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To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.

The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained.

Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively.

A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.

Limited to cases where the correlations for heat transfer coefficients are valid.

A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area.

The purpose of this paper is to reduce the destructive effects of existing unavoidable noises contaminating temperature data in inverse heat conduction problems (IHCP) utilizing the wavelets.

For noise reduction, sensor data were treated as input to the filter bank used for signal decomposition and implementation of discrete wavelet transform. This is followed by the application of wavelet denoising algorithm that is applied on the wavelet coefficients of signal components at different resolution levels. Both noisy and de‐noised measurement temperatures are then used as input data to a numerical experiment of IHCP. The inverse problem deals with an estimation of unknown surface heat flux in a 2D slab and is solved by the variable metric method.

Comparison of estimated heat fluxes obtained using denoised data with those using original sensor data indicates that noise reduction by wavelet has a potential to be a powerful tool for improvement of IHCP results.

Noise reduction using wavelets, while it can be implemented very easily, may also significantly relegate (or even eliminate) conventional regularization schemes commonly used in IHCP.

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (R_th) and rise in junction temperature (T_J) are critical parameters. The purpose of this work is to evaluate the R_th and T_j of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

T_J was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm² (flat) to 3,076 mm² (outward step). On comparison with inward step geometry, the T_J value was low for outward step configuration (ΔT_J ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both R_th and T_J for different driving currents.

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

This study aims to propose a new design value, based on experimental and numerical studies, for surface emissivity of zinc hot-dip galvanized members exposed to fire.

The paper sums up experiments, used specimens and also shows results. Four experiments were performed in a horizontal furnace and one test in a fire compartment of the experimental building. Several tests were carried out for determination of the surface emissivity of galvanized steel structures in fire. The experimental and numerical studies were used for preparation of new generation of the structural steel fire standard Eurocode EN 1993-1-2:2025.

Hot-dip galvanizing is one of the most widely used processes for corrosion protection of steel products. The new design value for surface emissivity of zinc hot-dip galvanized members exposed to fire is determined using experimental results as 0.35. The value is proposed for next generation of EN 1993-1-2:2025. If hot-dip galvanization additionally can contribute beneficially to the fire resistance of unprotected steel members, it would be a huge economic advantage.

Experimental studies in the past years have indicated the influence of hot-dip galvanizing on the heating of steel members. This study suggests 50% reduction of the surface emissivity of a carbon steel member. This amendment will be incorporated in future versions of Eurocodes 3 and 4 and has already been implemented in some fire design tools for steel members in order to consider the beneficial contribution of hot-dip galvanized for fire-resistance requirements of less than 60 min.

In any machining process, the surface profile of the workpiece is continuously changing with respect to time and input parameters. In a conventional machining process, input parameters are feed and depth of cut whilst other parameters are considered to be constant throughout the process.

The direct and indirect participation of this instantaneous curvature can be used to optimize the strategy of cutting operation in terms of different parameters like heat generation-induced stresses, etc. The concepts of the metric tensor and Riemannian curvature tensor are made use in this study as a representation of curvature itself. The objective of this study is to create a mathematical methodology that can be implemented on a highly flexible machining process to find an optimum cutting strategy for a particular output parameter.

The study also includes different case studies for the validation of this newly introduced mathematical methodology.

The study will also find its position in other mechanical processes like forging and casting where instantaneous curvature affects various mechanical properties.

This paper aims to numerically investigate the nanofluid flow, heat transfer and entropy generation during natural convection in an annulus.

The lattice Boltzmann method is used to simulate the velocity and temperature fields. Furthermore, some special modifications are applied to make the lattice Boltzmann method capable for simulation in the curved boundary conditions. The annulus is filled with CuO-water nanofluid. The dynamic viscosity of nanofluid is estimated using KLL (Koo-Kleinstreuer-Li) model, and the nanoparticle shape effect is taken account in calculating the thermal conductivity. On the other hand, the local/volumetric entropy generation is used to show the irreversibility under influence of different parameters.

The effect of considered governing parameters including Rayleigh number (103<Ra < 106); nanoparticle concentration (0<<0.04) and configuration of annulus on the flow structure; temperature field; and local and total entropy generation and heat transfer rate are presented.

The originality of this work is using of lattice Boltzmann method is simulation of natural convection in a curved configuration and using of Koo–Kleinstreuer–Li correlation for simulation of nanofluid.

