Influence of interlayer dwell time on stress field of thin-walled components in WAAM via numerical simulation and experimental tests

Abstract

Purpose

This paper aims to study the residual stress of deposited components which is a main issue to impede the widespread application of wire and arc additive manufacturing (WAAM). The interlayer dwell time is believed to have an effect on residual stress distributions in WAAM due to variance in heat dissipation condition. A coupled thermomechanical finite element model was established to evaluate the role of dwell time in between layers on the mechanical behavior of thin-walled components in WAAM, mainly involving thermal stress evolutions and residual stress distributions of the component and substrate.

Design/methodology/approach

Four interlayer dwell times including 0, 120 and 300 s and cooling to ambient temperature were selected in finite element modeling, and corresponding experiments were conducted to verify the reliability of the model.

Findings

The results show that with the interlayer dwell time, the stress cycling curves become more uniform and the interlayer stress-releasing effect is weakened. The residual stress levels on the substrate decrease with the increasing interlayer dwell time. In the outside surface of the component, the distributions of axial and longitudinal residual stress along the deposition path are the smoothest when the interlayer dwell time is cooling to ambient temperature. In the inside surface, a longer interlayer dwell time leads to an obvious decrease in the longitudinal and axial residual stress along the deposition path.

Originality/value

The comprehensive study of how the interlayer dwell time influences stress field of components is helpful to improve the deposition defects generated by WAAM.

Citation

Li, R. and Xiong, J. (2019), "Influence of interlayer dwell time on stress field of thin-walled components in WAAM via numerical simulation and experimental tests", Rapid Prototyping Journal, Vol. 25 No. 8, pp. 1433-1441. https://doi.org/10.1108/RPJ-03-2019-0067