinhole cavitation pits on the surface of 2Cr3WMoV steel. High temperature in the process led to oxidation and carbon precipitation on the material surface, resulting in the “rainbow ring” cavitation morphology. Both the concentration and size of microparticles affected the number of pits on the material surface. When the concentration of microparticles was 1 g/L, the number of pits reached the maximum, and when the size of microparticles was 20 µm, the number of pits reached the minimum. The microparticles of Fe3O4, Al2O3, SiC and SiO2 all increased the number of pits on the surface of 2Cr3WMoV steel. In addition, the distribution of pits of spherical microparticles was more concentrated than that of irregularly shaped microparticles in turbidity.

Most of the current studies have not systematically focused on the effect of each factor of microparticles on the cavitation behavior when they act separately, and the results of the studies are more scattered and varied. At the same time, it has not been found to carry out the study of microparticle cavitation with 2Cr3WMoV steel as the research material, and there is a lack of relevant cavitation morphology and experimental data.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

Polyethylene terephthalate (PET) as a fiber molding polymer is widely used in aerospace, electrical and electronic, clothing and other fields. The purpose of this study is to improve the thermal insulation performance of polyethylene terephthalate (PET), the SiO₂ aerogel/PET composites slices and fibers were prepared, and the effects of the SiO₂ aerogel on the morphology, structure, crystallization property and thermal conductivity of the SiO₂ aerogel/PET composites slices and their fibers were systematically investigated.

The mass ratio of purified terephthalic acid and ethylene glycol was selected as 1:1.5, which was premixed with Sb₂O₃ and the corresponding mass of SiO₂ aerogel, and SiO₂ aerogel/PET composites were prepared by direct esterification and in-situ polymerization. The SiO₂ aerogel/PET composite fibers were prepared by melt-spinning method.

The results showed that the SiO₂ aerogel was uniformly dispersed in the PET matrix. The thermal insulation coefficient of PET was significantly reduced by the addition of SiO₂ aerogel, and the thermal conductivity of the 1.0 Wt.% SiO₂ aerogel/PET composites was reduced by 75.74 mW/(m · K) compared to the pure PET. The thermal conductivity of the 0.8 Wt.% SiO₂ aerogel/PET composite fiber was reduced by 46.06% compared to the pure PET fiber. The crystallinity and flame-retardant coefficient of the SiO₂ aerogel/PET composite fibers showed an increasing trend with the addition of SiO₂ aerogel.

The SiO₂ aerogel/PET composite slices and their fibers have good thermal insulation properties and exhibit good potential for application in the field of thermal insulation, such as warm clothes. In today’s society where the energy crisis is becoming increasingly serious, improving the thermal insulation performance of PET to reduce energy loss will be of great significance to alleviate the energy crisis.

In this study, SiO₂ aerogel/PET composite slices and their fibers were prepared by an in situ polymerization process, which solved the problem of difficult dispersion of nanoparticles in the matrix and the thermal conductivity of PET significantly reduced.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

The final properties of ductile iron are decided by the inoculant processing while pouring the melt. The shape and size of nodules generated during solidification are of paramount importance in solidification of ductile cast iron. The purpose of this study is to examine the effect of different inoculant addition on the solidification of ductile cast iron melt through thermal analysis.

Thermal analysis has recently grown as a tool for modeling the solidification behavior of ductile cast irons. Iron properties will be predicted by analyzing the cooling curve patterns of the melts and predicting the related effectiveness of inoculant processing. In this study, thermal analysis is used to evaluate the need for inoculation.

The amount and type of inoculation will affect the amount of undercooling during the solidification of ductile cast iron. It is found that the addition of 0.1 to 0.4 Wt.% inoculant lowers the austenite dendrite formation starting temperature while increasing the eutectic freezing temperature. Microstructure analysis revealed that the addition of inoculation increases the nodule count from 103 to 242 nodules. The beneficial effects of inoculation are sustained by an improved graphitization factor, which shows the formation of graphite nodules in the second phase of the eutectic reaction.

The inoculation treatment has improved metallurgical occurrences such as carbide to graphite conversion, graphite microstructure control, graphite nodule count at the start of solidification and the last stage of solidification, which determines the soundness of casting. The foundry industry can follow these steps for monitoring the solidification of ductile iron castings.