This paper aims to study the residual stress of deposited components which is a main issue to impede the widespread application of wire and arc additive manufacturing (WAAM). The interlayer dwell time is believed to have an effect on residual stress distributions in WAAM due to variance in heat dissipation condition. A coupled thermomechanical finite element model was established to evaluate the role of dwell time in between layers on the mechanical behavior of thin-walled components in WAAM, mainly involving thermal stress evolutions and residual stress distributions of the component and substrate.

Four interlayer dwell times including 0, 120 and 300 s and cooling to ambient temperature were selected in finite element modeling, and corresponding experiments were conducted to verify the reliability of the model.

The results show that with the interlayer dwell time, the stress cycling curves become more uniform and the interlayer stress-releasing effect is weakened. The residual stress levels on the substrate decrease with the increasing interlayer dwell time. In the outside surface of the component, the distributions of axial and longitudinal residual stress along the deposition path are the smoothest when the interlayer dwell time is cooling to ambient temperature. In the inside surface, a longer interlayer dwell time leads to an obvious decrease in the longitudinal and axial residual stress along the deposition path.

The comprehensive study of how the interlayer dwell time influences stress field of components is helpful to improve the deposition defects generated by WAAM.

For reflow soldering in today's changing component and soldering technology, requirements with respect to profiling seem to be difficult to determine and even harder to meet. State‐of‐the‐art reflow trackers can be of help here, but, without some knowledge of the fundamentals in profiling, it will be easy to misunderstand measurements. The use of nitrogen as a protective gas for reflow soldering can be advantageous for fine pitch technology, bare copper boards and low residue solder pastes. However, because reflow solder defects are related to more than just the use of nitrogen, one may find different benefits for the use of nitrogen, depending on how the investigations are carried out. Wetting under nitrogen is certainly better and more reproducible, while the near absence of oxygen is beneficial to oxidation‐related problems. For high numbers of solder joints per board, it is not easy to achieve an acceptable first pass yield. Only with low, controlled defect levels found within a robust reproducible process is it possible to achieve this. Using forced convection together with nitrogen for reflow soldering is becoming the preferred method.

Studying the shear stress and pressure resulting on the walls of blood vessels, especially during high-pressure cases, which may lead to the explosion or rupture of these vessels, can also lead to the death of many patients. Therefore, it was necessary to try to control the shear and normal stresses on these veins through nanoparticles in the presence of some external forces, such as exposure to some electromagnetic shocks, to reduce the risk of high pressure and stress on those blood vessels. This study aims to examines the shear and normal stresses of electroosmotic-magnetized Sutterby Buongiorno’s nanofluid in a symmetric peristaltic channel with a moderate Reynolds number and curvature. The production of thermal radiation is also considered. Sutterby nanofluids equations of motion, energy equation, nanoparticles concentration, induced magnetic field and electric potential are calculated without approximation using small and long wavelengths with moderate Reynolds numbers.

The Adomian decomposition method solves the nonlinear partial differential equations with related boundary conditions. Graphs and tables show flow features and biophysical factors like shear and normal stresses.

This study found that when curvature and a moderate Reynolds number are present, the non-Newtonian Sutterby fluid raises shear stress across all domains due to velocity decay, resulting in high shear stress. Additionally, modest mobility increases shear stress across all channel domains. The Sutterby parameter causes fluid motion resistance, which results in low energy generation and a decrease in the temperature distribution.

Equations of motion, energy equation, nanoparticle concentration, induced magnetic field and electric potential for Sutterby nano-fluids are obtained without any approximation i.e. the authors take small and long wavelengths and also moderate Reynolds numbers.

This study aims to examine both the population balance approach based on the MUltiple SIze Group (MUSIG) model and the average bubble number density transport equation (ABND) model for 3D, low pressure, gas‐liquid, subcooled boiling, vertical flows. The purpose is to assess the ability of both models to predict the radial profile of void fraction, bubble Sauter mean diameter and interfacial area concentration which characterise subcooled boiling.

Improvement in the ABND model to simulate gas‐liquid bubbly flows with heat transfer was achieved by combining the condensation expression with the gaseous mass transport equation within the CFD commercial code CFX4.4.

Overall, both the ABND model and the MUSIG model provided good results in terms of the above‐mentioned criteria when compared against experimental measurements. However, the ABND model was found to have limitations in predicting high‐subcooled boiling flows due to the lack of bubble size resolution to adequately capture the effect of condensation over a range of bubbles sizes.

It is shown that the ABND model provides an economic alternative to the MUSIG model in terms of complexity and computational time, as long as one is aware of the limitations in simulating high‐subcooling flow regimes.