The research aims to investigate the impact of thermo-mechanical aging on SBR under cyclic-loading. By conducting experimental analyses and developing a 3D finite element analysis (FEA) model, it seeks to understand chemical and physical changes during aging processes. This research provides insights into nonlinear mechanical behavior, stress softening and microstructural alterations in SBR compounds, improving material performance and guiding future strategies.

This study combines experimental analyses, including cyclic tensile loading, attenuated total reflection (ATR), spectroscopy and energy-dispersive X-ray spectroscopy (EDS) line scans, to investigate the effects of thermo-mechanical aging (TMA) on carbon-black (CB) reinforced styrene-butadiene rubber (SBR). It employs a 3D FEA model using the Abaqus/Implicit code to comprehend the nonlinear behavior and stress softening response, offering a holistic understanding of aging processes and mechanical behavior under cyclic-loading.

This study reveals significant insights into SBR behavior during thermo-mechanical aging. Findings include surface roughness variations, chemical alterations and microstructural changes. Notably, a partial recovery of stiffness was observed as a function of CB volume fraction. The developed 3D FEA model accurately depicts nonlinear behavior, stress softening and strain fields around CB particles in unstressed states, predicting hysteresis and energy dissipation in aged SBRs.

This research offers novel insights by comprehensively investigating the impact of thermo-mechanical aging on CB-reinforced-SBR. The fusion of experimental techniques with FEA simulations reveals time-dependent mechanical behavior and microstructural changes in SBR materials. The model serves as a valuable tool for predicting material responses under various conditions, advancing the design and engineering of SBR-based products across industries.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

As data centres grow in size and complexity, traditional air-cooling methods are becoming less effective and more expensive. Immersion cooling, where servers are submerged in a dielectric fluid, has emerged as a promising alternative. Ensuring reliable operations in data centre applications requires the development of an effective control framework for immersion cooling systems, which necessitates the prediction of server temperature. While deep learning-based temperature prediction models have shown effectiveness, further enhancement is needed to improve their prediction accuracy. This study aims to develop a temperature prediction model using Long Short-Term Memory (LSTM) Networks based on recursive encoder-decoder architecture.

This paper explores the use of deep learning algorithms to predict the temperature of a heater in a two-phase immersion-cooled system using NOVEC 7100. The performance of recursive-long short-term memory-encoder-decoder (R-LSTM-ED), recursive-convolutional neural network-LSTM (R-CNN-LSTM) and R-LSTM approaches are compared using mean absolute error, root mean square error, mean absolute percentage error and coefficient of determination (R²) as performance metrics. The impact of window size, sampling period and noise within training data on the performance of the model is investigated.

The R-LSTM-ED consistently outperforms the R-LSTM model by 6%, 15.8% and 12.5%, and R-CNN-LSTM model by 4%, 11% and 12.3% in all forecast ranges of 10, 30 and 60 s, respectively, averaged across all the workloads considered in the study. The optimum sampling period based on the study is found to be 2 s and the window size to be 60 s. The performance of the model deteriorates significantly as the noise level reaches 10%.

The proposed models are currently trained on data collected from an experimental setup simulating data centre loads. Future research should seek to extend the applicability of the models by incorporating time series data from immersion-cooled servers.

The proposed multivariate-recursive-prediction models are trained and tested by using real Data Centre workload traces applied to the immersion-cooled system developed in the laboratory.

In recent years, using aberration-corrected transmission electron microscopy, the authors have achieved precisely detecting the structural evolution of passive film as well as its interface zone at atomic scale. The purpose of this paper aims to make a brief review to show the authors’ new understanding and perspective on the issue of critical factors determining stability of passive film of Fe-Cr alloy.

The introduction of single crystal enabled the authors to obtain a distinct metal/passive film interface and better characterize the structure of the interface region. The authors use aberration-corrected TEM to conduct cross-sectional observation and directly capture the details across the entire film at a high spatial and energy resolution.

Apart from the passive film itself, the interface zone, including metal/film (Me/F) interface and the adjacent metal side, is also the site which is attacked. Accordingly, the nature of the interface zone, such as microstructure, composition and atomic configuration, is one of the critical factors determining the stability of passive film.

Deciphering the critical factors determining the stability of passive film is of great significance and has been a fundamental issue in corrosion science. Great attention has been paid to the nature of the passive film itself. In contrast, the possible role of the interface between the passive film and the metal is rarely taken into account. Based on the advanced analytical tool with high spatial resolution, the authors have specified the significant role of interface structures on the macro-scale stability of passive film.